专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20050230368A1 System for and method of manufacturing gravure printing plates 审中-公开
公开(公告)号：US20050230368A1
公开(公告)日：2005-10-20
申请号：US11062342
申请日：2005-02-18
申请人： Chen-Hsiung Cheng , Xinbing Liu
发明人： Chen-Hsiung Cheng , Xinbing Liu
IPC分类号： B23K26/00 , B23K26/38 , B41C1/05 , B41N1/06 , B41N6/00 , G03F7/00
CPC分类号： B41C1/05
摘要： A method of operating a laser drilling system to manufacture gravure printing plates without etching or the use of hazardous chemicals includes activating a laser drilling system, including a picosecond laser, light valves, and a mechanism adapted to rotate a gravure cylinder blank. Operation of the light valves, includes setting the light valves to block and/or allow pulses of laser energy propagating from the laser drilling system that can ablate a linear pattern of cells along a substantially entire length of the gravure cylinder blank. Drilling of cells includes targeting the laser drilling system on the gravure cylinder blank, such that ablation of materials occurs as sub-beams propagate along an optical path to the target area and impinge upon the gravure cylinder blank, wherein specific cells within the target area of the gravure cylinder blank are drilled or not drilled according to settings of the light valves.

2. 发明申请

US20050211748A1 Laser processing method and laser processing apparatus using ultra-short pulse laser 审中-公开
标题翻译：激光加工方法和使用超短脉冲激光的激光加工设备
公开(公告)号：US20050211748A1
公开(公告)日：2005-09-29
申请号：US11120091
申请日：2005-05-02
申请人： Yosuke Mizuyama , Yosuke Toyofuku , Xinbing Liu , Chen-Hsiung Cheng
发明人： Yosuke Mizuyama , Yosuke Toyofuku , Xinbing Liu , Chen-Hsiung Cheng
IPC分类号： B23K26/00 , B23K26/06 , B23K26/38 , B41J2/16 , H01S3/107 , H01S3/098
CPC分类号： B41J2/1634 , B23K26/064 , B23K26/0643 , B23K26/0648 , B41J2/162
摘要： A laser processing apparatus includes a laser generation apparatus for outputting an ultra-short pulse laser beam, a laser control apparatus for controlling the laser generation apparatus, an optical system, an optical system control apparatus for measuring the optical system, and a measurement apparatus for measuring the ultra-short pulse laser beam. The intensity of the largest noise component pulse in the ultra-short pulse laser beam is controlled to be 2.5% or less of the intensity of the primary pulse in the ultra-short pulse laser beam.
摘要翻译：一种激光加工装置，包括用于输出超短脉冲激光束的激光产生装置，用于控制激光产生装置的激光控制装置，光学系统，用于测量光学系统的光学系统控制装置，以及用于测量超短脉冲激光束。超短脉冲激光束中的最大噪声分量脉冲的强度被控制在超短脉冲激光束的初级脉冲强度的2.5％以下。

3. 发明授权

US06803539B2 System and method of aligning a microfilter in a laser drilling system using a CCD camera 失效
标题翻译：使用CCD照相机在激光钻孔系统中对准微型过滤器的系统和方法
公开(公告)号：US06803539B2
公开(公告)日：2004-10-12
申请号：US10267021
申请日：2002-10-08
申请人： Xinbing Liu , Chen-Hsiung Cheng
发明人： Xinbing Liu , Chen-Hsiung Cheng
IPC分类号： B23K2600
CPC分类号： B23K26/0608 , B23K26/0624 , B23K26/066 , B23K26/0676 , B23K26/382 , B23K26/389 , B23K26/40 , B23K2103/02 , B23K2103/42 , B23K2103/50 , B23K2103/52 , B41J2/162 , B41J2/1634
摘要： A system and method for aligning a microfilter in an optical circuit and thereby providing sub-beam impingement intensity control from a set of highly proximate sub-beams generated from a parallel process laser system removing a portion from a workpiece (exit holes in inkjet nozzle plates). The energy of laser-generated sub-beams to the target (cutting) point is attenuated to a level sufficient for maintaining operation of a charge-coupled-device camera below saturation when the sub-beams are incident on the camera, the CCD camera monitors the sub-beams and directs output to either a monitor or control computer. The microfilter is then adjusted to provide an optimal sub-beam pattern.
摘要翻译：一种用于对准光电路中的微过滤器的系统和方法，从而从平行过程激光系统产生的一组高度近似的子光束提供子束冲击强度控制，从工件中移除部分（喷墨喷嘴板中的出口孔）。激光产生的子光束到目标（切割）点的能量被衰减到足以在电子束入射到相机上时将电荷耦合器件照相机的操作保持在饱和状态的水平，CCD照相机监视器子光束并将其输出到监视器或控制计算机。然后调整微过滤器以提供最佳的子束图案。

