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1. 发明申请

US20050284040A1 Pedestal unit, raised floor skeleton structure, method of installing pedestal unit, and method of producing pedestal frame 审中-公开
标题翻译：基座单元，高架地板骨架结构，安装基座单元的方法以及座架的制作方法
公开(公告)号：US20050284040A1
公开(公告)日：2005-12-29
申请号：US11136736
申请日：2005-05-25
申请人： Yakobu Hashimoto , Kazutsugu Hiramatsu , Takenori Yamashita , Hiromichi Sato , Shyouji Kobayashi , Hirotoshi Hidaka , Shinji Ando , Yukiji Oshima , Hideyuki Kaji , Takeshi Ono , Shigenori Saito , Kiyofumi Tanaka , Toshimasa Nishiyama , Yukio Kuramasu , Nobuyasu Hagisawa
发明人： Yakobu Hashimoto , Kazutsugu Hiramatsu , Takenori Yamashita , Hiromichi Sato , Shyouji Kobayashi , Hirotoshi Hidaka , Shinji Ando , Yukiji Oshima , Hideyuki Kaji , Takeshi Ono , Shigenori Saito , Kiyofumi Tanaka , Toshimasa Nishiyama , Yukio Kuramasu , Nobuyasu Hagisawa
IPC分类号： E04B2/82 , E04F15/024
CPC分类号： E04F15/02458 , E04F15/0247 , E04F2015/02061
摘要： A pedestal unit usable for a raised floor is disclosed which comprises: a pair of beams; and a pair of pedestal frames for supporting the beams at both ends of the beams, respectively. Each pedestal frame comprises: a pair of leg members; a pair of base plates for supporting the leg members; respectively, and a connecting member with a predetermined length for rigidly connecting the legs member each other with a predetermined interval. The pedestal frame may be installed under a middle portion of the beams, which frame may be installed after installation of pedestal frames at ends of beams for easy adjustment. Additional pedestal frames for supporting additional beams may be fixed to the pedestal frames or the beam. A supporting surface of leg member may have a mount provided by casting and be cut for accurate dimensions.
摘要翻译：公开了一种可用于高架地板的基座单元，其包括：一对梁; 以及分别用于在梁的两端支撑梁的一对基座框架。每个基座框架包括：一对腿部构件; 一对支撑腿部构件的基板; 以及具有预定长度的连接构件，用于以预定间隔将腿部构件彼此刚性地连接。基座框架可以安装在梁的中间部分下方，在将梁架的端部安装在梁的端部之后可以安装框架，以便于调整。用于支撑附加梁的附加支架框架可以固定到基座框架或梁上。腿构件的支撑表面可以具有通过铸造提供的支架，并且被切割成精确的尺寸。

2. 发明授权

US08434275B2 Double floor structure and support leg for double floor structure 有权
标题翻译：双层结构和双层结构的支撑腿
公开(公告)号：US08434275B2
公开(公告)日：2013-05-07
申请号：US13388510
申请日：2010-08-03
申请人： Yakobu Hashimoto , Jun Kondo , Hiroshi Dohi , Mikio Suzuki , Daisuke Chiba , Masahiro Nammoku , Yasutomo Akashi , Kiyofumi Tanaka , Hideyuki Kaji , Takeshi Ono , Yoshiharu Konishi
发明人： Yakobu Hashimoto , Jun Kondo , Hiroshi Dohi , Mikio Suzuki , Daisuke Chiba , Masahiro Nammoku , Yasutomo Akashi , Kiyofumi Tanaka , Hideyuki Kaji , Takeshi Ono , Yoshiharu Konishi
IPC分类号： E04B9/00
CPC分类号： E04F15/02458 , E04F15/02452 , E04F15/02464
摘要： A double floor structure capable of being adapted to the conditions of construction and the needs of users at low cost. A double floor structure (K) provided with support legs (1) which are provided on a lower floor and rows of beams which form an upper floor. The support legs (1) are each provided with an upper member (14) which supports a beam from the lower side, an intermediate member (13) which supports the upper member (14) from the lower side, and a lower member (12) which supports the intermediate member (13) from the lower side. The upper member (14), the intermediate member (13), and the lower member (12) consist of metallic, extruded shape material and are disposed in such a manner that the direction of the extrusion is aligned with the top-bottom direction.
摘要翻译：双层结构能够以低成本适应施工条件和用户需求。设置有设置在下层的支撑腿（1）和形成上层的梁的双层结构（K）。支撑腿（1）各自设置有从下侧支撑梁的上部构件（14），从下侧支撑上部构件（14）的中间构件（13）和下部构件（12）），其从下侧支撑中间构件（13）。上部构件（14），中间构件（13）和下部构件（12）由金属挤出形状材料构成，并且以使得挤出方向与上下方向对齐的方式设置。

