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1. 发明申请

US20120097415A1 HOUSING FOR AN INFRARED RADIATION MICRO DEVICE AND METHOD FOR FABRICATING SUCH HOUSING 有权
标题翻译：用于红外辐射微型器件的住房和用于制造这种住房的方法
公开(公告)号：US20120097415A1
公开(公告)日：2012-04-26
申请号：US13379263
申请日：2010-06-21
申请人： Wolfgang Reinert , Jochen Quenzer , Sebastien Tinnes , Cécile Roman
发明人： Wolfgang Reinert , Jochen Quenzer , Sebastien Tinnes , Cécile Roman
IPC分类号： H05K5/00 , C25D5/02 , H05K13/00
CPC分类号： H01L27/14618 , G01J5/045 , G01J5/0875 , H01L27/14649 , H01L27/14683 , H01L2224/16 , H01L2924/01019 , H01L2924/01057 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/01327 , H01L2924/10157 , H01L2924/10158 , H01L2924/1461 , H01L2924/00
摘要： Infrared radiation micro device, cover for such a device and method for its fabrication, the device comprising a substrate and a cover and an infrared radiation detecting, emitting or reflecting infrared micro unit, the infrared micro unit being arranged in a cavity defined between the substrate and the cover, the cover comprising an antireflective surface texture to enhance the transmissibility of infrared radiation, wherein a distance frame formed in an additive process on the substrate side of the cover and/or the cover side of the substrate is arranged between substrate and cover.
摘要翻译：红外辐射微器件，用于这种器件的盖子及其制造方法，该器件包括衬底和盖子以及红外辐射检测，发射或反射红外微单元，红外微单元布置在限定在衬底之间的空腔中所述盖子包括防反射表面纹理以增强红外线辐射的透射率，其中在衬底的衬底侧和/或衬底侧上的添加工艺中形成的距离框架布置在衬底和覆盖物之间。

2. 发明授权

US10002896B2 Housing for an infrared radiation micro device and method for fabricating such housing 有权
公开(公告)号：US10002896B2
公开(公告)日：2018-06-19
申请号：US13379263
申请日：2010-06-21
申请人： Wolfgang Reinert , Jochen Quenzer , Sebastien Tinnes , Cécile Roman
发明人： Wolfgang Reinert , Jochen Quenzer , Sebastien Tinnes , Cécile Roman
IPC分类号： H05K5/00 , C25D5/02 , H05K13/00 , H01L27/146 , G01J5/04 , G01J5/08
CPC分类号： H01L27/14618 , G01J5/045 , G01J5/0875 , H01L27/14649 , H01L27/14683 , H01L2224/16 , H01L2924/01019 , H01L2924/01057 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/01327 , H01L2924/10157 , H01L2924/10158 , H01L2924/1461 , H01L2924/00
摘要： Infrared radiation micro device, cover for such a device and method for its fabrication, the device comprising a substrate and a cover and an infrared radiation detecting, emitting or reflecting infrared micro unit, the infrared micro unit being arranged in a cavity defined between the substrate and the cover, the cover comprising an antireflective surface texture to enhance the transmissibility of infrared radiation, wherein a distance frame formed in an additive process on the substrate side of the cover and/or the cover side of the substrate is arranged between substrate and cover.

3. 发明授权

US09637377B2 Method for forming a micro-surface structure and for producing a micro-electromechanical component 有权
公开(公告)号：US09637377B2
公开(公告)日：2017-05-02
申请号：US13129601
申请日：2009-11-17
申请人： Wolfgang Reinert , Jochen Quenzer , Kai Gruber , Stephan Warnat
发明人： Wolfgang Reinert , Jochen Quenzer , Kai Gruber , Stephan Warnat
IPC分类号： B05D5/12 , B81C1/00 , B81B7/00 , G01J5/04 , H01L23/26 , B32B3/30
CPC分类号： B81C1/00206 , B32B3/30 , B81B7/0038 , G01J5/045 , H01L23/26 , H01L2924/0002 , Y10T29/4913 , Y10T428/24174 , Y10T428/24612 , H01L2924/00
摘要： The present invention relates to a method for forming a micro-surface structure on a substrate, in particular for producing a micro-electromechanical component, a micro-surface structure of this type, a method for producing a micro-electromechanical component having a micro-surface structure of this type and such a micro-electromechanical component. The invention is particularly relevant for components of microsystem technology (MST, micro-electromechanical systems MEMS) and the construction and connection technology for hermetically housing micro components, preferably using getter materials.

