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1. 发明申请

US20060003240A1 Methods for adjusting light intensity for photolithography and related systems 审中-公开
标题翻译：调整光刻和相关系统光强度的方法
公开(公告)号：US20060003240A1
公开(公告)日：2006-01-05
申请号：US11153787
申请日：2005-06-15
申请人： Woo-Seok Shim , Dae-Youp Lee , Joon-Sung Kim , In-Sang Song , Yong-Jin Cho
发明人： Woo-Seok Shim , Dae-Youp Lee , Joon-Sung Kim , In-Sang Song , Yong-Jin Cho
IPC分类号： G03C5/00 , G03B27/00
CPC分类号： G03F7/203 , G03F7/70558 , G03F7/70625
摘要： Correcting light intensity for photolithography may include irradiating light having a first light intensity distribution through a photo mask having a mask pattern to a photosensitive layer on a wafer to form a first pattern corresponding to the mask pattern. A distribution of critical dimensions of the first pattern corresponding to the mask pattern may be determined, and a second light intensity distribution may be determined based on a relation between the first light intensity distribution and the distribution of critical dimensions of the first pattern. Then, light having the second light intensity distribution may be irradiated. Related systems are also discussed.
摘要翻译：用于光刻的校正光强度可以包括将具有第一光强度分布的光通过具有掩模图案的光掩模照射到晶片上的感光层，以形成对应于掩模图案的第一图案。可以确定与掩模图案对应的第一图案的临界尺寸的分布，并且可以基于第一光强度分布与第一图案的临界尺寸的分布之间的关系来确定第二光强度分布。然后，可以照射具有第二光强度分布的光。还讨论了相关系统。

2. 发明授权

US08426299B2 Method of manufacturing semiconductor device 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US08426299B2
公开(公告)日：2013-04-23
申请号：US13337748
申请日：2011-12-27
申请人： Joon-Sung Kim , Hye-Soo Shin , Mi-Youn Kim , Young-Soo Kim
发明人： Joon-Sung Kim , Hye-Soo Shin , Mi-Youn Kim , Young-Soo Kim
IPC分类号： H01L21/4763
CPC分类号： H01L21/0273 , H01L21/28282 , H01L21/31058 , H01L21/31144 , H01L21/32139 , H01L27/11575 , H01L27/11582
摘要： A method of fabricating a semiconductor device may include: alternatively stacking dielectric layers and conductive layers on a substrate to form a stack structure, forming a first photoresist pattern on the stack structure, forming a second photoresist pattern whose thickness is reduced as the second photoresist pattern extends from the center of the stack structure towards a periphery of the stacked structure by performing a heat treatment on the first photoresist pattern, etching the stack structure through the second photoresist pattern to form a slope profile on the stack structure whose thickness is reduced as the slope profile extends from the center of the stack structure towards a periphery of the stacked structure, and forming a step-type profile on the end part of the stack structure by selectively etching the dielectric layer.
摘要翻译：制造半导体器件的方法可以包括：交替地在衬底上堆叠电介质层和导电层以形成堆叠结构，在堆叠结构上形成第一光致抗蚀剂图案，形成厚度随着第二光致抗蚀剂图案而减小的第二光致抗蚀剂图案通过对第一光致抗蚀剂图案进行热处理，从堆叠结构的中心向着堆叠结构的周边延伸，通过第二光致抗蚀剂图案蚀刻堆叠结构，以在堆叠结构上形成斜面，其厚度减小为倾斜轮廓从堆叠结构的中心延伸到层叠结构的周边，并且通过选择性地蚀刻介电层而在堆叠结构的端部上形成阶梯型轮廓。

