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1. 发明授权

US5712078A High contrast photoresists comprising acid sensitive crosslinked polymeric resins 失效
标题翻译：包含酸敏感交联聚合物树脂的高对比度光致抗蚀剂
公开(公告)号：US5712078A
公开(公告)日：1998-01-27
申请号：US476793
申请日：1995-06-07
申请人： Wu-Song Huang , Harold George Linde , Charles Arthur Whiting
发明人： Wu-Song Huang , Harold George Linde , Charles Arthur Whiting
IPC分类号： C08L25/02 , C08L61/10 , C08L101/00 , G03F7/004 , G03F7/039 , H01L21/027 , G03C1/73
CPC分类号： G03F7/0045 , G03F7/039 , Y10S430/106
摘要： Acid sensitive polymeric compositions, and improved chemically amplified microlithographic resist compositions comprising the acid sensitive polymeric compositions, and methods for the preparation and use thereof are disclosed. The compositions comprise, in admixture, a polymeric binder, an acid labile moiety which provides selective aqueous base solubility upon cleavage, and a compound that generates acid upon exposure of the resist composition to imaging radiation. More particularly, the compositions have one or more acid labile ketal groups, which may be chemically linked to a polymeric resin or which may be incorporated into a separate component to form a dissolution inhibitor. Crosslinking of the polymer to produce a high molecular weight, nonpolar resin may also occur by ketal exchange. Upon exposure, molecular weight and polarity changes of the crosslinked resin produce high contrast during development. The compositions exhibit reduced sensitivity to environmental contaminants when compared to known acid amplified resist compositions, and may optionally be processed without a post exposure bake step. Such compositions are especially useful in the fabrication of integrated circuit devices by microlithographic techniques.
摘要翻译：公开了酸敏感聚合物组合物和包含酸敏聚合物组合物的改进的化学放大微光蚀刻剂组合物及其制备和使用方法。组合物包含聚合物粘合剂，其在裂解时提供选择性碱性溶解度的酸不稳定部分，以及当将抗蚀剂组合物暴露于成像辐射时产生酸的化合物。更具体地，组合物具有一个或多个酸不稳定的缩酮基团，其可以与聚合物树脂化学连接，或者可以并入到单独的组分中以形成溶解抑制剂。聚合物的交联以产生高分子量的非极性树脂也可以通过缩酮交换进行。暴露后，交联树脂的分子量和极性变化在显影过程中产生高对比度。当与已知的酸扩增抗蚀剂组合物相比时，该组合物对环境污染物的敏感性降低，并且可以任选地在没有后曝光烘烤步骤的情况下进行处理。这种组合物通过微光刻技术在集成电路器件的制造中特别有用。

2. 发明授权

US5716763A Liquid immersion heating process for substrate temperature uniformity 失效
标题翻译：液浸式加热工艺，使基板温度均匀
公开(公告)号：US5716763A
公开(公告)日：1998-02-10
申请号：US350444
申请日：1994-12-06
申请人： Douglas Earl Benoit , Harold George Linde , Denise Marie Puisto , Charles Arthur Whiting
发明人： Douglas Earl Benoit , Harold George Linde , Denise Marie Puisto , Charles Arthur Whiting
IPC分类号： G03F7/16 , G03F7/26
CPC分类号： G03F7/168
摘要： A temperature-sensitive film such as a resist is baked onto a semiconductor substrate such as a mask blank by immersion in a heated liquid. A barrier coating may optionally be applied to the substrate prior to immersion and later removed. The substrate is subsequently cooled by immersing the substrate in a cooling liquid or dissolving the heated liquid from the substrate with a rinsing liquid at a temperature sufficiently lower than that of the heated liquid. Temperature uniformity within .+-.0.2.degree. C. is thereby achieved across the regions of varying thickness in the silicon wafer and membrane. Where a resist has been deposited on the mask blank substrate, heating and cooling by immersion results in improved line size control after exposure and development down to 0.25 .mu.m.
摘要翻译：将诸如抗蚀剂的感光膜通过浸入加热的液体中而被烘烤到诸如掩模坯料的半导体衬底上。可以在浸渍之前可选地将阻挡涂层施加到基底上并随后去除。随后通过将衬底浸入冷却液体中或者将基底上加热的液体用足够低于被加热液体的温度的冲洗液体将基底溶解而冷却。因此，在硅晶片和膜中的不同厚度的区域上实现了+/- 0.2℃内的温度均匀性。当抗蚀剂沉积在掩模坯料基板上时，通过浸渍进行加热和冷却导致曝光和显影后的线尺寸控制得到改善至0.25μm。