3. 发明申请

US20120131862A1 DOUBLE FLOOR STRUCTURE AND SUPPORT LEG FOR DOUBLE FLOOR STRUCTURE 有权
标题翻译：双层地板结构和双层结构的支撑杆
公开(公告)号：US20120131862A1
公开(公告)日：2012-05-31
申请号：US13388510
申请日：2010-08-03
申请人： Yakobu Hashimoto , Jun Kondo , Hiroshi Dohi , Mikio Suzuki , Daisuke Chiba , Masahiro Nammoku , Yasutomo Akashi , Kiyofumi Tanaka , Hideyuki Kaji , Takeshi Ono , Yoshiharu Konishi
发明人： Yakobu Hashimoto , Jun Kondo , Hiroshi Dohi , Mikio Suzuki , Daisuke Chiba , Masahiro Nammoku , Yasutomo Akashi , Kiyofumi Tanaka , Hideyuki Kaji , Takeshi Ono , Yoshiharu Konishi
IPC分类号： E04B5/43 , E04B5/00 , E04B1/19 , E04F15/024
CPC分类号： E04F15/02458 , E04F15/02452 , E04F15/02464
摘要： A double floor structure capable of being adapted to the conditions of construction and the needs of users at low cost. A double floor structure (K) provided with support legs (1) which are provided on a lower floor and rows of beams which form an upper floor. The support legs (1) are each provided with an upper member (14) which supports a beam from the lower side, an intermediate member (13) which supports the upper member (14) from the lower side, and a lower member (12) which supports the intermediate member (13) from the lower side. The upper member (14), the intermediate member (13), and the lower member (12) consist of metallic, extruded shape material and are disposed in such a manner that the direction of the extrusion is aligned with the top-bottom direction.
摘要翻译：双层结构能够以低成本适应施工条件和用户需求。设置有设置在下层的支撑腿（1）和形成上层的梁的双层结构（K）。支撑腿（1）各自设置有从下侧支撑梁的上部构件（14），从下侧支撑上部构件（14）的中间构件（13）和下部构件（12）），其从下侧支撑中间构件（13）。上部构件（14），中间构件（13）和下部构件（12）由金属挤出形状材料构成，并且以使得挤出方向与上下方向对齐的方式设置。

