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1. 发明授权

US08686550B2 Method and apparatus for high pressure sensor device 有权
标题翻译：高压传感器装置的方法和装置
公开(公告)号：US08686550B2
公开(公告)日：2014-04-01
申请号：US13371635
申请日：2012-02-13
申请人： William G. McDonald , Alexander M. Arayata , Philip H. Bowles , Stephen R. Hooper
发明人： William G. McDonald , Alexander M. Arayata , Philip H. Bowles , Stephen R. Hooper
IPC分类号： H01L23/02
CPC分类号： H01L23/3157 , B60C23/0433 , G01L19/0069 , G01L19/147 , H01L23/49575 , H01L24/32 , H01L24/48 , H01L2224/2919 , H01L2224/32145 , H01L2224/32245 , H01L2224/48091 , H01L2224/48145 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/1461 , H01L2924/1815 , H01L2924/00 , H01L2224/45099 , H01L2924/00012
摘要： A pressure sensor package is provided that reduces the occurrence of micro gaps between molding material and metal contacts that can store high-pressure air. The present invention provides this capability by reducing or eliminating interfaces between package molding material and metal contacts. In one embodiment, a control die is electrically coupled to a lead frame and then encapsulated in molding material, using a technique that forms a cavity over a portion of the control die. The cavity exposes contacts on the free surface of the control die that can be electrically coupled to a pressure sensor device using, for example, wire bonding techniques. In another embodiment, a region of a substrate can be encapsulated in molding material, using a technique that forms a cavity over a sub-portion of the substrate that includes contacts. A pressure sensor device can be electrically coupled to the exposed contacts.
摘要翻译：提供了压力传感器封装，其减少了可存储高压空气的成型材料和金属触点之间的微小间隙的发生。本发明通过减少或消除封装模制材料和金属触点之间的界面来提供这种能力。在一个实施例中，使用在控制管芯的一部分上形成空腔的技术将控制管芯电耦合到引线框架，然后封装在成型材料中。空腔使控制管芯的自由表面上的触点露出，该触点可以使用例如引线接合技术电耦合到压力传感器装置。在另一个实施例中，可以使用在包括触点的衬底的子部分上形成空腔的技术将衬底的区域封装在模制材料中。压力传感器装置可以电连接到暴露的触点。

2. 发明申请

US20130207207A1 METHOD AND APPARATUS FOR HIGH PRESSURE SENSOR DEVICE 有权
标题翻译：高压传感器装置的方法和装置
公开(公告)号：US20130207207A1
公开(公告)日：2013-08-15
申请号：US13371635
申请日：2012-02-13
申请人： William G. McDonald , Alexander M. Arayata , Philip H. Bowles , Stephen R. Hooper
发明人： William G. McDonald , Alexander M. Arayata , Philip H. Bowles , Stephen R. Hooper
IPC分类号： H01L29/84 , H01L21/50
CPC分类号： H01L23/3157 , B60C23/0433 , G01L19/0069 , G01L19/147 , H01L23/49575 , H01L24/32 , H01L24/48 , H01L2224/2919 , H01L2224/32145 , H01L2224/32245 , H01L2224/48091 , H01L2224/48145 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/1461 , H01L2924/1815 , H01L2924/00 , H01L2224/45099 , H01L2924/00012
摘要： A pressure sensor package is provided that reduces the occurrence of micro gaps between molding material and metal contacts that can store high-pressure air. The present invention provides this capability by reducing or eliminating interfaces between package molding material and metal contacts. In one embodiment, a control die is electrically coupled to a lead frame and then encapsulated in molding material, using a technique that forms a cavity over a portion of the control die. The cavity exposes contacts on the free surface of the control die that can be electrically coupled to a pressure sensor device using, for example, wire bonding techniques. In another embodiment, a region of a substrate can be encapsulated in molding material, using a technique that forms a cavity over a sub-portion of the substrate that includes contacts. A pressure sensor device can be electrically coupled to the exposed contacts.
摘要翻译：提供了压力传感器封装，其减少了可存储高压空气的成型材料和金属触点之间的微小间隙的发生。本发明通过减少或消除封装模制材料和金属触点之间的界面来提供这种能力。在一个实施例中，使用在控制管芯的一部分上形成空腔的技术将控制管芯电耦合到引线框架，然后封装在成型材料中。该空腔暴露出控制管芯的自由表面上的触点，其可以使用例如引线接合技术电耦合到压力传感器装置。在另一个实施例中，可以使用在包括触点的衬底的子部分上形成空腔的技术将衬底的区域封装在模制材料中。压力传感器装置可以电连接到暴露的触点。

