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1. 发明申请

US20080121368A1 HEAT DISSIPATION DEVICE 有权
标题翻译：散热装置
公开(公告)号：US20080121368A1
公开(公告)日：2008-05-29
申请号：US11564265
申请日：2006-11-28
申请人： YONG-DONG CHEN , GUANG YU , SHIH-HSUN WUNG , CHUN-CHI CHEN
发明人： YONG-DONG CHEN , GUANG YU , SHIH-HSUN WUNG , CHUN-CHI CHEN
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a base and a fin set arranged on the base. The fin set includes a plurality of fins each having an undulating body and two flanges extending from the body. The body includes a plurality of peak faces, a plurality of trough faces alternating with the peak faces and a plurality of slanted faces each connecting adjacent peak face and trough face. The peak faces of each fin conform to the peak faces of an adjacent fin, while the trough faces of each fin conform to the trough faces of the adjacent fin. Pluralities of undulating passages are defined between two adjacent fins. Each heat pipe has a first section contacting the base and a second section extending through the fin set. A fan is located corresponding to the passages of the fin set for providing forced airflow to the fin set.
摘要翻译：散热装置包括底座和布置在基座上的翅片组。翅片组包括多个翅片，每个翼片具有起伏体和从主体延伸的两个凸缘。主体包括多个峰面，与峰面交替的多个槽面和各自连接相邻的峰面和槽面的多个倾斜面。每个翅片的峰面与相邻翅片的峰面匹配，而每个翅片的槽面符合相邻翅片的槽面。在两个相邻的翅片之间限定多个起伏通道。每个热管具有接触基部的第一部分和延伸穿过翅片组的第二部分。风扇对应于翅片组的通道，用于向翅片组提供强制气流。

2. 发明申请

US20080295993A1 HEAT DISSIPATION APPARATUS WITH HEAT PIPES 有权
标题翻译：热管散热装置
公开(公告)号：US20080295993A1
公开(公告)日：2008-12-04
申请号：US11757196
申请日：2007-06-01
申请人： YONG-DONG CHEN , GUANG YU , SHIH-HSUN WUNG , CHUN-CHI CHEN
发明人： YONG-DONG CHEN , GUANG YU , SHIH-HSUN WUNG , CHUN-CHI CHEN
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , F28D15/0266 , F28D15/0275 , F28F1/12 , F28F3/02 , F28F2215/10 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation apparatus adapted for removing heat from a heat-generating electronic component, includes a conducting core, a plurality of conducting arms, a plurality of fins and a heat pipe assembly. The conducting core comprises a heat-absorbing portion contacting with the heat-generating electronic component. The conducting arms extend radially and outwardly from the conducting core. The fins extend outwardly from the respective conducting arms. Each of the heat pipes comprises an evaporating section thermally attached to the heat-absorbing portion of the conducting core and at least one condensing section thermally coupled to the respective conducting arm.
摘要翻译：一种用于从发热电子部件除去热量的散热装置，包括导电芯，多个导电臂，多个翅片和热管组件。导电芯包括与发热电子部件接触的吸热部。导电臂从导电芯径向和向外延伸。翅片从相应的导电臂向外延伸。每个热管包括热连接到导电芯的吸热部分的蒸发部分和至少一个热连接到相应导电臂的冷凝部分。

