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1. 发明授权

US06475638B1 Electrodeposited copper foil with its surface prepared, process for producing the same and use thereof 失效
标题翻译：其表面电沉积铜箔，其制备方法及其用途
公开(公告)号：US06475638B1
公开(公告)日：2002-11-05
申请号：US09654769
申请日：2000-09-05
申请人： Masakazu Mitsuhashi , Yasuaki Mashiko , Hitoshi Kurabe
发明人： Masakazu Mitsuhashi , Yasuaki Mashiko , Hitoshi Kurabe
IPC分类号： B32B1508
CPC分类号： C25D1/04 , C25D5/48 , H05K3/382 , Y10T428/12431 , Y10T428/12438 , Y10T428/12472 , Y10T428/12569 , Y10T428/1291 , Y10T428/12993
摘要： A process for producing an electrodeposited copper foil with its surface prepared, comprising the steps of: subjecting an electrodeposited copper foil having a shiny side and a matte side whose average surface roughness (Rz) is in the range of 2.5 to 10 &mgr;m to at least one mechanical polishing so that the average surface roughness (Rz) of the matte side becomes in the range of 1.5 to 3.0 &mgr;m; and subjecting the matte side having undergone the mechanical polishing to a selective chemical polishing so that the average surface roughness (Rz) of the matte side becomes in the range of 0.8 to 2.5 &mgr;m. The invention further provides an electrodeposited copper foil with its surface prepared, produced by the above process, and still further provides PWBs and a multilayer laminate of PWBs, produced with the use of the above electrodeposited copper foil with its surface prepared. The mechanical polishing followed by chemical polishing of the matte side enables obtaining an electrodeposited copper foil with its surface prepared, the matte side of which exhibits excellent properties, and hence enables obtaining PWBs and a multilayer PWBs which have excellent properties.
摘要翻译：一种制备其表面的电沉积铜箔的方法，包括以下步骤：将平均表面粗糙度（Rz）在2.5至10μm的范围内的平均表面粗糙度（Rz）的光致侧面和无光泽面的电解铜箔至少一次机械抛光使得无光面的平均表面粗糙度（Rz）在1.5-3.0μm的范围内; 并对经过机械抛光的磨砂面进行选择性化学抛光，使得无光面的平均表面粗糙度（Rz）在0.8〜2.5μm的范围内。本发明还提供了通过上述方法制备的其表面的电沉积铜箔，并且还进一步提供PWB和PWB的多层层压体，其使用其上制备的上述电沉积铜箔制备。机械抛光后，通过无光泽化学抛光，可以得到其表面准备的电沉积铜箔，其哑光面具有优异的性能，因此能够获得具有优异性能的PWB和多层PWB。

2. 发明授权

US06291081B1 Electrodeposited copper foil with its surface prepared, process for producing the same and use thereof 有权
标题翻译：其表面电沉积铜箔，其制备方法及其用途
公开(公告)号：US06291081B1
公开(公告)日：2001-09-18
申请号：US09652642
申请日：2000-08-31
申请人： Hitoshi Kurabe , Mitsuhito Shibata , Masakazu Mitsuhashi
发明人： Hitoshi Kurabe , Mitsuhito Shibata , Masakazu Mitsuhashi
IPC分类号： B32B1520
CPC分类号： C25D5/48 , C25D1/04 , H05K3/382 , Y10T428/12431 , Y10T428/12438 , Y10T428/12569 , Y10T428/12993
摘要： A process for producing an electrodeposited copper foil with its surface prepared, comprising the steps of: subjecting an electrodeposited copper foil having a shiny side and a matte side whose average surface roughness (Rz) is in the range of 2.5 to 10 &mgr;m to the first mechanical polishing so that the average surface roughness (Rz) of the matte side becomes 1.5 to 6 &mgr;m; and subjecting the matte side having undergone the first mechanical polishing to at least one further mechanical polishing so that the average surface roughness (Rz) of the matte side becomes 1.0 to 3.0 &mgr;m. The protrudent parts of the matte side are selectively polished by the first mechanical polishing, and the surface having undergone the first mechanical polishing is further subjected to the second and any ensuing mechanical polishings under milder conditions. Thus, a highly planar polished face with excellent surface properties can be obtained. Moreover, depressed parts are not polished, so that the amount of copper lost by the polishings is extremely minute. The use of the electrodeposited copper foil with its surface prepared according to the present invention enables forming a wiring pattern of extremely fine pitch.
摘要翻译：一种制备其表面的电沉积铜箔的方法，包括以下步骤：使平均表面粗糙度（Rz）在2.5-10μm范围内的具有光泽面和无光泽面的电沉积铜箔与第一机械抛光使得无光面的平均表面粗糙度（Rz）为1.5〜6μm; 并对已进行第一次机械研磨的磨砂面进行至少一次进一步的机械研磨，使得无光面的平均表面粗糙度（Rz）为1.0〜3.0μm。通过第一机械抛光来选择性地抛光无光泽面的突出部分，并且经历了第一次机械抛光的表面在更温和的条件下进一步受到第二次和随后的机械抛光。因此，可以获得具有优异表面性能的高度平面的抛光面。此外，凹陷部件不被抛光，使得由抛光损失的铜的量非常小。使用根据本发明制备的表面的电沉积铜箔能够形成极细间距的布线图案。

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