4. 发明授权

US06931991B1 System for and method of manufacturing gravure printing plates 失效
公开(公告)号：US06931991B1
公开(公告)日：2005-08-23
申请号：US10814934
申请日：2004-03-31
申请人： Chen-Hsiung Cheng , Xinbing Liu
发明人： Chen-Hsiung Cheng , Xinbing Liu
IPC分类号： B23K26/00 , B23K26/38 , B41C1/05 , B41N1/06 , B41N6/00 , G03F7/00 , B41N6/06
CPC分类号： B41C1/05
摘要： A method of operating a laser drilling system to manufacture gravure printing plates without etching or the use of hazardous chemicals includes activating a laser drilling system, including a picosecond laser, light valves, and a mechanism adapted to rotate a gravure cylinder blank. Operation of the light valves, includes setting the light valves to block and/or allow pulses of laser energy propagating from the laser drilling system that can ablate a linear pattern of cells along a substantially entire length of the gravure cylinder blank. Drilling of cells includes targeting the laser drilling system on the gravure cylinder blank, such that ablation of materials occurs as sub-beams propagate along an optical path to the target area and impinge upon the gravure cylinder blank, wherein specific cells within the target area of the gravure cylinder blank are drilled or not drilled according to settings of the light valves.

5. 发明授权

US06627844B2 Method of laser milling 失效
标题翻译：激光铣削方法
公开(公告)号：US06627844B2
公开(公告)日：2003-09-30
申请号：US10267023
申请日：2002-10-08
申请人： Xinbing Liu , Chen-Hsiung Cheng
发明人： Xinbing Liu , Chen-Hsiung Cheng
IPC分类号： B23K2600
CPC分类号： B23K26/08 , B23K26/0624 , B23K26/082 , B23K26/384 , B23K26/389 , B41J2/162 , B41J2/1634 , H05K3/0026
摘要： A method of laser milling varied shape, geometrically repeatable holes is disclosed where a laser drilling system is provided to ablate material, desired hole geometry is determined based on customer specifications, ablation rate is determined using laser drilling system parameters, and a tool path algorithm is determined based on the geometry, ablation rate, and laser drilling system parameters. The laser milling method may be used in combination with single or parallel processing.
摘要翻译：公开了一种激光铣削的方法，其中提供了几何可重复的孔，其中提供激光钻孔系统以消融材料，根据客户规格确定所需的孔几何形状，使用激光钻孔系统参数确定烧蚀速率，并且刀具路径算法为基于几何，消融率和激光钻孔系统参数确定。激光研磨方法可以与单次或并行处理组合使用。

6. 发明授权

US07773216B2 Composite sheet material selection method for use in ultra-fast laser patterning 有权
标题翻译：用于超快速激光图案化的复合片材选择方法
公开(公告)号：US07773216B2
公开(公告)日：2010-08-10
申请号：US11579521
申请日：2005-05-10
申请人： Chen-Hsiung Cheng , Xinbing Liu
发明人： Chen-Hsiung Cheng , Xinbing Liu
IPC分类号： G01J3/00
CPC分类号： B23K26/032 , B23K26/03 , B23K2103/30 , B23K2103/50 , B32B38/10 , B32B2310/0843
摘要： The present invention is a method of selecting composite sheet materials for use in ultra-fast laser patterning of layers of organic thin film material such as OLEDs. The material is selected to accomplish patterning of upper layers without damaging underlying layers by using an ultra-fast laser programmed with the appropriate laser processing parameters. These parameters are derived by examining each layer's absorption spectra, thermal, and chemical characteristics. The method of the present invention includes measuring each layer's absorption spectrum, examining each layer's thermal and chemical characteristics, determining if the layer is ablatable, determining the laser setup, patterning the layer through laser ablation processing, and determining if more layers need to be ablated. Further, the method includes a sub-method of selecting an alternate material if a layer's material characteristics are not favorable for ablation without damaging underlying layers.
摘要翻译：本发明是选择用于有机薄膜材料如OLED的超快速激光图案化的复合片材的方法。选择材料以通过使用用适当的激光加工参数编程的超快速激光来实现上层的图案化而不损坏下层。这些参数是通过检查每层的吸收光谱，热和化学特性得出的。本发明的方法包括测量每层的吸收光谱，检查每层的热和化学特性，确定层是否可消融，确定激光设置，通过激光烧蚀处理对层进行图案化，以及确定是否需要消除更多的层。此外，该方法包括如果层的材料特性不利于消融而不损坏下层，则选择替代材料的子方法。

7. 发明申请

US20050230369A1 System for and method of manufacturing gravure printing plates 审中-公开
公开(公告)号：US20050230369A1
公开(公告)日：2005-10-20
申请号：US11071755
申请日：2005-03-03
申请人： Chen-Hsiung Cheng , Xinbing Liu
发明人： Chen-Hsiung Cheng , Xinbing Liu
IPC分类号： B23K26/00 , B23K26/38 , B41C1/05 , B41N1/06 , B41N6/00 , G03F7/00
CPC分类号： B41C1/05
摘要： A method of operating a laser drilling system to manufacture gravure printing plates without etching or the use of hazardous chemicals includes activating a laser drilling system, including a picosecond laser, light valves, and a mechanism adapted to rotate a gravure cylinder blank. Operation of the light valves, includes setting the light valves to block and/or allow pulses of laser energy propagating from the laser drilling system that can ablate a linear pattern of cells along a substantially entire length of the gravure cylinder blank. Drilling of cells includes targeting the laser drilling system on the gravure cylinder blank, such that ablation of materials occurs as sub-beams propagate along an optical path to the target area and impinge upon the gravure cylinder blank, wherein specific cells within the target area of the gravure cylinder blank are drilled or not drilled according to settings of the light valves.

