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1. 发明申请

US20120103861A1 TRAY FOR POSITIONING ELONGATED OBJECTS, IN PARTICULAR SYRINGE BODIES OR SYRINGES 有权
标题翻译：用于定位延长对象的托盘，特别是SYRINGE机构或SYRINGES
公开(公告)号：US20120103861A1
公开(公告)日：2012-05-03
申请号：US13382237
申请日：2009-07-15
申请人： Xu Song , Behzad Mottahed , Ruane Jeter , Samuel Gagnieux , Antoine Boulet , Franck Carrel , Nicolas Eon
发明人： Xu Song , Behzad Mottahed , Ruane Jeter , Samuel Gagnieux , Antoine Boulet , Franck Carrel , Nicolas Eon
IPC分类号： B65D1/34
CPC分类号： A61M5/008 , A61B50/33 , A61M5/002 , B01L9/00 , B01L9/06 , B01L9/54 , B65D21/0233
摘要： Each of said elongated objects comprises a body and a flange. The tray includes a plate with openings and bearing surfaces.According to the invention: the tray includes at least one first bearing surface near a first opening, located at a first distance from the plate of the tray, and at least one second bearing surface near a second opening adjacent said first opening located at a second distance from the plate of the tray, said second distance being different from said first distance; said first and second openings are located at a distance one with respect to the other such that the flange of the object engaged in one of these openings is able to partially overlap the flange of the object engaged in the other of these openings without contact with this flange.
摘要翻译：每个所述细长物体包括主体和凸缘。托盘包括具有开口和支承表面的板。根据本发明：托盘包括位于距托盘平板第一距离处的第一开口附近的至少一个第一支承表面，以及邻近位于第二开口处的第一开口的第二开口附近的至少一个第二支承表面距离盘的板的距离，所述第二距离不同于所述第一距离; 所述第一和第二开口位于相对于另一开口的距离处，使得接合在这些开口中的一个中的物体的凸缘能够部分地重叠与这些开口中的另一个接合的物体的凸缘，而不与该接触法兰

2. 发明授权

US08485357B2 Tray for positioning elongated objects, in particular syringe bodies or syringes 有权
标题翻译：用于定位细长物体，特别是注射器体或注射器的托盘
公开(公告)号：US08485357B2
公开(公告)日：2013-07-16
申请号：US13382237
申请日：2009-07-15
申请人： Xu Song , Behzad Mottahed , Ruane Jeter , Samuel Gagniuex , Antoine Boulet , Franck Carrel , Nicolas Eon
发明人： Xu Song , Behzad Mottahed , Ruane Jeter , Samuel Gagniuex , Antoine Boulet , Franck Carrel , Nicolas Eon
IPC分类号： B65D83/10 , B65D85/20 , A47F7/00
CPC分类号： A61M5/008 , A61B50/33 , A61M5/002 , B01L9/00 , B01L9/06 , B01L9/54 , B65D21/0233
摘要： A tray for positioning elongated objects each having a body and a flange. The tray includes a plate with openings and bearing surfaces. At least one first bearing surface is near a first opening and located at a first distance from the plate of the tray, and at least one second bearing surface is near a second opening adjacent the first opening and located at a second distance from the plate of the tray. The second distance is different from the first distance. The first and second openings are located at a distance with respect to one another such that the flange of a first elongated object engaged in one of these openings is able to partially overlap the flange of a second elongated object engaged in the other of these openings without contact between the flange of the first elongated object and the flange of the second elongated object.
摘要翻译：用于定位细长物体的托盘，每个物体均具有主体和凸缘。托盘包括具有开口和支承表面的板。至少一个第一支承表面靠近第一开口并且位于距托盘平板的第一距离处，并且至少一个第二支承表面靠近与第一开口相邻的第二开口，并且位于离板的第二距离处托盘。第二距离与第一距离不同。第一和第二开口相对于彼此定位成一定距离，使得接合在这些开口中的一个中的第一细长物体的凸缘能够部分地重叠接合在这些开口中的另一个中的第二细长物体的凸缘，而没有第一细长物体的凸缘与第二细长物体的凸缘之间的接触。

3. 发明申请

US20070132124A1 Molds for use in contact lens production 有权
标题翻译：用于隐形眼镜生产的模具
公开(公告)号：US20070132124A1
公开(公告)日：2007-06-14
申请号：US11299641
申请日：2005-12-12
申请人： Dharmesh Dubey , Xu Song , Mark Schlagel
发明人： Dharmesh Dubey , Xu Song , Mark Schlagel
IPC分类号： G02B3/00 , B29D11/00
CPC分类号： B29C33/0038 , B29D11/00057
摘要： The invention provides molds useful in the production of contact lenses having seamless edges and in which molds movement of one mold half in relation to the other mold half is decreased. These results are attained by providing mold halves with shoulder stops and seam-matching features.
摘要翻译：本发明提供了用于生产具有无缝边缘的隐形眼镜的模具，其中一个半模相对于另一个半模的模具移动减小。这些结果是通过提供具有肩台和缝合匹配特征的半模获得的。