3. 发明授权

US09604844B2 Sequential wafer bonding 有权
公开(公告)号：US09604844B2
公开(公告)日：2017-03-28
申请号：US14804110
申请日：2015-07-20
申请人： Philip H. Bowles , Stephen R. Hooper
发明人： Philip H. Bowles , Stephen R. Hooper
IPC分类号： H01L29/84 , B81B7/04 , B81B7/00 , B81C1/00 , H01L29/66 , H01L23/10
CPC分类号： B81B7/04 , B81B7/0029 , B81B7/0041 , B81B2201/0235 , B81B2201/0242 , B81B2207/012 , B81C1/0023 , B81C1/00293 , B81C2203/0145 , H01L23/10 , H01L29/66007 , H01L29/84 , H01L2224/11 , H01L2924/0002 , H01L2924/00
摘要： Embodiments of a sensor device include a sensor substrate and a first cap substrate attached to the sensor substrate with a first bond material. The first bond material is arranged to define a first device cavity. A second cap substrate is attached to the sensor substrate with a second bond material. The second bond material is arranged to define a second device cavity. The second bond material has a lower bonding temperature than the first bond material. The second cap substrate is further secured to the sensor substrate by an adhesive material disposed between the sensor substrate and the second cap substrate.

4. 发明授权

US09090454B2 Sequential wafer bonding 有权
标题翻译：顺序晶片接合
公开(公告)号：US09090454B2
公开(公告)日：2015-07-28
申请号：US14011289
申请日：2013-08-27
申请人： Philip H. Bowles , Stephen R. Hooper
发明人： Philip H. Bowles , Stephen R. Hooper
IPC分类号： H01L21/00 , B81B7/00 , B81C1/00 , H01L29/66 , H01L23/10 , H01L29/84
CPC分类号： B81B7/04 , B81B7/0029 , B81B7/0041 , B81B2201/0235 , B81B2201/0242 , B81B2207/012 , B81C1/0023 , B81C1/00293 , B81C2203/0145 , H01L23/10 , H01L29/66007 , H01L29/84 , H01L2224/11 , H01L2924/0002 , H01L2924/00
摘要： Embodiments of methods of fabricating a sensor device includes attaching a first wafer to a sensor wafer with a first bond material, and attaching a second wafer to the sensor wafer with a second bond material, the second bond material having a lower bonding temperature than the first bond material. After attaching the second wafer, an opening (e.g., a trench cut) through the second wafer is formed, and an adhesive material is provided through the opening to further secure the second wafer to the sensor wafer. Embodiments of sensor devices formed using such methods include a first device cavity having a first pressure, and a second device cavity having a second pressure.
摘要翻译：制造传感器装置的方法的实施例包括用第一接合材料将第一晶片附接到传感器晶片，并且用第二接合材料将第二晶片附接到传感器晶片，第二接合材料具有比第一接合材料低的接合温度债券资料。在安装第二晶片之后，形成通过第二晶片的开口（例如，沟槽切割），并且通过该开口提供粘合材料以进一步将第二晶片固定到传感器晶片。使用这种方法形成的传感器装置的实施例包括具有第一压力的第一装置腔和具有第二压力的第二装置腔。

5. 发明授权

US08906747B2 Cavity-type semiconductor package and method of packaging same 有权
标题翻译：腔式半导体封装及其封装方法
公开(公告)号：US08906747B2
公开(公告)日：2014-12-09
申请号：US13478557
申请日：2012-05-23
申请人： Stephen R. Hooper , Philip H. Bowles
发明人： Stephen R. Hooper , Philip H. Bowles
IPC分类号： H01L23/02 , H01L21/762
CPC分类号： B81B7/0064 , B81C1/00269 , B81C2203/0109 , B81C2203/019 , H01L23/04 , H01L23/053 , H01L23/10 , H01L2224/48091 , H01L2224/48137 , H01L2224/49175 , H01L2924/16152 , H01L2924/00014
摘要： A method (30) of forming a semiconductor package (20) entails applying (56) an adhesive (64) to a portion (66) of a bonding perimeter (50) of a base (22), with a section (68) of the perimeter (50) being without the adhesive (64). A lid (24) is placed on the base (22) so that a bonding perimeter (62) of the lid (24) abuts the bonding perimeter (50) of the base (22). The lid (24) includes a cavity (25) in which dies (38) mounted to the base (22) are located. A gap (70) is formed without the adhesive (64) at the section (68) between the base (22) and the lid (24). The structure vents from the gap (70) as air inside the cavity (25) expands during heat curing (72). Following heat curing (72), another adhesive (80) is dispensed in the section (68) to close the gap (70) and seal the cavity (25).
摘要翻译：形成半导体封装（20）的方法（30）需要将粘合剂（64）施加到基座（22）的接合周边（50）的部分（66）上，其中部分（68）为周边（50）没有粘合剂（64）。盖（24）被放置在基座（22）上，使得盖（24）的粘合周边（62）邻接基部（22）的粘合周边（50）。盖（24）包括一个空腔（25），其中安装在基座（22）上的模具（38）位于该空腔中。在基部（22）和盖（24）之间的部分（68）处形成没有粘合剂（64）的间隙（70）。当热固化（72）期间空腔（25）内的空气膨胀时，结构从间隙（70）排出。在热固化（72）之后，将另一粘合剂（80）分配在部分（68）中以封闭间隙（70）并密封空腔（25）。