3. 发明授权

US06518679B2 Capacitive alignment structure and method for chip stacking 失效
标题翻译：电容对准结构和芯片堆叠方法
公开(公告)号：US06518679B2
公开(公告)日：2003-02-11
申请号：US09738167
申请日：2000-12-15
申请人： Ning Lu , Wilbur David Pricer , Charles Arthur Whiting
发明人： Ning Lu , Wilbur David Pricer , Charles Arthur Whiting
IPC分类号： H01L23544
CPC分类号： H01L25/50 , H01L23/48 , H01L25/0657 , H01L2225/06513 , H01L2225/06531 , H01L2225/06593 , H01L2924/0002 , H01L2924/00
摘要： An alignment structure (14) and method for aligning a first circuit image region (18) of a microelectronic chip (10) with a second circuit region (20) of a wafer (12). The alignment structure comprises a plurality of passive coupling elements (22) attached to the chip and arranged in a linear array and further comprises a plurality of electrodes (24) attached to the wafer and arranged in a linear array. The electrodes are arranged into a set of first driven electrodes (46), a set of second driven electrodes (48) and a set of sensing electrodes (50). The first driven, second driven and sensing electrodes are arranged alternatingly with one another and may each include one or more plates (62). The first and second driven electrodes are driven, respectively, with sine wave signals 180 degrees out of phase with one another. When each passive coupling element is centered over a corresponding sensing electrode, the signals from all of the sensing electrodes are null, indicating that the first circuit image region is aligned with the second circuit image region in the alignment direction. In an alternative embodiment, individual electrodes are configurable into different size first driven, second driven and sensing electrodes to adjust the alignment resolution of the alignment structure.
摘要翻译：对准结构（14）和用于将微电子芯片（10）的第一电路图像区域（18）与晶片（12）的第二电路区域（20）对准的方法。对准结构包括多个被连接到芯片并被布置成线性阵列的无源耦合元件（22），并且还包括附接到晶片并以线性阵列布置的多个电极（24）。电极被布置成一组第一驱动电极（46），一组第二驱动电极（48）和一组感测电极（50）。第一驱动，第二驱动和感测电极彼此交替布置，并且可以各自包括一个或多个板（62）。第一驱动电极和第二驱动电极分别被驱动相互180度异相的正弦波信号。当每个无源耦合元件在对应的感测电极上居中时，来自所有感测电极的信号为零，表示第一电路图像区域与排列方向上的第二电路图像区域对齐。在替代实施例中，各个电极可配置成不同尺寸的第一驱动，第二驱动和感测电极，以调整对准结构的对准分辨率。