4. 发明授权

US06753477B1 Flatwire jumper patch 失效
标题翻译：扁线跳线贴片
公开(公告)号：US06753477B1
公开(公告)日：2004-06-22
申请号：US10426304
申请日：2003-04-30
申请人： Peter J. Sinkunas , Andrew Z. Glovatsky , Xu Song , Anne M. Sullivan , Yutaka Kawase
发明人： Peter J. Sinkunas , Andrew Z. Glovatsky , Xu Song , Anne M. Sullivan , Yutaka Kawase
IPC分类号： H01B708
CPC分类号： H01R12/613 , H05K1/141 , H05K3/222 , H05K3/363 , H05K2201/10363
摘要： A flatwire assembly includes a pair of elongate flatwire segments that are interconnected with a thin, flexible patch that overlies the opposed longitudinal ends of the segments. Conductive traces on the bottom face of the patch are electrically connected to the respective conductive traces of the segments by solder layers that, upon reflow under heat and pressure, respectively extend past an edge of the patch, whereupon visual confirmation of the solder joints between the traces of the patch and the segment is readily obtained. A layer of a thermally-activated or pressure-sensitive adhesive is disposed between the patch and each segment to further mechanically couple the patch to each segment during solder reflow. Longitudinal extensions of the patch substrate are bonded by the adhesive layer to respective portions of the segments farther removed from the segment ends than the solder layer extensions provide enhanced strain relief.
摘要翻译：扁线组件包括一对细长的扁平线段，其与覆盖在段的相对的纵向端部之间的薄的柔性补片相互连接。贴片底面上的导电迹线通过焊料层电连接到片段的相应导电迹线，焊料层在热和压力下回流分别延伸经过贴片的边缘，于是可见地确认焊点贴片和片段的痕迹容易获得。在贴片和每个片段之间设置热激活或压敏粘合剂层，以在焊料回流期间进一步将贴片机械地耦合到每个片段。贴片衬底的纵向延伸部分通过粘合剂层粘合到比段焊接层延伸更远部分的相应部分，而焊料层延伸部提供增强的应变消除。

5. 发明授权

US06814273B2 Flatwire repair tool systems and methods 失效
标题翻译： Flatwire维修工具系统和方法
公开(公告)号：US06814273B2
公开(公告)日：2004-11-09
申请号：US10241898
申请日：2002-09-12
申请人： Anne Marie Sullivan , Xu Song , Lakhi N. Goenka , Yutaka Kawase , Cuong-Van Pham , Bhavani Shankar Tata , Peter Joseph Sinkunas
发明人： Anne Marie Sullivan , Xu Song , Lakhi N. Goenka , Yutaka Kawase , Cuong-Van Pham , Bhavani Shankar Tata , Peter Joseph Sinkunas
IPC分类号： B23K3704
CPC分类号： H01R12/613 , B23K1/012 , B23K2101/38 , H01R43/0263 , H05K3/0052 , H05K3/225 , H05K3/3494 , H05K3/363 , H05K2203/0195 , H05K2203/086 , H05K2203/167
摘要： A system and method for reworking, repairing and upgrading flatwire is disclosed. A repair tool for reworking and/or repairing the flatwire is disclosed for creating subsequent electrical and mechanical joints of equal or greater quality as compared to the original system. The repair tool includes a heating blade, a power controller, a tool assembly, an inerting system, a cooling system, a flatwire cassette, a tool material, a flatwire material, an upgrade/repair procedure and various other aspects for rapidly heating flatwire two join two separate portions of the flatwire. The system and method of the present invention addresses the challenges of working with substrate materials which typically degrade at temperatures commonly used to form solder joints. Further, the soldering tool of the present invention may be a portable, lightweight unit that can be used in the field, for automotive and aerospace applications.
摘要翻译：公开了一种用于返修，修理和升级扁线的系统和方法。公开了用于修复和/或修理扁线的修理工具，用于与原始系统相比创建相同或更高质量的后续电气和机械接头。修理工具包括加热刀片，功率控制器，工具组件，惰性系统，冷却系统，扁平线盒，工具材料，扁线材料，升级/修复程序以及用于将扁丝快速加热到连接扁丝的两个分开的部分。本发明的系统和方法解决了在通常用于形成焊点的温度下通常降解的衬底材料的挑战。此外，本发明的焊接工具可以是可用于现场的便携式轻型单元，用于汽车和航空应用。