3. 发明授权

US08280204B2 Optical wiring board and manufacturing method thereof 失效
标题翻译：光接线板及其制造方法
公开(公告)号：US08280204B2
公开(公告)日：2012-10-02
申请号：US12760035
申请日：2010-04-14
申请人： Sang-Hoon Kim , Han-Seo Cho , Joon-Sung Kim , Jae-Hyun Jung
发明人： Sang-Hoon Kim , Han-Seo Cho , Joon-Sung Kim , Jae-Hyun Jung
IPC分类号： G02B6/12
CPC分类号： G02B6/4214 , B32B37/02 , B32B38/10 , B32B2038/0092 , B32B2457/08 , B32B2457/14 , G02B6/428 , G02B6/43 , Y10T156/1002
摘要： An optical wiring board and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, the method includes providing a base substrate having an optical waveguide layer with a mirror groove formed on one surface thereof and a first insulation layer stacked on one surface of the optical waveguide layer and having a through-hole connected with the mirror groove formed thereon, forming a metal mirror layer connected from the mirror groove to an inner wall of the through-hole and forming an electrode pad on a side of the other surface of the optical waveguide layer, in which the electrode pad is disposed in accordance with the position of the metal mirror layer.
摘要翻译：公开了一种光布线板及其制造方法。根据本发明的实施例，该方法包括提供一基底基板，该基底基板具有光波导层，该光波导层在其一个表面上形成有反射镜槽，第一绝缘层层叠在该光波导层的一个表面上，与形成在其上的反射镜槽连接的孔，形成从反射镜槽连接到通孔的内壁的金属镜层，并在光波导层的另一个表面的一侧形成电极焊盘，其中电极按照金属镜面层的位置设置衬垫。

4. 发明授权

US07697800B2 Method of manufacturing printed circuit board 失效
标题翻译：制造印刷电路板的方法
公开(公告)号：US07697800B2
公开(公告)日：2010-04-13
申请号：US12453616
申请日：2009-05-15
申请人： Han Seo Cho , Je-Gwang Yoo , Sang-Hoon Kim , Joon-Sung Kim
发明人： Han Seo Cho , Je-Gwang Yoo , Sang-Hoon Kim , Joon-Sung Kim
IPC分类号： G02B6/12 , G02B6/10 , H01L21/00
CPC分类号： G02B6/1221 , G02B6/136 , G02B6/28 , G02B6/4214 , H05K1/0274 , H05K3/20 , Y10T29/49155
摘要： A method of manufacturing a printed circuit board in which optical waveguides are formed for transmitting optical signals together with electrical signals, which includes a cladding, a core embedded in the cladding that transmits optical signals, and a wiring pattern embedded in the cladding that transmits electrical signals, can offer improved optical connection efficiency and reduced material costs by enabling the cladding to act as an insulation layer and embedding the wiring pattern in the cladding.
摘要翻译：一种制造印刷电路板的方法，其中形成光波导以及电信号一起传输光信号，电信号包括包层，嵌入在传播光信号的包层中的芯，以及嵌入在包层中的布线图案，其传输电信号，可以通过使包层充当绝缘层并且将布线图案嵌入包层中来提供改善的光学连接效率和降低的材料成本。

5. 发明授权

US07546002B2 Printed circuit board and manufacturing method thereof 失效
标题翻译：印刷电路板及其制造方法
公开(公告)号：US07546002B2
公开(公告)日：2009-06-09
申请号：US11889477
申请日：2007-08-14
申请人： Han Seo Cho , Je-Gwang Yoo , Sang-Hoon Kim , Joon-Sung Kim
发明人： Han Seo Cho , Je-Gwang Yoo , Sang-Hoon Kim , Joon-Sung Kim
IPC分类号： G02B6/12 , G02B6/10
CPC分类号： G02B6/1221 , G02B6/136 , G02B6/28 , G02B6/4214 , H05K1/0274 , H05K3/20 , Y10T29/49155
摘要： A printed circuit board and a method of manufacturing a printed circuit board are disclosed. A printed circuit board in which optical waveguides are formed for transmitting optical signals together with electrical signals, which includes a cladding, a core embedded in the cladding that transmits optical signals, and a wiring pattern embedded in the cladding that transmits electrical signals, can offer improved optical connection efficiency and reduced material costs by enabling the cladding to act as an insulation layer and embedding the wiring pattern in the cladding.
摘要翻译：公开了印刷电路板和制造印刷电路板的方法。一种印刷电路板，其中形成光波导以与电信号一起传输光信号，电信号包括包层，嵌入在传播光信号的包层中的芯，以及嵌入在传输电信号的包层中的布线图案可以提供通过使包层作为绝缘层并将布线图案嵌入包层中，可以提高光学连接效率并降低材料成本。