4. 发明授权

US06412666B1 Fluid container with a keying means to prevent improper fluid loading in a fluid delivery tool and a system including such fluid container and fluid delivery tool 失效
标题翻译：具有键控装置的流体容器，用于防止在流体输送工具和包括这种流体容器和流体输送工具的系统中的不适当流体负载
公开(公告)号：US06412666B1
公开(公告)日：2002-07-02
申请号：US09811846
申请日：2001-03-19
申请人： Dennis Pleegor Hogan , Christopher Edward Walsh , Charles Arthur Whiting
发明人： Dennis Pleegor Hogan , Christopher Edward Walsh , Charles Arthur Whiting
IPC分类号： B65D8854
CPC分类号： B67D7/344
摘要： A fluid delivery system that includes a fluid delivery tool having a connector element and a location for holding a fluid container. The fluid container location of the tool has a replaceable template with a first key element portion. The fluid delivery system also includes a fluid container having a connector portion for connecting the fluid container to the connector element of the fluid delivery tool so that the fluid in the fluid container may be delivered to the fluid delivery tool. The fluid container may also have a second key element portion distinct from its connector portion and configured to mate with the first key element portion of the tool template. Alternatively, the fluid container may have a body portion integral with and distinct from its connector portion, and a key element is provided on at least a portion of the fluid container body portion and configured to mate with the first key element portion of the tool template. In this configuration, the key element may be removable from or permanently attached to the body portion of the fluid container. The fluid delivery system ensures that only a fluid container key element capable of mating with the key element portion of the template presently located in the fluid delivery tool may be inserted in the container holding location of the fluid delivery tool.
摘要翻译：流体输送系统，其包括具有连接器元件的流体输送工具和用于保持流体容器的位置。工具的流体容器位置具有带有第一关键元件部分的可更换模板。流体输送系统还包括具有用于将流体容器连接到流体输送工具的连接器元件的连接器部分的流体容器，使得流体容器中的流体可被输送到流体输送工具。流体容器还可以具有与其连接器部分不同的第二键元件部分，并且被配置为与工具模板的第一键元件部分配合。或者，流体容器可以具有与其连接器部分一体且与其不同的主体部分，并且在流体容器主体部分的至少一部分上设置关键元件，并且构造成与工具模板的第一关键元件部分配合。在该构造中，关键元件可以从流体容器的主体部分移除或永久地附接到流体容器的主体部分。流体输送系统确保仅能够与目前位于流体输送工具中的模板的键元件部分配合的流体容器关键元件可以插入到流体输送工具的容器保持位置中。

5. 发明授权

US5783309A Recovery of an anodically bonded glass device from a substrate by use of a metal interlayer 失效
标题翻译：通过使用金属中间层从基板回收阳极粘合的玻璃器件
公开(公告)号：US5783309A
公开(公告)日：1998-07-21
申请号：US591253
申请日：1996-01-19
申请人： Thomas Benjamin Faure , Kurt Rudolf Kimmel , Wilbur David Pricer , Charles Arthur Whiting
发明人： Thomas Benjamin Faure , Kurt Rudolf Kimmel , Wilbur David Pricer , Charles Arthur Whiting
IPC分类号： G03F1/22 , G03F1/50 , G03F1/60 , B32B15/00
CPC分类号： G03F1/22 , G03F1/50 , G03F1/60
摘要： A structure and method for removing and recovering an anodically bonded glass device from a substrate using a metal interlayer interposed between the glass and the substrate is provided. As used in semiconductor mask fabrication, the structure comprises a silicon wafer substrate coated with a membrane on which a metal interlayer is disposed. The metal interlayer and a glass device are anodically bonded together. Recovery of the glass device is accomplished by chemically and mechanically removing the wafer and its membrane from the metal interlayer. The membrane is preferably removed using reactive ion etching to which the metal interlayer is resistant. The metal interlayer is then removed from the glass device using a highly corrosive chemical solution. The recovered glass device may then be reused.
摘要翻译：提供了一种使用夹在玻璃和基板之间的金属夹层从基板去除和回收阳极粘合玻璃器件的结构和方法。如在半导体掩模制造中使用的，该结构包括涂覆有膜的硅晶片衬底，金属中间层设置在膜上。将金属中间层和玻璃器件阳极结合在一起。玻璃器件的回收是通过化学和机械地从金属中间层除去晶片及其膜而实现的。优选使用金属中间层抵抗的反应离子蚀刻去除膜。然后使用高度腐蚀性的化学溶液从玻璃装置中除去金属中间层。然后可以重新使用回收的玻璃装置。

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