6. 发明授权

US5813884A Meniscus-shape terminations for leadless electronic components 失效
标题翻译：无铅电子部件的弯月形终端
公开(公告)号：US5813884A
公开(公告)日：1998-09-29
申请号：US835366
申请日：1997-04-07
申请人： Yi-Hsin Pao , Dangrong Ronald Liu , Chan-Jiun Ed Jih , Xu Song
发明人： Yi-Hsin Pao , Dangrong Ronald Liu , Chan-Jiun Ed Jih , Xu Song
IPC分类号： H01C1/14 , H01C17/00 , H05K3/34 , H01R4/02
CPC分类号： H01C17/006 , H01C1/14 , H05K3/3442 , H05K2201/09381 , H05K2201/10636 , Y02P70/611 , Y02P70/613
摘要： There is disclosed herein a leadless electronic component (LEC) which avoids solder joint crack initiation. A preferred embodiment of the LEC 110 comprises a body portion 112 having terminations 114 arranged thereabout, each termination having a bottom portion 124 with an interior edge 126, wherein the interior edge has a substantially meniscus-like shape oriented so as to be concave with respect to a centroid of the LEC.
摘要翻译：这里公开了一种避免焊点裂纹开始的无引线电子部件（LEC）。 LEC 110的优选实施例包括具有布置在其周围的终端114的主体部分112，每个终端具有带有内部边缘126的底部124，其中内部边缘具有基本上弯月面状的形状，以相对于到LEC的质心。

7. 发明授权

US08287269B2 Molds for use in contact lens production 有权
标题翻译：用于隐形眼镜生产的模具
公开(公告)号：US08287269B2
公开(公告)日：2012-10-16
申请号：US11299641
申请日：2005-12-12
申请人： Dharmesh K. Dubey , Xu Song , Mark E. Schlagel
发明人： Dharmesh K. Dubey , Xu Song , Mark E. Schlagel
IPC分类号： B29D11/00
CPC分类号： B29C33/0038 , B29D11/00057
摘要： The invention provides molds useful in the production of contact lenses having seamless edges and in which molds movement of one mold half in relation to the other mold half is decreased. These results are attained by providing mold halves with shoulder stops and seam-matching features.
摘要翻译：本发明提供了用于生产具有无缝边缘的隐形眼镜的模具，其中一个半模相对于另一个半模的模具移动减小。这些结果是通过提供具有肩台和缝合匹配特征的半模获得的。

8. 发明授权

US5931371A Standoff controlled interconnection 失效
标题翻译：对接控制互连
公开(公告)号：US5931371A
公开(公告)日：1999-08-03
申请号：US784333
申请日：1997-01-16
申请人： Yi-Hsin Pao , Chan-Jiun Jih , Jun Ming Hu , Vivek Amir Jairazbhoy , Richard Keith McMillan, II , Xu Song
发明人： Yi-Hsin Pao , Chan-Jiun Jih , Jun Ming Hu , Vivek Amir Jairazbhoy , Richard Keith McMillan, II , Xu Song
IPC分类号： B23K35/02 , H01L21/60 , H05K3/30 , H05K3/34 , B23K31/02 , B23K35/14 , B23K35/24
CPC分类号： H01L24/81 , B23K35/0244 , H05K3/3421 , H05K3/3442 , H01L2224/13111 , H01L2224/17517 , H01L2224/81136 , H01L2224/81801 , H01L2924/00013 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/19041 , H01L2924/19043 , H05K2201/10166 , H05K2201/10636 , H05K2201/10689 , H05K2201/10727 , H05K2201/10992 , H05K2201/2036 , H05K3/305 , Y02P70/611 , Y02P70/613
摘要： A method for joining a component to a substrate applies a base solder portion to the substrate and provides a standoff solder portion in the base solder portion. The standoff solder portion has a higher melting temperature than the base solder portion and a height which substantially corresponds to a desired standoff height between the component and the substrate. The component is positioned on the standoff solder portion and the base solder portion is melted under reflow conditions to form a solder joint between the component and the substrate. This joint substantially encapsulates the standoff solder portion, wherein the reflow conditions create a dendritic structure between the base solder portion and the standoff solder portion.
摘要翻译：用于将部件接合到基板的方法将基底焊接部分施加到基板，并在基底焊接部分中提供支撑焊接部分。隔离焊料部分具有比基底焊料部分更高的熔化温度和基本上对应于部件和基板之间期望的间隔高度的高度。该部件位于支座焊接部分上，并且基底焊料部分在回流条件下熔化以在部件和基板之间形成焊接接头。该接头基本上封装了支座焊接部分，其中回流条件在基底焊料部分和支座焊接部分之间产生树枝状结构。

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