6. 发明申请

US20080044129A1 Printed circuit board and manufacturing method thereof 失效
标题翻译：印刷电路板及其制造方法
公开(公告)号：US20080044129A1
公开(公告)日：2008-02-21
申请号：US11889477
申请日：2007-08-14
申请人： Han Seo Cho , Je-Gwang Yoo , Sang-Hoon Kim , Joon-Sung Kim
发明人： Han Seo Cho , Je-Gwang Yoo , Sang-Hoon Kim , Joon-Sung Kim
IPC分类号： G02B6/12 , H05K3/00
CPC分类号： G02B6/1221 , G02B6/136 , G02B6/28 , G02B6/4214 , H05K1/0274 , H05K3/20 , Y10T29/49155
摘要： A printed circuit board and a method of manufacturing a printed circuit board are disclosed. A printed circuit board in which optical waveguides are formed for transmitting optical signals together with electrical signals, which includes a cladding, a core embedded in the cladding that transmits optical signals, and a wiring pattern embedded in the cladding that transmits electrical signals, can offer improved optical connection efficiency and reduced material costs by enabling the cladding to act as an insulation layer and embedding the wiring pattern in the cladding.
摘要翻译：公开了印刷电路板和制造印刷电路板的方法。一种印刷电路板，其中形成光波导以与电信号一起传输光信号，电信号包括包层，嵌入在传播光信号的包层中的芯，以及嵌入在传输电信号的包层中的布线图案可以提供通过使包层作为绝缘层并将布线图案嵌入包层中，可以提高光学连接效率并降低材料成本。

7. 发明申请

US20070296935A1 Substrate having alignment marks and method of obtaining alignment information using the same 失效
标题翻译：具有对准标记的基板和使用其的获取对准信息的方法
公开(公告)号：US20070296935A1
公开(公告)日：2007-12-27
申请号：US11723362
申请日：2007-03-19
申请人： Joon-Sung Kim , Ji-Yong You
发明人： Joon-Sung Kim , Ji-Yong You
IPC分类号： G03B27/52 , G01B11/00
CPC分类号： G03F9/7084 , G03F9/7076 , G03F9/708
摘要： The alignment marks formed in a scribe line of a semiconductor substrate include at least one main mark, a first sub-mark and second sub-marks. The first sub-mark is formed at a central portion of the main mark. The second sub-marks are disposed symmetrically with respect to the first sub-mark and are used for detecting asymmetry of the main mark by measuring distances between respective side edges of the main mark and the first sub-mark, and by measuring respective side edges between the main mark and each of the second sub-marks. Alternatively, the alignment marks include main outer and inner marks and a sub-mark disposed in between the main outer and inner marks. In this case, the sub-mark is used for detecting asymmetry of the main mark by measuring distances between respective side edges of the main outer mark and the sub-mark, and by measuring respective side edges between the main inner mark and the sub-mark. Thus, accurate alignment information can be obtained regardless of whether the main mark was inadvertently formed as asymmetrical.
摘要翻译：形成在半导体衬底的划线中的对准标记包括至少一个主标记，第一子标记和第二子标记。第一子标记形成在主标记的中心部分。第二子标记相对于第一子标记对称设置，并且用于通过测量主标记的各个侧边缘与第一子标记之间的距离来检测主标记的不对称性，并且通过测量相应的侧边缘主标记和每个第二个子标记之间。或者，对准标记包括主外标和内标，以及设置在主外标和内标之间的子标记。在这种情况下，子标记用于通过测量主外标号和子标记的各侧边缘之间的距离来检测主标记的不对称性，并且通过测量主内标和子标记之间的相应侧边缘，标记。因此，无论主标记是否被无意地形成为不对称，都可以获得准确的对准信息。