4. 发明申请

US20110287214A1 METHOD FOR FORMING A MICRO-SURFACE STRUCTURE AND FOR PRODUCING A MICRO-ELECTROMECHANICAL COMPONENT, MICRO-SURFACE STRUCTURE AND MICRO-ELECTROMECHANICAL COMPONENT HAVING SAID MICRO-SURFACE STRUCTURE 有权
标题翻译：形成微表面结构和生产微机电组件的方法，微表面结构和具有微观表面结构的微机电组件
公开(公告)号：US20110287214A1
公开(公告)日：2011-11-24
申请号：US13129601
申请日：2009-11-17
申请人： Wolfgang Reinert , Jochen Quenzer , Kai Gruber , Stephan Warnat
发明人： Wolfgang Reinert , Jochen Quenzer , Kai Gruber , Stephan Warnat
IPC分类号： B32B7/00 , B32B3/30 , H05K3/30
CPC分类号： B81C1/00206 , B32B3/30 , B81B7/0038 , G01J5/045 , H01L23/26 , H01L2924/0002 , Y10T29/4913 , Y10T428/24174 , Y10T428/24612 , H01L2924/00
摘要： The present invention relates to a method for forming a micro-surface structure on a substrate, in particular for producing a micro-electromechanical component, a micro-surface structure of this type, a method for producing a micro-electromechanical component having a micro-surface structure of this type and such a micro-electromechanical component. The invention is particularly relevant for components of microsystem technology (MST, micro-electromechanical systems MEMS) and the construction and connection technology for hermetically housing micro components, preferably using getter materials.
摘要翻译：本发明涉及一种在基板上形成微表面结构的方法，特别是用于制造微机电元件的微型表面结构，这种微型表面结构的制造方法，这种类型的表面结构和这种微机电部件。本发明特别涉及微系统技术（MST，微机电系统MEMS）的组件以及用于气密地容纳微组件的构造和连接技术，优选使用吸气材料。

5. 发明授权

US08129838B2 Housed active microstructures with direct contacting to a substrate 有权
标题翻译：与底物直接接触的有活性微结构
公开(公告)号：US08129838B2
公开(公告)日：2012-03-06
申请号：US12153174
申请日：2008-05-14
申请人： Wolfgang Reinert
发明人： Wolfgang Reinert
IPC分类号： H01L23/10
CPC分类号： B81B7/007 , B81C2203/0118 , B81C2203/032 , B81C2203/035 , G01P1/023 , H01L24/16 , H01L24/48 , H01L25/165 , H01L2224/0401 , H01L2224/0557 , H01L2224/13025 , H01L2224/48 , H01L2924/00014 , H01L2924/0002 , H01L2924/0102 , H01L2924/01046 , H01L2924/01068 , H01L2924/01077 , H01L2924/01079 , H01L2924/01322 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/1433 , H01L2924/1461 , H01L2924/16235 , H01L2924/3011 , H01L2924/00 , H01L2224/05552 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A microstructured component with microsensors or other active microcomponent is provided. The microstructured component includes a substrate and at least one housing arranged on the substrate with one or more active microstructures situated on it.
摘要翻译：提供了具有微传感器或其它有源微元件的微结构元件。微结构组件包括衬底和布置在衬底上的至少一个壳体，其上设置有一个或多个活性微结构。