3. 发明申请

US20080123296A1 HEAT DISSIPATION SYSTEM 失效
标题翻译：散热系统
公开(公告)号：US20080123296A1
公开(公告)日：2008-05-29
申请号：US11626049
申请日：2007-01-23
申请人： YONG-DONG CHEN , GUANG YU , CHUN-CHI CHEN , SHIH-HSUN WUNG
发明人： YONG-DONG CHEN , GUANG YU , CHUN-CHI CHEN , SHIH-HSUN WUNG
IPC分类号： H05K7/20 , H01B7/42
CPC分类号： H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation system is used for dissipating heat generated by an electronic device mounted on a printed circuit board. The heat dissipation system includes an enclosure adapted to receive the electronic device therein, the enclosure having a base plate on which the printed circuit board is mounted. A spreader adapted for contacting the electronic device in the enclosure. A plurality of fins disposed between the printed circuit board and the base plate, the fins thermally engaging with the base plate. A heat pipe is used to thermally connect the spreader and the fins together, which are positioned at opposite sides of the printed circuit board, respectively. Accordingly, the enclosure can help to dissipate the heat generated by the electronic device.
摘要翻译：散热系统用于散发由安装在印刷电路板上的电子装置产生的热量。散热系统包括适于在其中接收电子设备的外壳，外壳具有安装有印刷电路板的基板。适于接触外壳中的电子设备的吊具。设置在印刷电路板和基板之间的多个翅片，散热片与基板热接合。热管用于将扩散器和翅片热连接在一起，这些分别位于印刷电路板的相对侧。因此，外壳可以帮助消散由电子设备产生的热量。

4. 发明申请

US20080151505A1 HEAT DISSIPATION DEVICE 失效
标题翻译：散热装置
公开(公告)号：US20080151505A1
公开(公告)日：2008-06-26
申请号：US11614766
申请日：2006-12-21
申请人： YONG-DONG CHEN , GUANG YU , SHIH-HSUN WUNG , CHUN-CHI CHEN
发明人： YONG-DONG CHEN , GUANG YU , SHIH-HSUN WUNG , CHUN-CHI CHEN
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , F28F2215/00 , H01L23/4006 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device is used for dissipating heat from a CPU and electronic components. The heat dissipation device includes a heat absorbing portion for absorbing heat from the CPU, and a heat sink located on the heat absorbing portion. The heat sink includes a plurality of curved fins defining a plurality of curved passages therebetween. An airflow source is located adjacent to the heat sink for providing forced airflow to the heat sink. A direction of the airflow from the airflow source is changed when it passes through the passages. A direction of the airflow out of the passages is perpendicular to a direction of the airflow into the passages. The airflow out of the heat sink further flows to the electronic components located adjacent to the CPU.
摘要翻译：散热装置用于散发来自CPU和电子元件的热量。散热装置包括用于从CPU吸收热量的吸热部分和位于吸热部分上的散热器。散热器包括多个在其间限定多个弯曲通道的弯曲翅片。气流源位于散热器附近，以向散热器提供强制气流。来自气流源的气流的方向在通过通路时发生变化。从通道出来的气流的方向垂直于进入通道的气流的方向。从散热器出来的气流进一步流向位于CPU附近的电子部件。

5. 发明申请

US20080128118A1 HEAT DISSIPATION DEVICE WITH A HEAT PIPE 审中-公开
标题翻译：带散热管的散热装置
公开(公告)号：US20080128118A1
公开(公告)日：2008-06-05
申请号：US11566011
申请日：2006-12-01
申请人： YONG-DONG CHEN , GUANG YU , CHUN-CHI CHEN
发明人： YONG-DONG CHEN , GUANG YU , CHUN-CHI CHEN
IPC分类号： H05K7/20
CPC分类号： H01L23/3672 , H01L23/4006 , H01L23/427 , H01L2023/4062 , H01L2023/4081 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a base (40) and fins (30) attached to the base (40) and two heat pipes (20). The fins (30) include a first portion (325) and a second portion (326) connecting with one side of the first portion (325), and the second portion (326) is higher than the first portion (325). Each of the heat pipes (20) includes an evaporating portion (22) sandwiched between the base (40) and the first portion (325) of the fins (30), a condensing portion (24) inserted into the second portion (326) of the fins (30).
摘要翻译：散热装置包括底座（40）和连接到基座（40）的翅片（30）和两个热管（20）。翅片（30）包括与第一部分（325）的一侧连接的第一部分（325）和第二部分（326），并且第二部分（326）高于第一部分（325）。每个热管（20）包括夹在基座（40）和翅片（30）的第一部分（325）之间的蒸发部分（22），插入第二部分（326）中的冷凝部分（24）的翅片（30）。

