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    • 4. 发明申请
    • CMOS SRAM cells employing multiple-gate transistors and methods fabricating the same
    • 采用多栅极晶体管的CMOS SRAM单元及其制造方法
    • US20060220134A1
    • 2006-10-05
    • US11375617
    • 2006-03-14
    • Zong-Liang HuoSeung-Jae BaikIn-Seok YeoHong-Sik YoonShi-Eun Kim
    • Zong-Liang HuoSeung-Jae BaikIn-Seok YeoHong-Sik YoonShi-Eun Kim
    • H01L27/12
    • H01L27/1203H01L21/84H01L27/11H01L27/1104H01L27/1108H01L29/785
    • Complementary metal oxide semiconductor (CMOS) static random access memory (SRAM) cells include at least a first inverter formed in a fin-shaped pattern of stacked semiconductor regions of opposite conductivity type. In some of these embodiments, the first inverter includes a first conductivity type (e.g., P-type or N-type) MOS load transistor electrically coupled in series with a second conductivity type (e.g., N-type of P-type) MOS driver transistor. The first inverter is arranged so that active regions of the first conductivity type MOS load transistor and the second conductivity type driver transistor are vertically stacked relative to each other within a first portion of a vertical dual-conductivity semiconductor fin structure. This fin structure is surrounded on at least three sides by a wraparound gate electrode, which is configured to modulate conductivity of both the active regions in response to a gate signal.
    • 互补金属氧化物半导体(CMOS)静态随机存取存储器(SRAM)单元包括形成为具有相反导电类型的堆叠半导体区域的鳍状图案的至少第一反相器。 在这些实施例的一些中,第一反相器包括与第二导电类型(例如,N型P型)MOS驱动器串联电耦合的第一导电类型(例如,P型或N型)MOS负载晶体管 晶体管。 第一反相器被布置成使得第一导电类型MOS负载晶体管和第二导电类型驱动晶体管的有源区在垂直双电导率半导体鳍结构的第一部分内相对于彼此垂直堆叠。 这种翅片结构在至少三面被环绕的栅电极包围,该环形栅电极被配置成响应于栅极信号调制两个有源区的电导率。