6. 发明授权

US07286294B2 Beam-shaping element for optical radiation and a method for producing said element 有权
标题翻译：用于光辐射的光束成形元件和用于制造所述元件的方法
公开(公告)号：US07286294B2
公开(公告)日：2007-10-23
申请号：US10484214
申请日：2002-07-17
申请人： Hans-Joachim Quenzer , Wolfgang Reinert
发明人： Hans-Joachim Quenzer , Wolfgang Reinert
IPC分类号： G02B1/10 , F21V9/04
CPC分类号： G02B27/0927 , A61F9/00814 , G02B27/09 , G02B27/0938
摘要： A beam-shaping element comprises a carrier substrate (1) bearing a thin-layer metallization which is structured for shaping the beam of optical radiation. The thin-layer metallization includes at least two metallic layers (2, 3), which, upon impingement of the optical radiation (4), react with each other accompanied by a permanent change in color in response to a certain intensity and/or an irradiation period of the optical radiation (4).
摘要翻译：光束成形元件包括承载基板（1），该载体基板（1）承载用于使光辐射束成形的薄层金属化。薄层金属化包括至少两个金属层（2,3），其在光辐射（4）的撞击时响应于一定的强度而伴随着颜色的永久变化而相互反应和/或照射周期的光辐射（4）。

7. 发明授权

US09761740B2 Electromagnetic radiation micro device, wafer element and method for manufacturing such a micro device 有权
公开(公告)号：US09761740B2
公开(公告)日：2017-09-12
申请号：US14384318
申请日：2012-03-23
申请人： Wolfgang Reinert
发明人： Wolfgang Reinert
IPC分类号： G01J5/08 , H01L31/0216 , G01J5/04 , G01J5/02 , G01J5/20 , G02B1/115 , H01L31/18
CPC分类号： H01L31/02165 , G01J5/0215 , G01J5/0235 , G01J5/024 , G01J5/045 , G01J5/046 , G01J5/0803 , G01J5/0806 , G01J5/0862 , G01J5/0875 , G01J5/20 , G02B1/115 , H01L31/18 , H01L2924/16235
摘要： The invention refers to an electromagnetic radiation sensor micro device for detecting electromagnetic radiation, which device comprises a substrate and a cover at least in part consisting of an electromagnetic radiation transparent material, and comprising a reflection reducing coating and providing a hermetic sealed cavity and an electromagnetic radiation detecting unit arranged within the cavity. The reflection reducing coating is arranged in form of a multi-layer thin film stack, which comprises a first layer and a second layer arranged one upon the other. The first layer has a first refractive index and the second layer has a second refractive index different from the one of said first layer. First and second layer are of such layer thickness that for a certain wavelength there is destructive interference. The invention also refers to a wafer element as well as method for manufacturing such a device.

8. 发明授权

US07739900B2 Method for testing the leakage rate of vacuum encapsulated devices 失效
标题翻译：用于测试真空封装装置的泄漏率的方法
公开(公告)号：US07739900B2
公开(公告)日：2010-06-22
申请号：US11792074
申请日：2005-11-10
申请人： Wolfgang Reinert , Dirk Kaehler , Peter Merz
发明人： Wolfgang Reinert , Dirk Kaehler , Peter Merz
IPC分类号： G01M3/02
CPC分类号： G01M3/329 , G01M3/186 , G01M3/226
摘要： The present invention is directed to a method for testing the leakage rate of an encapsulated device comprising the step: bombing the device with a neon and/or argon atmosphere using a bombing pressure of at least more than environmental pressure and measuring the quality factor before and after bombing. Preferably, the bombing time is about 10 to 100 hours, and the bombing pressure is 1.5 to 100 bar, more preferably 1.5 to 5 bar and most preferably about 4 bar. With this test, the leakage rate of fine leaks of the device may be determined.
摘要翻译：本发明涉及一种用于测试封装装置的泄漏率的方法，包括以下步骤：使用至少大于环境压力的轰炸压力，用氖气和/或氩气气氛轰炸该装置，并测量先前的质量因子轰炸后优选地，轰炸时间为约10至100小时，轰炸压力为1.5至100巴，更优选为1.5至5巴，最优选为约4巴。通过该测试，可以确定装置的微小泄漏的泄漏率。

