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1. 发明授权

US07316965B2 Substrate contact for a capped MEMS and method of making the substrate contact at the wafer level 有权
标题翻译：用于封装的MEMS的衬底接触和在晶片级使衬底接触的方法
公开(公告)号：US07316965B2
公开(公告)日：2008-01-08
申请号：US11158793
申请日：2005-06-21
申请人： Stephen R. Hooper , Hemant D. Desai , William G. McDonald , Arvind S. Salian
发明人： Stephen R. Hooper , Hemant D. Desai , William G. McDonald , Arvind S. Salian
IPC分类号： H01L21/00
CPC分类号： B81B3/0086 , B81B2201/0235 , B81B2207/07 , B81B2207/098 , B81C2203/0118 , G01P15/0802 , G01P15/125 , G01P2015/0814
摘要： A MEMS device (100) is provided that includes a handle layer (108) having a sidewall (138), a cap (132) overlying said handle layer (108), said cap (132) having a sidewall (138), and a conductive material (136) disposed on at least a portion of said sidewall of said cap (138) and said sidewall of said handle layer (138) to thereby electrically couple said handle layer (108) to said cap (132). A wafer-level method for manufacturing the MEMS device from a substrate (300) comprising a handle layer (108) and a cap (132) overlying the handle layer (108) is also provided. The method includes making a first cut through the cap (132) and at least a portion of the substrate (300) to form a first sidewall (138), and depositing a conductive material (136) onto the first sidewall (138) to electrically couple the cap (132) to the substrate (300).
摘要翻译：提供了一种MEMS器件（100），其包括具有侧壁（138）的手柄层（108），覆盖所述手柄层（108）的盖（132），所述盖（132）具有侧壁（138）导电材料（136），设置在所述盖子（138）的所述侧壁和所述手柄层（138）的所述侧壁的至少一部分上，从而将所述手柄层（108）电耦合到所述盖子（132）。还提供了用于从包括手柄层（108）和覆盖在手柄层（108）上的盖子（132）的衬底（300）制造MEMS器件的晶片级方法。该方法包括通过帽（132）和基底（300）的至少一部分进行第一次切割以形成第一侧壁（138），以及将导电材料（136）沉积到第一侧壁（138）上以电将盖（132）耦合到基板（300）。

2. 发明授权

US07109055B2 Methods and apparatus having wafer level chip scale package for sensing elements 有权
标题翻译：具有用于感测元件的晶片级芯片级封装的方法和装置
公开(公告)号：US07109055B2
公开(公告)日：2006-09-19
申请号：US11039688
申请日：2005-01-20
申请人： William G. McDonald , Stephen R. Hooper , Arvind S. Salian
发明人： William G. McDonald , Stephen R. Hooper , Arvind S. Salian
IPC分类号： H01L21/00
CPC分类号： B81C1/00309 , B81C2201/053
摘要： Methods are provided for manufacturing a sensor. The method comprises depositing a sacrificial material at a first predetermined thickness onto a wafer having at least one sense element mounted thereon, the sacrificial material deposited at least partially onto the at least one sense element, forming an encapsulating layer at a second predetermined thickness less than the first predetermined thickness over the wafer and around the deposited sacrificial material, and removing the sacrificial material. Apparatus for a sensor manufactured by the aforementioned method are also provided.
摘要翻译：提供了制造传感器的方法。该方法包括将第一预定厚度的牺牲材料沉积到具有安装在其上的至少一个感测元件的晶片上，所述牺牲材料至少部分地沉积在所述至少一个感测元件上，形成第二预定厚度的封装层，在晶片上方并围绕沉积的牺牲材料的第一预定厚度，以及去除牺牲材料。还提供了通过上述方法制造的传感器的装置。