6. 发明申请

US20100053953A1 LIGHT-GUIDING MODULE AND LED LAMP USING THE SAME 失效
标题翻译：导光模块和使用其的LED灯
公开(公告)号：US20100053953A1
公开(公告)日：2010-03-04
申请号：US12331394
申请日：2008-12-09
申请人： SHIH-HSUN WUNG , YONG-DONG CHEN , XIAO-YU HU
发明人： SHIH-HSUN WUNG , YONG-DONG CHEN , XIAO-YU HU
IPC分类号： F21V1/00
CPC分类号： F21V29/763 , F21K9/00 , F21V29/004 , F21V29/75 , F21V29/76 , F21V29/85 , F21Y2115/10
摘要： An LED lamp includes a heat sink, a plurality of LED modules mounted on a top of the heat sink and a plurality of light-guiding modules respectively fixed on the LED modules. The heat sink includes a base and a plurality of fins extending downwardly from the base. Each LED module includes a plurality of LEDs mounted thereon. Each light-guiding module includes a mounting bracket defining a plurality of through holes therein and a plurality of guiding units respectively received in the through holes of the mounting bracket. The guiding units are respectively in alignment with the LEDs of a corresponding LED module and receive the LEDs in lower ends thereof to reflect and guide light generated by the corresponding LED module in a predetermined manner.
摘要翻译： LED灯包括散热器，安装在散热器顶部的多个LED模块和分别固定在LED模块上的多个导光模块。散热器包括底座和从基座向下延伸的多个翅片。每个LED模块包括安装在其上的多个LED。每个导光模块包括在其中限定多个通孔的安装支架和分别容纳在安装支架的通孔中的多个引导单元。引导单元分别与相应的LED模块的LED对准，并在其下端接收LED，以预定的方式反射和引导由相应的LED模块产生的光。

7. 发明申请

US20090154169A1 LED LAMP WITH A HEAT SINK 审中-公开
标题翻译：带灯泡的LED灯
公开(公告)号：US20090154169A1
公开(公告)日：2009-06-18
申请号：US12039637
申请日：2008-02-28
申请人： JUN LIU , YONG-DONG CHEN , SHIH-HSUN WUNG
发明人： JUN LIU , YONG-DONG CHEN , SHIH-HSUN WUNG
IPC分类号： F21V7/00 , F21V29/00
CPC分类号： F21V29/767 , F21K9/00 , H01L2924/0002 , H01L2924/00
摘要： An LED lamp includes a post (10), a heat sink (20) enclosing the post, an LED module (30) mounted in the post, a holder (40) secured on the LED module, and a lens (50) covering the holder. The heat sink is formed by a plurality of fins (22), each having an annular and planar configuration to contact and surround the post. The fins are parallel to each other and mounted on the post along a length direction of the post. An LED (32) of the LED module is received in the holder, whereby light generated by the LED is reflected by the holder.
摘要翻译： LED灯包括柱（10），封闭柱的散热器（20），安装在柱中的LED模块（30），固定在LED模块上的保持架（40）和覆盖持有人散热器由多个翅片（22）形成，每个翅片具有环形和平面构造以接触和围绕柱。散热片彼此平行并沿柱的长度方向安装在支柱上。 LED模块的LED（32）被容纳在保持器中，由LED产生的光被保持器反射。