4. 发明授权

US08212345B2 Holding jig, semiconductor wafer grinding method, semiconductor wafer protecting structure and semiconductor wafer grinding method and semiconductor chip fabrication method using the structure 有权
标题翻译：保持夹具，半导体晶片研磨方法，半导体晶片保护结构和半导体晶片研磨方法以及使用该结构的半导体芯片制造方法
公开(公告)号：US08212345B2
公开(公告)日：2012-07-03
申请号：US12945078
申请日：2010-11-12
申请人： Kiyofumi Tanaka , Satoshi Odashima , Noriyoshi Hosono , Hironobu Fujimoto , Takeshi Segawa
发明人： Kiyofumi Tanaka , Satoshi Odashima , Noriyoshi Hosono , Hironobu Fujimoto , Takeshi Segawa
IPC分类号： H01L23/02
CPC分类号： H01L21/6875 , B24B37/042 , B24B41/061 , B65G49/061 , B65G2249/045 , Y10T428/24322
摘要： A backgrinding machine 10 of a semiconductor wafer W includes: a table 13 set on the working plane of a mount 11; a multiple number of holding jigs 20 arranged via check tables 15 on table 13; a grinding machine 30 for performing a grinding process of the rear side of semiconductor wafer W held by holding jig 20; and a washing device 40 for ground semiconductor wafers W. Each holding jig 20 is constructed of a concave 22 depressed on the surface of a base plate 21, a multiple number of supporting projections 23 projectively arrayed on the bottom surface of concave 22, a deformable contact film 24, covering the concave 22, being supported by the multiple supporting projections 23, for detachably holding semiconductor wafer W in close contact with it; and an exhaust path 25 for conducting air from the concave 22 covered by contact film 24 to the outside.
摘要翻译：半导体晶片W的背面研磨机10包括：设置在安装件11的工作面上的工作台13; 通过表13上的检查台15布置多个保持夹具20; 用于进行通过保持夹具20保持的半导体晶片W的后侧的研磨处理的研磨机30; 以及用于接地半导体晶片W的洗涤装置40.每个保持夹具20由在基板21的表面上凹陷的凹部22构成，多个支撑突起23投影地排列在凹部22的底面上，接触膜24，覆盖凹部22，由多个支撑突起23支撑，用于可拆卸地保持半导体晶片W与其紧密接触; 以及用于将空气从由接触膜24覆盖的凹部22引导到外部的排气路径25。

5. 发明授权

US07875501B2 Holding jig, semiconductor wafer grinding method, semiconductor wafer protecting structure and semiconductor wafer grinding method and semiconductor chip fabrication method using the structure 有权
标题翻译：保持夹具，半导体晶片研磨方法，半导体晶片保护结构和半导体晶片研磨方法以及使用该结构的半导体芯片制造方法
公开(公告)号：US07875501B2
公开(公告)日：2011-01-25
申请号：US12282984
申请日：2007-03-09
申请人： Kiyofumi Tanaka , Satoshi Odashima , Noriyoshi Hosono , Hironobu Fujimoto , Takeshi Segawa
发明人： Kiyofumi Tanaka , Satoshi Odashima , Noriyoshi Hosono , Hironobu Fujimoto , Takeshi Segawa
IPC分类号： H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L21/6875 , B24B37/042 , B24B41/061 , B65G49/061 , B65G2249/045 , Y10T428/24322
摘要： A backgrinding machine 10 of a semiconductor wafer W includes: a table 13 set on the working plane of a mount 11; a multiple number of holding jigs 20 arranged via check tables 15 on table 13; a grinding machine 30 for performing a grinding process of the rear side of semiconductor wafer W held by holding jig 20; and a washing device 40 for ground semiconductor wafers W. Each holding jig 20 is constructed of a concave 22 depressed on the surface of a base plate 21, a multiple number of supporting projections 23 projectively arrayed on the bottom surface of concave 22, a deformable contact film 24, covering the concave 22, being supported by the multiple supporting projections 23, for detachably holding semiconductor wafer W in close contact with it; and an exhaust path 25 for conducting air from the concave 22 covered by contact film 24 to the outside.
摘要翻译：半导体晶片W的背面研磨机10包括：设置在安装件11的工作面上的工作台13; 通过表13上的检查台15布置多个保持夹具20; 用于进行通过保持夹具20保持的半导体晶片W的后侧的研磨处理的研磨机30; 以及用于接地半导体晶片W的洗涤装置40.每个保持夹具20由在基板21的表面上凹陷的凹部22构成，多个支撑突起23投影地排列在凹部22的底面上，接触膜24，覆盖凹部22，由多个支撑突起23支撑，用于可拆卸地保持半导体晶片W与其紧密接触; 以及用于将空气从由接触膜24覆盖的凹部22引导到外部的排气路径25。