9. 发明授权

US08546928B2 Micromechanical housing comprising at least two cavities having different internal pressure and/or different gas compositions and method for the production thereof 有权
标题翻译：微机械壳体包括具有不同内部压力和/或不同气体组成的至少两个空腔及其制造方法
公开(公告)号：US08546928B2
公开(公告)日：2013-10-01
申请号：US12296189
申请日：2007-04-04
申请人： Peter Merz , Wolfgang Reinert , Marten Oldsen , Oliver Schwarzelbach
发明人： Peter Merz , Wolfgang Reinert , Marten Oldsen , Oliver Schwarzelbach
IPC分类号： H01L23/20 , H01L27/14
CPC分类号： B81B7/0038 , B81B7/02 , B81C1/00285
摘要： The present application relates to a multiple component which is to be subsequently individualized by forming components containing active structures, in addition to a corresponding component which can be used in microsystem technology systems. The multiple component and/or component comprises a flat substrate and also a flat cap structure which are bound to each other such that they surround at least one first and one second cavity per component, which are sealed against each other and towards the outside. The first of the two cavities is provided with getter material and due to the getter material has a different internal pressure and/or a different gas composition than the second cavity. The present application also relates to a method for producing the type of component and/or components for which gas mixtures of various types of gas have a different absorption ratio in relation to the getter material.
摘要翻译：本申请涉及除了可用于微系统技术系统的相应组件之外，通过形成包含活性结构的组分，随后将其个性化的多组分。多个部件和/或部件包括平坦的基板以及平的盖结构，它们彼此结合，使得它们围绕彼此密封并朝向外侧的每个部件的至少一个第一和第二腔。两个空腔中的第一个具有吸气材料，并且由于吸气材料具有与第二腔体不同的内部压力和/或不同的气体组成。本申请还涉及一种用于生产各种类型气体的气体混合物相对于吸气剂材料具有不同吸收比的组分和/或组分的类型的方法。

10. 发明申请

US20080141759A1 Method for Testing the Leakage Rate of Vacuum Capsulated Devices 失效
标题翻译：真空包装设备泄漏率测试方法
公开(公告)号：US20080141759A1
公开(公告)日：2008-06-19
申请号：US11792074
申请日：2005-11-10
申请人： Wolfgang Reinert , Dirk Kaehler , Peter Merz
发明人： Wolfgang Reinert , Dirk Kaehler , Peter Merz
IPC分类号： G01M3/02
CPC分类号： G01M3/329 , G01M3/186 , G01M3/226
摘要： The present invention is directed to a method for testing the leakage rate of an encapsulated device comprising the step: bombing the device with a Neon and/or Argon atmosphere using a bombing pressure of at least more than environmental pressure and measuring the quality factor before and after bombing. Preferably, the bombing time is about 10 to 100 hours, and the bombing pressure is 1.5 to 100 bar, more preferably 1.5 to 5 bar and most preferably about 4 bar. With this test, the leakage rate of fine leaks of the device may be determined. This test is helpful in determining statistical surface contaminations or defects caused by wafer processing that affect the seal integrity just enough to cause shorter lifetimes. Further, dicing, die assembly and transfer molding may also introduce physical defects which may be detected with the present method. Finally, the inventive test method may be useful for process optimization: Hermeticity tests are a great help to optimize sealing processes.
摘要翻译：本发明涉及一种用于测试包封装置的泄漏率的方法，包括以下步骤：使用至少大于环境压力的轰炸压力，用氖气和/或氩气气氛轰炸该装置，并测量先前的质量因子，轰炸后优选地，轰炸时间为约10至100小时，轰炸压力为1.5至100巴，更优选为1.5至5巴，最优选为约4巴。通过该测试，可以确定装置的微小泄漏的泄漏率。该测试有助于确定影响密封完整性的晶片处理造成的统计表面污染或缺陷，足以导致更短的寿命。此外，切割，模具组装和传递模塑也可能引入可用本方法检测的物理缺陷。最后，本发明的测试方法可能对于工艺优化是有用的：密封性测试对于优化密封过程是非常有帮助的。

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