3. 发明授权

US08686550B2 Method and apparatus for high pressure sensor device 有权
标题翻译：高压传感器装置的方法和装置
公开(公告)号：US08686550B2
公开(公告)日：2014-04-01
申请号：US13371635
申请日：2012-02-13
申请人： William G. McDonald , Alexander M. Arayata , Philip H. Bowles , Stephen R. Hooper
发明人： William G. McDonald , Alexander M. Arayata , Philip H. Bowles , Stephen R. Hooper
IPC分类号： H01L23/02
CPC分类号： H01L23/3157 , B60C23/0433 , G01L19/0069 , G01L19/147 , H01L23/49575 , H01L24/32 , H01L24/48 , H01L2224/2919 , H01L2224/32145 , H01L2224/32245 , H01L2224/48091 , H01L2224/48145 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/1461 , H01L2924/1815 , H01L2924/00 , H01L2224/45099 , H01L2924/00012
摘要： A pressure sensor package is provided that reduces the occurrence of micro gaps between molding material and metal contacts that can store high-pressure air. The present invention provides this capability by reducing or eliminating interfaces between package molding material and metal contacts. In one embodiment, a control die is electrically coupled to a lead frame and then encapsulated in molding material, using a technique that forms a cavity over a portion of the control die. The cavity exposes contacts on the free surface of the control die that can be electrically coupled to a pressure sensor device using, for example, wire bonding techniques. In another embodiment, a region of a substrate can be encapsulated in molding material, using a technique that forms a cavity over a sub-portion of the substrate that includes contacts. A pressure sensor device can be electrically coupled to the exposed contacts.
摘要翻译：提供了压力传感器封装，其减少了可存储高压空气的成型材料和金属触点之间的微小间隙的发生。本发明通过减少或消除封装模制材料和金属触点之间的界面来提供这种能力。在一个实施例中，使用在控制管芯的一部分上形成空腔的技术将控制管芯电耦合到引线框架，然后封装在成型材料中。空腔使控制管芯的自由表面上的触点露出，该触点可以使用例如引线接合技术电耦合到压力传感器装置。在另一个实施例中，可以使用在包括触点的衬底的子部分上形成空腔的技术将衬底的区域封装在模制材料中。压力传感器装置可以电连接到暴露的触点。

4. 发明申请

US20130207207A1 METHOD AND APPARATUS FOR HIGH PRESSURE SENSOR DEVICE 有权
标题翻译：高压传感器装置的方法和装置
公开(公告)号：US20130207207A1
公开(公告)日：2013-08-15
申请号：US13371635
申请日：2012-02-13
申请人： William G. McDonald , Alexander M. Arayata , Philip H. Bowles , Stephen R. Hooper
发明人： William G. McDonald , Alexander M. Arayata , Philip H. Bowles , Stephen R. Hooper
IPC分类号： H01L29/84 , H01L21/50
CPC分类号： H01L23/3157 , B60C23/0433 , G01L19/0069 , G01L19/147 , H01L23/49575 , H01L24/32 , H01L24/48 , H01L2224/2919 , H01L2224/32145 , H01L2224/32245 , H01L2224/48091 , H01L2224/48145 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/1461 , H01L2924/1815 , H01L2924/00 , H01L2224/45099 , H01L2924/00012
摘要： A pressure sensor package is provided that reduces the occurrence of micro gaps between molding material and metal contacts that can store high-pressure air. The present invention provides this capability by reducing or eliminating interfaces between package molding material and metal contacts. In one embodiment, a control die is electrically coupled to a lead frame and then encapsulated in molding material, using a technique that forms a cavity over a portion of the control die. The cavity exposes contacts on the free surface of the control die that can be electrically coupled to a pressure sensor device using, for example, wire bonding techniques. In another embodiment, a region of a substrate can be encapsulated in molding material, using a technique that forms a cavity over a sub-portion of the substrate that includes contacts. A pressure sensor device can be electrically coupled to the exposed contacts.
摘要翻译：提供了压力传感器封装，其减少了可存储高压空气的成型材料和金属触点之间的微小间隙的发生。本发明通过减少或消除封装模制材料和金属触点之间的界面来提供这种能力。在一个实施例中，使用在控制管芯的一部分上形成空腔的技术将控制管芯电耦合到引线框架，然后封装在成型材料中。该空腔暴露出控制管芯的自由表面上的触点，其可以使用例如引线接合技术电耦合到压力传感器装置。在另一个实施例中，可以使用在包括触点的衬底的子部分上形成空腔的技术将衬底的区域封装在模制材料中。压力传感器装置可以电连接到暴露的触点。

