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    • 6. 发明申请
    • Direct-Manufactured Duct Interconnects
    • 直接制造的管道互连
    • US20090284010A1
    • 2009-11-19
    • US12537142
    • 2009-08-06
    • Chris HuskampTracy L. Bagwill
    • Chris HuskampTracy L. Bagwill
    • F16L21/00
    • B28B1/00B22F3/1055B22F5/106B22F7/062B28B1/001B29C64/00B33Y70/00B33Y80/00Y02P10/295
    • A method for forming a duct interconnect generally includes providing a digital model of a first duct structure and a second duct structure, the first duct structure including a first duct section having a passage for conveying a substance and an interconnect component moveably and captively coupled to the duct section. The second duct structure includes a second duct structure and a second interconnect component. The process includes forming, via a direct manufacturing procedure (e.g., stereolithography), a physical model of the first duct and second structures in accordance with the digital models, wherein the interconnect component has a locked and unlocked state, and wherein the unlocked state corresponds to a predetermined compressive force between the first duct structure and a second duct structure.
    • 用于形成管道互连的方法通常包括提供第一管道结构和第二管道结构的数字模型,所述第一管道结构包括第一管道段,其具有用于传送物质的通道和互连部件, 管段。 第二管道结构包括第二管道结构和第二互连部件。 该过程包括通过直接制造程序(例如,立体光刻)形成根据数字模型的第一管道和第二结构的物理模型,其中互连部件具有锁定和解锁状态,并且其中解锁状态对应于 到第一管道结构和第二管道结构之间的预定压缩力。
    • 8. 发明申请
    • DIRECT-MANUFACTURED DUCT INTERCONNECTS
    • 直接制造的导管互连
    • US20070278794A1
    • 2007-12-06
    • US11422052
    • 2006-06-02
    • Chris HuskampTracy L. Bagwill
    • Chris HuskampTracy L. Bagwill
    • F16L21/00
    • B28B1/00B22F3/1055B22F5/106B22F7/062B28B1/001B29C64/00B33Y70/00B33Y80/00Y02P10/295
    • A method for forming a duct interconnect generally includes providing a digital model of a first duct structure and a second duct structure, the first duct structure including a first duct section having a passage for conveying a substance and an interconnect component moveably and captively coupled to the duct section. The second duct structure includes a second duct structure and a second interconnect component. The process includes forming, via a direct manufacturing procedure (e.g., stereolithography), a physical model of the first duct and second structures in accordance with the digital models, wherein the interconnect component has a locked and unlocked state, and wherein the unlocked state corresponds to a predetermined compressive force between the first duct structure and a second duct structure.
    • 用于形成管道互连的方法通常包括提供第一管道结构和第二管道结构的数字模型,所述第一管道结构包括第一管道段,其具有用于传送物质的通道和互连部件, 管段。 第二管道结构包括第二管道结构和第二互连部件。 该过程包括通过直接制造程序(例如,立体光刻)形成根据数字模型的第一管道和第二结构的物理模型,其中互连部件具有锁定和解锁状态,并且其中解锁状态对应于 到第一管道结构和第二管道结构之间的预定压缩力。
    • 9. 发明授权
    • Direct-manufactured duct interconnects
    • 直接制造的管道互连
    • US07623940B2
    • 2009-11-24
    • US11422052
    • 2006-06-02
    • Chris HuskampTracy L. Bagwill
    • Chris HuskampTracy L. Bagwill
    • G06F19/00G06F17/50F16L9/18F16L21/02F16L23/00
    • B28B1/00B22F3/1055B22F5/106B22F7/062B28B1/001B29C64/00B33Y70/00B33Y80/00Y02P10/295
    • A method for forming a duct interconnect generally includes providing a digital model of a first duct structure and a second duct structure, the first duct structure including a first duct section having a passage for conveying a substance and an interconnect component moveably and captively coupled to the duct section. The second duct structure includes a second duct structure and a second interconnect component. The process includes forming, via a direct manufacturing procedure (e.g., stereolithography), a physical model of the first duct and second structures in accordance with the digital models, wherein the interconnect component has a locked and unlocked state, and wherein the unlocked state corresponds to a predetermined compressive force between the first duct structure and a second duct structure.
    • 用于形成管道互连的方法通常包括提供第一管道结构和第二管道结构的数字模型,所述第一管道结构包括第一管道段,其具有用于传送物质的通道和互连部件, 管段。 第二管道结构包括第二管道结构和第二互连部件。 该过程包括通过直接制造程序(例如,立体光刻)形成根据数字模型的第一管道和第二结构的物理模型,其中互连部件具有锁定和解锁状态,并且其中解锁状态对应于 到第一管道结构和第二管道结构之间的预定压缩力。