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1. 发明授权

US08956180B2 FPC connector 有权
标题翻译： FPC连接器
公开(公告)号：US08956180B2
公开(公告)日：2015-02-17
申请号：US13320874
申请日：2010-05-19
申请人： Yasuaki Kobayashi , Shinsuke Kunishi
发明人： Yasuaki Kobayashi , Shinsuke Kunishi
IPC分类号： H01R12/24 , H01R12/77 , H01R12/79 , H01R12/71
CPC分类号： H01R12/774 , H01R12/714 , H01R12/79
摘要： To provide a connector capable of assuring contact pressure between a terminal and a flat cable without disposing a metal beam supporting an actuator. In the connector of the Present Application, a housing has a convexity-opposing a terminal, and an actuator has a concavity mating with the convexity. An axle disposed in the concavity is inserted into a bearing disposed on the convexity. The actuator has a cam fitting between the convexity and the terminal, and is disposed so as to be able to turn between a sandwiched position at which a flat cable is sandwiched between the cam and the terminal and a release position at which the sandwiching is released.
摘要翻译：提供能够确保端子和扁平电缆之间的接触压力而不设置支撑致动器的金属梁的连接器。在本申请的连接器中，壳体具有与凸起相对的端子，并且致动器具有与凸部配合的凹部。设置在凹部中的轴插入设置在凸部上的轴承中。致动器在凸部和端子之间具有凸轮配合，并且被布置成能够在扁平电缆夹在凸轮和端子之间的夹持位置与夹持被释放的释放位置之间转动。

2. 发明授权

US4172869A Method of and apparatus for manufacturing fiber-reinforced thermoplastic resin of cellular structure 失效
标题翻译：蜂窝结构纤维增强热塑性树脂的制造方法和装置
公开(公告)号：US4172869A
公开(公告)日：1979-10-30
申请号：US889448
申请日：1978-03-23
申请人： Yoshisue Oishi , Akihisa Inoue , Syuji Moriya , Hironori Nakabayashi , Yasuaki Kobayashi , Hiroyuki Nagata
发明人： Yoshisue Oishi , Akihisa Inoue , Syuji Moriya , Hironori Nakabayashi , Yasuaki Kobayashi , Hiroyuki Nagata
IPC分类号： B29C44/12 , B29C44/32 , B29D27/00
CPC分类号： B29C44/12 , B29C44/32 , Y10T428/24132 , Y10T428/249942 , Y10T428/249953
摘要： The manufacture is carried out by impregnating bundles of filaments of fibrous-reinforcing material in a bath made up of an emulsion of a thermoplastic resin and a blowing agent. The emulsion-impregnated reinforcing filament bundles are then squeezed and dried to form resin coatings, and then collected to provide a single bunch of the fiber-reinforced thermoplastic resin material. This bunch is subsequently heated and allowed to expand in a tunnel and also cooled in a tunnel to produce a fiber-reinforced thermoplastic resin of a cellular structure. During the impregnation with the emulsion in a bath, the bundles are slackened and repeatedly beaten in the condition of free tension to cause the filament bundles to be substantially frayed to facilitate the impregnation. An apparatus utilizable in the practice of the above method is also disclosed.
摘要翻译：通过在由热塑性树脂和发泡剂的乳液组成的浴中浸渍纤维增强材料的细丝束来进行制造。然后将乳液浸渍的增强长丝束挤压干燥以形成树脂涂层，然后收集以提供一束纤维增强热塑性树脂材料。随后将该束加热并允许在隧道中膨胀并且还在隧道中冷却以产生纤维结构的纤维增强的热塑性树脂。在用浴中浸渍乳液的过程中，在自由张力的条件下，松散松弛并重复地打浆，导致丝束基本磨损以便于浸渍。还公开了在上述方法的实践中可利用的装置。

3. 发明申请

US20090206451A1 Semiconductor device 审中-公开
标题翻译：半导体器件
公开(公告)号：US20090206451A1
公开(公告)日：2009-08-20
申请号：US12379288
申请日：2009-02-18
申请人： Hiroyuki Uno , Yasuaki Kobayashi
发明人： Hiroyuki Uno , Yasuaki Kobayashi
IPC分类号： H01L25/07
CPC分类号： H01L27/0928 , H01L21/31053 , H01L21/823871 , H01L21/823892 , H01L27/0207
摘要： A semiconductor device is provided, in which a well contact diffusion layer pattern (13) and a sub-contact diffusion layer pattern (14) are arranged between a P-ch transistor diffusion layer pattern (11) and an N-ch transistor diffusion layer pattern (12), and a CMP dummy pattern (15) is arranged around a P-ch and N-ch transistor arrays. In the device, a data rate exceeding 75% when the well contact diffusion layer pattern and the sub-contact diffusion layer pattern are formed into lines, is reduced to fall within a range of 25% to 75% by forming at least either of the well contact diffusion layer pattern and the sub-contact diffusion layer pattern into dots.
摘要翻译：提供了一种半导体器件，其中阱间接触扩散层图案（13）和子接触扩散层图案（14）布置在P沟道晶体管扩散层图案（11）和N沟道晶体管扩散层图案（12）和CMP虚拟图案（15）围绕P-ch和N-ch晶体管阵列布置。在该装置中，当阱接触扩散层图案和亚接触扩散层图案形成为线时，超过75％的数据率通过形成至少任一个而降低到25％至75％的范围内良好的接触扩散层图案和子接触扩散层图案变成点。

4. 发明授权

US4943947A Semiconductor memory device with an improved serial addressing structure 失效
标题翻译：具有改进的串行寻址结构的半导体存储器件
公开(公告)号：US4943947A
公开(公告)日：1990-07-24
申请号：US242446
申请日：1988-09-09
申请人： Yasuaki Kobayashi
发明人： Yasuaki Kobayashi
IPC分类号： G06F12/02 , G06F12/00 , G11C7/10 , G11C11/401 , G11C11/408
CPC分类号： G11C7/103
摘要： A serially addressing type memory integrated circuit with an improved shift register operable at a high speed and fabricated on a reduced area of chip, is disclosed and featured in that the shift register has a plurality of first stages connected in cascade and arranged from a first location to a second location and a plurality of second stages connected in cascade and arranged from the second location to the first location and the first and second stages are alternately arranged one by one, and that an access detection circuit for indicating an access to an approximately center of serial addresses is connected to one of the first and second stages near the second location.

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