8. 发明授权

US06829517B2 Computer system for use with laser drilling system 失效
公开(公告)号：US06829517B2
公开(公告)日：2004-12-07
申请号：US10267035
申请日：2002-10-08
申请人： Chen-Hsiung Cheng , Xinbing Liu
发明人： Chen-Hsiung Cheng , Xinbing Liu
IPC分类号： G06F1900
CPC分类号： B41J2/1634 , B23K26/0624 , B23K26/382 , B23K26/389 , B23K26/40 , B23K2103/05 , B23K2103/42 , B23K2103/50 , B41J2/161
摘要： A computer interface system for automated control of a laser drilling system has workpiece geometry template data defining a shape formed in a laser-milled workpiece. A user interface is receptive of a user selection characterizing a desired laser drilling operation. An expert system is adapted to receive the template data and the user selection, and is operable to adapt the template data to the user selection.

9. 发明授权

US06621045B1 Workpiece stabilization with gas flow 失效
标题翻译：工件稳定与气流
公开(公告)号：US06621045B1
公开(公告)日：2003-09-16
申请号：US10266936
申请日：2002-10-08
申请人： Xinbing Liu , Ming Li , Chen-Hsiung Cheng
发明人： Xinbing Liu , Ming Li , Chen-Hsiung Cheng
IPC分类号： B23K2638
CPC分类号： B23K26/38 , B23K26/0624 , B23K26/142 , B23K26/1435 , B23K26/1436 , B23K26/1437 , B23K26/1438 , B23K26/147
摘要： A method is provided for maintaining a workpiece in a focal plane of a laser drilling system. The method includes: providing a workpiece holder that is adapted to releasably retain a workpiece on a planar surface thereof, the planar surface having a recess extending therein; positioning the workpiece onto a planar surface of a workpiece holder, such that the workpiece extends across the recess formed in the workpiece holder and an exposed surface of the workpiece aligns with a focal plane of a laser drilling system; projecting a laser beam from the laser drilling system onto the exposed surface of the workpiece, thereby forming an ablation on the exposed surface of the workpiece; and directing a flow of gas onto the exposed surface of the workpiece substantially concurrent with the step of projecting a laser beam, such that the flow of gas substantially impinges on an area of the exposed surface that extends across the recess formed in the workpiece holder, thereby maintaining the exposed surface of the workpiece in the focal plane of the laser drilling system during the laser drilling operation.
摘要翻译：提供了一种用于将工件保持在激光钻孔系统的焦平面中的方法。该方法包括：提供适于将工件可释放地保持在其平坦表面上的工件保持器，该平坦表面具有在其中延伸的凹部; 将工件定位在工件保持器的平坦表面上，使得工件延伸穿过形成在工件保持器中的凹部，并且工件的暴露表面与激光钻孔系统的焦平面对齐; 将来自激光钻孔系统的激光束投射到工件的暴露表面上，从而在工件的暴露表面上形成消融; 并且在投射激光束的步骤的基础上同时将气体流引导到工件的暴露表面上，使得气体流基本上撞击暴露表面的延伸穿过形成在工件保持器中的凹部的区域，从而在激光钻孔操作期间将工件的暴露表面保持在激光钻孔系统的焦平面内。

10. 发明授权

US07122489B2 Manufacturing method of composite sheet material using ultrafast laser pulses 有权
公开(公告)号：US07122489B2
公开(公告)日：2006-10-17
申请号：US10844608
申请日：2004-05-12
申请人： Chen-Hsiung Cheng , Xinbing Liu , Atsushi Sogami , Kazuo Nishimura
发明人： Chen-Hsiung Cheng , Xinbing Liu , Atsushi Sogami , Kazuo Nishimura
IPC分类号： H01L21/00
CPC分类号： H01L51/0017 , H01L51/0009 , H01L51/56 , Y10S438/94
摘要： A patterned, multi-layered thin film structure is patterned using ultra-fast lasers and absorption spectroscopy without damaging underlying layers of the layered structure. The structure is made by selecting ablatable layers based on their thermal, strength and absorption spectra and by using an ultra-fast laser programmed with the appropriate wavelength (λ), pulse width (τ), spectral width (Δλ), spot size, bite size and fluence. The end structure may have features (such as vias, insulating areas, or inkjet printed areas) patterned in the last (top) layer applied or at deeper layers within the layered structure, and can be used as components of organic light emitting didoes (OLEDs) and organic thin film transistors (OTFTs). The method of the present invention includes determining the product's specifications, providing a substrate, selecting a layer, applying the layer, patterning the layer and determining if more layers need to be added to the multi-layered thin film structure.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式