8. 发明授权

US08457450B2 Printed circuit board and manufacturing method thereof 失效
公开(公告)号：US08457450B2
公开(公告)日：2013-06-04
申请号：US12314449
申请日：2008-12-10
申请人： Sang-Hoon Kim , Je-Gwang Yoo , Joon-Sung Kim , Han Seo Cho
发明人： Sang-Hoon Kim , Je-Gwang Yoo , Joon-Sung Kim , Han Seo Cho
IPC分类号： G02B6/12
CPC分类号： G02B6/43 , G02B6/4214 , H05K1/0274 , H05K3/4691 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165
摘要： A printed circuit board is disclosed. A printed circuit board, which includes a first board part, a flexible board part which has one side coupled with the first board part and which includes an electrical wiring layer and an optical waveguide to transmit both electrical signals and optical signals, and a second board part coupled with the other side of the flexible board part, where the electrical wiring layer and the optical waveguide are disposed with a gap in-between, can provide greater bendability and reliability, by having the optical waveguide and electrical wiring layer separated with a gap in-between at the flexible portion of the board, and the optical waveguide can be manufactured with greater precision for even higher reliability, by having the optical waveguide manufactured separately and then inserted during the manufacturing process of the board.

9. 发明申请

US20090133444A1 Method of manufacturing optical board 审中-公开
标题翻译：制造光板的方法
公开(公告)号：US20090133444A1
公开(公告)日：2009-05-28
申请号：US12149517
申请日：2008-05-02
申请人： Sang-Hoon Kim , Je-Gwang Yoo , Han-Seo Cho , Joon-Sung Kim
发明人： Sang-Hoon Kim , Je-Gwang Yoo , Han-Seo Cho , Joon-Sung Kim
IPC分类号： C03B37/022
CPC分类号： G02B6/136 , G02B6/4214 , G02B6/43 , H05K1/0274 , H05K3/4611
摘要： A method of manufacturing an optical board is disclosed. The method of manufacturing an optical board may include stacking an optical waveguide core layer over a first optical waveguide cladding layer, forming an inclined surface by diffracting a laser with a mask to remove a portion of the optical waveguide core layer, and stacking a reflective layer over the inclined surface.
摘要翻译：公开了一种制造光学板的方法。制造光学板的方法可以包括在第一光波导包层上层叠光波导芯层，通过用掩模衍射激光来形成倾斜表面以去除光波导芯层的一部分，并且将反射层在倾斜的表面上。

10. 发明申请

US20090130390A1 Optical wiring board and manufacturing method thereof 审中-公开
标题翻译：光接线板及其制造方法
公开(公告)号：US20090130390A1
公开(公告)日：2009-05-21
申请号：US12149952
申请日：2008-05-09
申请人： Joon-Sung Kim , Je-Gwang Yoo , Chang-Sup Ryu , Han-Seo Cho , Sang-Hoon Kim
发明人： Joon-Sung Kim , Je-Gwang Yoo , Chang-Sup Ryu , Han-Seo Cho , Sang-Hoon Kim
IPC分类号： B32B3/00 , B29D11/00
CPC分类号： B29D11/00663 , B29D11/00807 , G02B6/136 , H05K1/0274 , Y10T428/24612
摘要： An optical wiring board and a method of manufacturing the optical wiring board are disclosed. The method of manufacturing an optical wiring board may include forming a lower cladding over an insulating layer; forming a side cladding, which has an indentation corresponding with the core, over the lower cladding; filling a core material in the indentation; and forming an upper cladding such that the core material is covered. Embodiments of the invention can be utilized to readily control the thickness of the core.
摘要翻译：公开了一种光布线板及其制造方法。制造光布线板的方法可以包括在绝缘层上形成下包层; 在所述下包层上形成具有与所述芯对应的凹陷的侧包层; 填充压痕中的芯材; 并且形成上覆层，使得芯材被覆盖。本发明的实施例可用于容易地控制芯的厚度。

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