6. 发明授权

US06310296B1 Multicore cable and a method of manufacturing thereof 失效
标题翻译：多芯电缆及其制造方法
公开(公告)号：US06310296B1
公开(公告)日：2001-10-30
申请号：US09442457
申请日：1999-11-18
申请人： Yasushi Nishi , Kiyofumi Tanaka , Morio Suzuki
发明人： Yasushi Nishi , Kiyofumi Tanaka , Morio Suzuki
IPC分类号： H01B708
CPC分类号： H01R4/04 , Y10T29/49123 , Y10T29/49174 , Y10T29/49176
摘要： A multicore cable includes a plurality of cables in parallel and is formed by fusion-welding the plurality of cables with a resin jacket. Each of the plurality of cables is formed by winding a shield around a signaling core wire, which is covered with an insulating material, and a grounding core wire. The resin jacket and the shield are stripped so that a stair portion is formed. The stair portion is coated with an electrically conductive adhesive. A vibration is exerted on the grounding core wire, thereby connecting the shield with the grounding core wire with the electrically conductive adhesive. Eventually, the shield and the grounding core wire are bonded with the electrically conductive adhesive. This allows an electrical connection between the shield and the grounding core wire to be maintained in a desirable condition, thus making it possible to suppress a characteristic impedance variation of the signaling core wire caused by an external factor.
摘要翻译：多芯电缆包括并联的多根电缆，并且通过用树脂护套将多根电缆熔接而形成。多个电缆中的每一个通过围绕由绝缘材料覆盖的信号芯线和接地芯线缠绕屏蔽来形成。剥离树脂护套和护罩，形成台阶部。楼梯部分涂有导电粘合剂。在接地芯线上施加振动，从而将屏蔽与接地芯线与导电粘合剂连接。最后，屏蔽层和接地芯线与导电粘合剂结合。这样就可以将屏蔽层和接地芯线之间的电连接保持在期望的状态，从而可以抑制由外部因素引起的信号芯线的特性阻抗变化。

7. 发明授权

US5941787A Arrangement of pulley working fluid passage in a belt-type continuously variable transmission 失效
标题翻译：皮带轮工作流体通道在带式无级变速器中的布置
公开(公告)号：US5941787A
公开(公告)日：1999-08-24
申请号：US6383
申请日：1998-01-13
申请人： Makoto Imaida , Kiyofumi Tanaka , Yusuke Kasuya , Masahiko Yamada
发明人： Makoto Imaida , Kiyofumi Tanaka , Yusuke Kasuya , Masahiko Yamada
IPC分类号： F16H55/56 , F16H9/18 , F16H63/06 , F16H59/00 , B60K41/12 , F16H61/00
CPC分类号： F16H63/065 , Y10T477/624
摘要： In a pulley working fluid (oil) passage arrangement for a belt-type continuously variable transmission having a V belt wound about a letter V-shaped groove formed with mutually opposing oblique surfaces of movable and stationary sheaves and a working fluid pressure cylinder chamber to which a working fluid pressure is supplied so as to move the movable sheave toward or away from the stationary sheave, thus a gear shift being varied, a first working fluid passage communicated with an axle chamber working fluid passage is extended in an axial direction of the axle member at an opposing surface thereof against the axle member and the movable sheave and a second working fluid passage having one end communicated with the first working fluid passage and the other end opened to a working fluid pressure cylinder chamber is extended along a radial direction of the axle member.
摘要翻译：在用于带式无级变速器的带轮工作流体（油）通道装置中，所述带式无级变速器具有卷绕在形成有可移动和固定滑轮的相互相对的倾斜表面的字母V形槽的V形带和工作流体压力缸室，提供工作流体压力以使可动滑轮朝向或远离固定滑轮移动，因此变速是变化的，与轴室工作流体通道连通的第一工作流体通道在轴的轴向方向上延伸在其相对表面处的构件抵靠所述车轴构件和所述可动槽轮;以及第二工作流体通道，其具有与所述第一工作流体通道连通的一端，并且向工作流体压力缸室敞开的另一端沿着所述第一工作流体通道的径向方向延伸轴构件。