5. 发明授权

US08384168B2 Sensor device with sealing structure 有权
标题翻译：带密封结构的传感器
公开(公告)号：US08384168B2
公开(公告)日：2013-02-26
申请号：US13091997
申请日：2011-04-21
申请人： Stephen R. Hooper , Dwight L. Daniels , James D. MacDonald , William G. McDonald , Chunlin C. Xia
发明人： Stephen R. Hooper , Dwight L. Daniels , James D. MacDonald , William G. McDonald , Chunlin C. Xia
IPC分类号： H01L29/84 , G01L7/08
CPC分类号： G01L9/0052 , B81B7/0041 , B81B2201/0264 , B81B2207/012 , G01L19/0672 , G01L19/147 , H01L2224/16225 , H01L2924/15151 , H01L2924/16152
摘要： Apparatus and related fabrication methods are provided for a sensor device. The sensor device includes a sensor structure including a first portion having a sensing arrangement formed thereon and a second structure. A sealing structure is interposed between the sensor structure and the second structure, wherein the sealing structure surrounds the first portion of the sensor structure. The sealing structure establishes a fixed reference pressure on a first side of the first portion, and an opposing side of the first portion is exposed to an ambient pressure.
摘要翻译：为传感器装置提供了装置和相关的制造方法。该传感器装置包括传感器结构，该传感器结构包括其上形成有感测装置的第一部分和第二结构。在传感器结构和第二结构之间插入密封结构，其中密封结构围绕传感器结构的第一部分。密封结构在第一部分的第一侧上建立固定的参考压力，并且第一部分的相对侧暴露于环境压力。

6. 发明申请

US20110036174A1 Molded Differential PRT Pressure Sensor 有权
标题翻译：成型差压PRT压力传感器
公开(公告)号：US20110036174A1
公开(公告)日：2011-02-17
申请号：US12539853
申请日：2009-08-12
申请人： Stephen R. Hooper , James D. MacDonald , William G. McDonald
发明人： Stephen R. Hooper , James D. MacDonald , William G. McDonald
IPC分类号： G01L9/06 , H01L21/50
CPC分类号： B81B7/0061 , B81B2201/0264 , B81C2203/0154 , G01L19/0084 , G01L19/141 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2924/1461 , H01L2924/15747 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A method and apparatus are described for fabricating an exposed differential pressure sensor (30) which protects interior electrical components (37) formed on a topside surface of a differential pressure sensor transducer die (31) from corrosive particles using a molding compound (39), but which vents both sides of a piezoresistive transducer sensor diaphragm (33) through a first vent hole (42) formed in an exposed die flag (36) and a second vent hole (38) formed in an exposed cap structure (33), enabling the sensor diaphragm (33) to sense differential pressure variations directly or indirectly through a protective gel.
摘要翻译：描述了一种用于制造暴露的差压传感器（30）的方法和装置，其使用模制化合物（39）将形成在差压传感器传感器模头（31）的顶侧表面上的内部电气部件（37）与腐蚀性颗粒保护，但是通过形成在暴露的盖标志（36）中的第一通气孔（42）和形成在暴露的盖结构（33）中的第二通气孔（38），通过压阻换能器传感器隔膜（33）的两侧通风，使得能够传感器隔膜（33）通过保护性凝胶直接或间接地感测差压变化。