8. 发明申请

US20100097804A1 LED LAMP 失效
标题翻译：点灯
公开(公告)号：US20100097804A1
公开(公告)日：2010-04-22
申请号：US12391175
申请日：2009-02-23
申请人： SHIH-HSUN WUNG , YONG-DONG CHEN , YE-KE XIE
发明人： SHIH-HSUN WUNG , YONG-DONG CHEN , YE-KE XIE
IPC分类号： F21V21/00
CPC分类号： F21V19/0035 , F21V23/02 , F21Y2115/10
摘要： An LED lamp includes a bracket, two guiding plates and a number of LED assemblies. Each of the guiding plates includes a body, a top flange and a bottom flange extending from top and bottom edges of the body, respectively. The bottom flanges are mounted on opposite sides of the bracket. The top flanges are oriented towards each other. The LED assemblies are mounted to the bracket and sandwiched between the bodies of the guiding plates. The LED assemblies slide along a longitudinal direction of the guiding plates before the LED assemblies are assembled to the bracket by screwing the LED assemblies to the guiding plates. The quantity of the LED assemblies assembled to the bracket is selective thereby to meet different luminous density requirements/specifications.
摘要翻译： LED灯包括支架，两个导板和多个LED组件。每个导向板分别包括主体，顶部凸缘和从主体的顶部和底部边缘延伸的底部凸缘。底部法兰安装在支架的相对两侧。顶部法兰朝向彼此。 LED组件安装到支架并夹在导板的主体之间。 LED组件沿着导向板的纵向方向滑动，然后将LED组件通过将LED组件拧到导向板上而组装到支架上。组装到支架上的LED组件的数量是选择性的，以满足不同的发光密度要求/规格。

9. 发明申请

US20090303712A1 LED LAMP 失效
标题翻译：点灯
公开(公告)号：US20090303712A1
公开(公告)日：2009-12-10
申请号：US12329609
申请日：2008-12-07
申请人： SHIH-HSUN WUNG , YONG-DONG CHEN , WEN XU , YE-KE XIE
发明人： SHIH-HSUN WUNG , YONG-DONG CHEN , WEN XU , YE-KE XIE
IPC分类号： F21V29/00
CPC分类号： F21V29/20 , F21K9/00 , F21S2/005 , F21V15/01 , F21V19/003 , F21V29/74 , F21V29/763 , F21Y2103/10 , F21Y2115/10
摘要： An LED lamp includes a housing, a heat sink received in the housing, a plurality of LED modules thermally attached to the heat sink and a plurality of wire clips spanning over the heat sink and securing the heat sink on the housing. The heat sink includes a base and a plurality of fins extending from the base. Each of the clips includes a pivoting portion pivotally mounted on the housing, two locking portions located opposite to the pivoting portion and detachably engaging with the housing, and two pressing portions respectively interconnecting the pivoting portion with the two locking portions and abutting against the base.
摘要翻译： LED灯包括壳体，容纳在壳体中的散热器，多个LED模块，其热连接到散热器，以及多个线夹跨过散热器并将散热器固定在壳体上。散热器包括基部和从基部延伸的多个翅片。每个夹子包括枢转地安装在壳体上的枢转部分，与枢转部分相对并且可拆卸地与壳体接合的两个锁定部分，以及两个分别将枢转部分与两个锁定部分相互连接并抵靠基部的按压部分。

10. 发明申请

US20090296393A1 LED LAMP 失效
标题翻译：点灯
公开(公告)号：US20090296393A1
公开(公告)日：2009-12-03
申请号：US12248898
申请日：2008-10-10
申请人： SHIH-HSUN WUNG , YONG-DONG CHEN , WEN XU , XIN-JIAN XIAO
发明人： SHIH-HSUN WUNG , YONG-DONG CHEN , WEN XU , XIN-JIAN XIAO
IPC分类号： F21V21/00
CPC分类号： F21V29/004 , F21S8/08 , F21V7/00 , F21V15/01 , F21V19/001 , F21V29/777 , F21W2131/10 , F21W2131/40 , F21Y2115/10 , H01L2924/0002 , Y10S362/80 , H01L2924/00
摘要： An LED lamp comprises a heat sink, a plurality of LED modules respectively disposed at two opposite sides of the heat sink, a casing attached to a front of the heat sink, two envelopes respectively located at the two opposite lateral sides of the heat sink and covering the LED modules therein and a holder connecting the casing for holding the LED lamp in position.
摘要翻译： LED灯包括散热器，分别设置在散热器的两个相对侧的多个LED模块，附接到散热器前部的壳体，分别位于散热器的两个相对侧面的两个信封，以及覆盖其中的LED模块和连接壳体以将LED灯保持就位的保持架。

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