8. 发明授权

US08465011B2 Fixing jig and method of processing work 有权
标题翻译：固定夹具及加工工艺方法
公开(公告)号：US08465011B2
公开(公告)日：2013-06-18
申请号：US12452647
申请日：2008-07-31
申请人： Takeshi Segawa , Kiyofumi Tanaka
发明人： Takeshi Segawa , Kiyofumi Tanaka
IPC分类号： H01L21/683 , B25B11/00
CPC分类号： H01L21/67132 , H01L21/6838 , Y10T29/49998 , Y10T156/1132
摘要： A fixing jig is made up of a plate-like jig main body (2) and a close contact layer (3) which detachably holds a work (W) in close contact therewith. The jig main body has: on one surface thereof a plurality of supporting projections (4) to support the close contact layer; and also has, along an outer peripheral portion of said one surface, a side wall (5) which is of substantially the same height as the supporting projections. The close contact layer is adhered to an end surface of the side wall to thereby define a partitioned space (6) between the close contact layer and the jig main body. By sucking the air within the partitioned space via a ventilation hole (7) formed in the jig main body, the close contact layer is deformed. The work is thus surely supported and fixed also in performing a processing in which a force is applied to the work. The jig main body (2) has formed therein a suction hole (8) which opens into an outer surface on the side of the close contact layer (3) but which is not communicated with the partitioned space (6). A through hole (9) in communication with the suction hole (8) is formed in the close contact layer (3). A suction force is applied to the work W by evacuation of the suction hole (8).
摘要翻译：固定夹具由能够可拆卸地保持工件（W）紧密接触的板状夹具主体（2）和紧密接触层（3）构成。夹具主体在其一个表面上具有多个支撑突起（4）以支撑紧密接触层; 并且沿着所述一个表面的外周部分具有与所述支撑突起基本相同的高度的侧壁（5）。紧密接触层粘附到侧壁的端面，从而在紧密接触层和夹具主体之间限定分隔空间（6）。通过在夹具主体中形成的通气孔（7）吸入分隔空间内的空气，使紧密接触层发生变形。因此，在对作业施加力的处理中，确实地支撑和固定工件。夹具主体（2）上形成有向密闭接触层（3）侧的外表面开口但不与分隔空间（6）连通的吸入孔（8）。在紧密接触层（3）中形成有与抽吸孔（8）连通的通孔（9）。通过抽吸吸入孔（8）将吸力施加到工件W。