7. 发明授权

US08476087B2 Methods for fabricating sensor device package using a sealing structure 有权
标题翻译：使用密封结构制造传感器装置封装的方法
公开(公告)号：US08476087B2
公开(公告)日：2013-07-02
申请号：US13092001
申请日：2011-04-21
申请人： Stephen R. Hooper , Dwight L. Daniels , James D. MacDonald , William G. McDonald , Chunlin C. Xia
发明人： Stephen R. Hooper , Dwight L. Daniels , James D. MacDonald , William G. McDonald , Chunlin C. Xia
IPC分类号： H01L21/66
CPC分类号： B81C1/0023 , B81B2201/0264 , G01L19/141 , G01L19/148 , H01L2224/48247
摘要： Fabrication methods are provided for a sensor device packages. An exemplary fabrication method involves bonding a sensor structure and another structure using a sealing structure. The sealing structure surrounds a diaphragm region of the sensor structure and provides an airtight seal between the sensor structure and the other structure to establish a fixed reference pressure on one side of the diaphragm region.
摘要翻译：为传感器装置提供制造方法。示例性的制造方法包括使用密封结构粘合传感器结构和另一结构。密封结构围绕传感器结构的隔膜区域，并且在传感器结构和另一结构之间提供气密密封，以在隔膜区域的一侧上建立固定的参考压力。

8. 发明授权

US08307714B1 Dual port pressure sensor 有权
标题翻译：双口压力传感器
公开(公告)号：US08307714B1
公开(公告)日：2012-11-13
申请号：US13151404
申请日：2011-06-02
申请人： Stephen R. Hooper , William G. McDonald
发明人： Stephen R. Hooper , William G. McDonald
IPC分类号： G01L7/00
CPC分类号： G01L19/141 , G01L13/025 , G01L19/0038
摘要： A dual port pressure sensor has a lead frame having a flag having a first opening and a second opening. The lead frame has a flag having a first opening and a second opening. An encapsulant holds the lead frame. The encapsulant is over a top of the flag and a bottom of the flag is uncovered by the encapsulant. A first opening in the encapsulant is aligned with and larger than the first opening in the flag, and a second opening in the encapsulant is aligned with the second opening in the flag. A pressure sensor transducer is attached to the bottom of the flag and covers the first opening in the flag and provides an electrically detectable correlation to a pressure differential based on a first pressure received on its top side and a second pressure received on its bottom side. An integrated circuit is attached to the bottom of the flag and is electrically coupled to the pressure sensor. A lid forming an enclosure with the bottom of the flag. The pressure sensor transducer receives the first pressure through the first opening in the encapsulant and the first opening in the flag and the second pressure through the second opening in the encapsulant, the second opening in the flag, and the enclosure.
摘要翻译：双端口压力传感器具有带有具有第一开口和第二开口的标志的引线框架。引线框架具有具有第一开口和第二开口的标志。密封剂保持引线框架。密封剂在标志的顶部之上，标志的底部被封装剂覆盖。密封剂中的第一开口与标志中的第一开口对准并且大于标志中的第一开口，并且密封剂中的第二开口与标记中的第二开口对齐。压力传感器传感器连接到标志的底部并覆盖标志中的第一开口，并且基于在其顶侧接收的第一压力和在其底侧上接收的第二压力而提供与压力差的电可检测的相关性。集成电路连接到标志的底部并且电耦合到压力传感器。盖子形成与旗子底部的封闭物。压力传感器传感器通过密封剂中的第一开口和标志中的第一开口接收第一压力，并且通过密封剂中的第二开口，标志中的第二开口和外壳接收通过第二压力的第一压力。

