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    • 3. 发明授权
    • Forming adherent coatings using plasma processing
    • 使用等离子体处理形成粘附涂层
    • US06572933B1
    • 2003-06-03
    • US09160227
    • 1998-09-24
    • Michael A. NastasiKevin C. WalterDonald J. Rej
    • Michael A. NastasiKevin C. WalterDonald J. Rej
    • H05H124
    • C23C16/56C23C8/36C23C16/0245C23C16/029C23C16/32H01J37/32412
    • Process for forming adherent coatings using plasma processing. Plasma Immersion Ion Processing (PIIP) is a process where energetic (hundreds of eV to many tens of keV) metallic and metalloid ions derived from high-vapor-pressure organometallic compounds in a plasma environment are employed to deposit coatings on suitable substrates, which coatings are subsequently relieved of stress using inert ion bombardment, also in a plasma environment, producing thereby strongly adherent coatings having chosen composition, thickness and density. Four processes are utilized: sputter-cleaning, ion implantation, material deposition, and coating stress relief. Targets are placed directly in a plasma and pulse biased to generate a non-line-of-sight deposition without the need for complex fixturing. If the bias is a relatively high negative potential (20 kV-100 kV) ion implantation will result. At lower voltages (50 V-10 kV), deposition occurs, and the extent of the surface modification can routinely be extended between 1 &mgr;m and 10 &mgr;m. By combining plasma based implantation and film deposition, coatings with greatly reduced stress are possible, allowing the ultimate coating thickness to be expanded to tens of microns.
    • 使用等离子体处理形成粘附涂层的方法。 等离子体浸入离子处理(PIIP)是一种在等离子体环境中由高蒸气压的有机金属化合物衍生的能量(几百eV至几十keV)的金属和准金属离子用于将涂层沉积在合适的基材上的工艺, 随后在等离子体环境中使用惰性离子轰击释放应力,由此产生具有所选组成,厚度和密度的强粘附性涂层。 利用四个工艺:溅射清洗,离子注入,材料沉积和涂层应力消除。 目标直接放置在等离子体中,脉冲偏置以产生非视距沉积,而不需要复杂的夹持。 如果偏置是相对较高的负电位(20 kV-100 kV),则会产生离子注入。 在较低的电压(50V-10kV)下,发生沉积,并且表面改性的程度可以常规地在1m和10um之间延伸。 通过组合基于等离子体的植入和膜沉积,可以大大降低应力的涂层,使最终的涂层厚度扩展到几十微米。