9. 发明申请

US20090081852A1 HOLDING JIG, SEMICONDUCTOR WAFER GRINDING METHOD, SEMICONDUCTOR WAFER PROTECTING STRUCTURE AND SEMICONDUCTOR WAFER GRINDING METHOD AND SEMICONDUCTOR CHIP FABRICATION METHOD USING THE STRUCTURE 有权
标题翻译：控制晶圆，半导体晶粒磨削方法，半导体晶体保护结构和半导体晶粒研磨方法及半导体芯片制造方法
公开(公告)号：US20090081852A1
公开(公告)日：2009-03-26
申请号：US12282984
申请日：2007-03-09
申请人： Kiyofumi Tanaka , Satoshi Odashima , Noriyoshi Hosono , Hironobu Fujimoto , Takeshi Segawa
发明人： Kiyofumi Tanaka , Satoshi Odashima , Noriyoshi Hosono , Hironobu Fujimoto , Takeshi Segawa
IPC分类号： H01L21/304 , B24B41/06
CPC分类号： H01L21/6875 , B24B37/042 , B24B41/061 , B65G49/061 , B65G2249/045 , Y10T428/24322
摘要： A backgrinding machine 10 of a semiconductor wafer W includes: a table 13 set on the working plane of a mount 11; a multiple number of holding jigs 20 arranged via check tables 15 on table 13; a grinding machine 30 for performing a grinding process of the rear side of semiconductor wafer W held by holding jig 20; and a washing device 40 for ground semiconductor wafers W. Each holding jig 20 is constructed of a concave 22 depressed on the surface of a base plate 21, a multiple number of supporting projections 23 projectively arrayed on the bottom surface of concave 22, a deformable contact film 24, covering the concave 22, being supported by the multiple supporting projections 23, for detachably holding semiconductor wafer W in close contact with it; and an exhaust path 25 for conducting air from the concave 22 covered by contact film 24 to the outside.
摘要翻译：半导体晶片W的背面研磨机10包括：设置在安装件11的工作面上的工作台13; 通过表13上的检查台15布置多个保持夹具20; 用于进行通过保持夹具20保持的半导体晶片W的后侧的研磨处理的研磨机30; 以及用于接地半导体晶片W的洗涤装置40.每个保持夹具20由在基板21的表面上凹陷的凹部22构成，多个支撑突起23投影地排列在凹部22的底面上，接触膜24，覆盖凹部22，由多个支撑突起23支撑，用于可拆卸地保持半导体晶片W与其紧密接触; 以及用于将空气从由接触膜24覆盖的凹部22引导到外部的排气路径25。

10. 发明授权

US6089999A Arrangement of pulley cylinder in a belt-type continuously variable transmission 失效
标题翻译：皮带轮在带式无级变速器中的布置
公开(公告)号：US6089999A
公开(公告)日：2000-07-18
申请号：US10577
申请日：1998-01-22
申请人： Makoto Imaida , Kiyofumi Tanaka , Yusuke Kasuya , Masahiko Yamada
发明人： Makoto Imaida , Kiyofumi Tanaka , Yusuke Kasuya , Masahiko Yamada
IPC分类号： F16H9/18 , F16H55/56 , F16H63/06 , F16H59/00
CPC分类号： F16H55/56 , F16H63/065
摘要： In a pulley arrangement of a belt-type continuously variable transmission, a ring member (6) integrated with a first cylinder member (3) is coupled to a second cylinder member (5) using splines (6d and 5c) to limit mutual movements of the first and second cylinder members and using snap ring (7) to limit the axial displacement therebetween in peripheral directions of the respective first and second cylinder members. The first cylinder member is slidably contacted on an outer peripheral surface of a hollow cylindrical portion of a second conical pulley component. The second cylinder member is fixed onto an outer peripheral surface of a shaft portion of a first conical pulley component. In addition, a another stopper is provided between an outer peripheral end of the hollow cylindrical portion (56d) and an inner peripheral surface of the second piston member (8) for limiting mutual movements of the second piston member and the hollow cylindrical portion in the peripheral directions of the second piston member and the hollow cylindrical portion.
摘要翻译：在带式无级变速器的滑轮装置中，与第一气缸构件（3）成一体的环构件（6）使用花键（6d和5c）联接到第二气缸构件（5），以限制相互运动第一和第二气缸构件，并且使用止动环（7）限制其在相应的第一和第二气缸构件的圆周方向上的轴向位移。第一圆筒构件在第二圆锥形滑轮组件的中空圆柱形部分的外周表面上可滑动地接触。第二圆筒部件被固定在第一锥形滑轮部件的轴部的外周面上。此外，在中空圆筒部（56d）的外周端与第二活塞部件（8）的内周面之间设置另一个止动件，用于限制第二活塞部件和中空圆筒部的相互移动第二活塞部件和中空圆筒部的圆周方向。

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