9. 发明申请

US20100199777A1 Exposed Pad Backside Pressure Sensor Package 有权
标题翻译：裸露的背面压力传感器封装
公开(公告)号：US20100199777A1
公开(公告)日：2010-08-12
申请号：US12368402
申请日：2009-02-10
申请人： Stephen R. Hooper , James D. MacDonald , William G. McDonald
发明人： Stephen R. Hooper , James D. MacDonald , William G. McDonald
IPC分类号： G01L9/06 , B65B11/00
CPC分类号： G01L19/141 , G01L19/0084 , H01L2224/05554 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2924/1461 , H01L2924/15747 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： A method and apparatus are described for fabricating an exposed backside pressure sensor (30) which protects interior electrical components (37) formed on a topside surface of a pressure sensor transducer die (31) from corrosive particles using a protective gel layer (38) and molding compound (39), but which vents a piezoresistive transducer sensor diaphragm (33) formed on a backside of the pressure sensor transducer die (31) through a vent hole (42) formed in an exposed die flag (36), enabling the sensor diaphragm (33) to directly sense pressure variations without the influence of a protective gel.
摘要翻译：描述了一种用于制造暴露的背侧压力传感器（30）的方法和装置，其利用保护性凝胶层（38）保护形成在压力传感器传感器模具（31）的顶侧表面上的内部电气部件（37）免受腐蚀性颗粒的影响，模制化合物（39），但是通过形成在暴露的模具标记（36）中的通气孔（42）通向形成在压力传感器传感器模头（31）的背面上的压阻换能器传感器膜片（33），使得传感器隔膜（33）直接感应压力变化而不受保护凝胶的影响。

10. 发明授权

US09021689B2 Method of making a dual port pressure sensor 有权
标题翻译：制造双口压力传感器的方法
公开(公告)号：US09021689B2
公开(公告)日：2015-05-05
申请号：US13151409
申请日：2011-06-02
申请人： Stephen R. Hooper , William G. McDonald
发明人： Stephen R. Hooper , William G. McDonald
IPC分类号： H01C17/02 , G01L13/02 , H01L23/31 , G01L19/00 , G01L19/14 , H01L29/84
CPC分类号： G01L13/025 , G01L19/0038 , G01L19/141 , H01L23/315 , H01L29/84 , H01L2224/48137 , H01L2224/48247 , H01L2224/49171 , Y10T29/43 , Y10T29/49007 , Y10T29/49128 , Y10T29/4913 , Y10T29/49146 , H01L2924/00
摘要： A method of forming a dual port pressure sensor includes forming a first opening and a second opening in a flag of a lead frame. An encapsulant is molded to hold the lead frame in which the encapsulant is over a top of the flag and a bottom of the flag is uncovered by the encapsulant. A first opening in the encapsulant is aligned with and larger than the first opening in the flag and a second opening in the encapsulant aligned with the second opening in the flag. A pressure sensor transducer is attached to the bottom of the flag to cover the first opening in the flag, wherein the pressure sensor transducer provides an electrically detectable correlation to a pressure differential based on a first pressure received on its top side and a second pressure received on its bottom side. An integrated circuit is attached to the bottom of the flag. The integrated circuit is electrically coupled to the pressure sensor. A lid is attached to the encapsulant to form an enclosure around the bottom of the flag. The pressure sensor transducer receives the first pressure through the first opening in the encapsulant and the first opening in the flag and the second pressure through the second opening in the encapsulant, the second opening in the flag, and the enclosure.
摘要翻译：形成双端口压力传感器的方法包括在引线框架的标志中形成第一开口和第二开口。密封剂被模制以保持引线框架，其中密封剂在标志的顶部之上，并且标记的底部被封装剂覆盖。密封剂中的第一开口与标志中的第一开口对齐并且大于标志中的第一开口，并且密封剂中的第二开口与标记中的第二开口对齐。压力传感器传感器连接到标志的底部以覆盖标志中的第一开口，其中压力传感器换能器基于在其顶侧接收的第一压力和接收到的第二压力而提供与压差的电可检测相关性在它的底部。集成电路附在标志的底部。集成电路电耦合到压力传感器。将盖子附接到密封剂以形成围绕标志底部的外壳。压力传感器传感器通过密封剂中的第一开口和标志中的第一开口接收第一压力，并且通过密封剂中的第二开口，标志中的第二开口和外壳接收通过第二压力的第一压力。

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