6. 发明授权

US09499397B2 Microelectronic packages having axially-partitioned hermetic cavities and methods for the fabrication thereof 有权
标题翻译：具有轴向隔开的密封腔的微电子封装及其制造方法
公开(公告)号：US09499397B2
公开(公告)日：2016-11-22
申请号：US14230273
申请日：2014-03-31
申请人： Philip H. Bowles , Stephen R. Hooper
发明人： Philip H. Bowles , Stephen R. Hooper
IPC分类号： B81B7/02
CPC分类号： B81B7/02 , B81B2201/0235 , B81B2201/0242 , B81B2207/07 , B81B2207/09
摘要： Microelectronic packages and methods for producing microelectronic packages are provided. In one embodiment, the method includes bonding a first Microelectromechanical Systems (MEMS) die having a first MEMS transducer structure thereon to a cap piece. The first MEMS die and cap piece are bonded such that a first hermetically-sealed cavity is formed enclosing the first MEMS transducer. A second MEMS die having a second MEMS transducer structure thereon is further bonded to one of the cap piece and the second MEMS die. The second MEMS die and the cap piece are bonded such that a second hermetically-sealed cavity is formed enclosing the second MEMS transducer. The second hermetically-sealed cavity contains a different internal pressure than does the first hermetically-sealed cavity.
摘要翻译：提供微电子封装和用于制造微电子封装的方法。在一个实施例中，该方法包括将其上具有第一MEMS换能器结构的第一微机电系统（MEMS）管芯结合到盖件上。第一MEMS管芯和盖件被接合，使得形成封闭第一MEMS换能器的第一密封腔。其上具有第二MEMS换能器结构的第二MEMS管芯进一步结合到盖件和第二MEMS管芯之一。第二MEMS管芯和盖件被接合，使得形成封闭第二MEMS换能器的第二密封空腔。第二个密封腔与第一个密封腔相比具有不同的内部压力。

7. 发明授权

US09365414B2 Sensor package having stacked die 有权
标题翻译：具有堆叠模具的传感器封装
公开(公告)号：US09365414B2
公开(公告)日：2016-06-14
申请号：US14257553
申请日：2014-04-21
申请人： Philip H. Bowles , Stephen R. Hooper
发明人： Philip H. Bowles , Stephen R. Hooper
IPC分类号： H01L29/84 , B81B7/02 , B81C1/00
CPC分类号： B81B7/02 , B81B2201/0235 , B81B2201/0242 , B81B2201/0292 , B81B2207/07 , B81C1/0023 , B81C2203/0154 , B81C2203/0792 , H01L2224/05554 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2224/73265 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： A small area semiconductor device package containing two or more MEMS sensor device die and a controller die for the sensor devices is provided. The controller die is mounted on top of the largest MEMS sensor device die (e.g., a gyroscope) and over a second MEMS sensor device die (e.g., an accelerometer). In one embodiment, the controller die is also mounted on the top of the second MEMS sensor device die. In another embodiment, the controller die overhangs the second MEMS sensor device die, which is of a lesser thickness than the first MEMS sensor device die.
摘要翻译：提供了一种包含两个或更多个MEMS传感器器件管芯和用于传感器器件的控制器管芯的小面积半导体器件封装。控制器管芯安装在最大的MEMS传感器器件管芯（例如，陀螺仪）的顶部上，并且安装在第二MEMS传感器器件管芯（例如，加速度计）上。在一个实施例中，控制器管芯也安装在第二MEMS传感器器件管芯的顶部上。在另一个实施例中，控制器模具突出第二MEMS传感器器件管芯，该第二MEMS传感器器件管芯的厚度小于第一MEMS传感器器件管芯的厚度。

8. 发明申请

US20150321907A1 SEQUENTIAL WAFER BONDING 有权
标题翻译：顺序波形结合
公开(公告)号：US20150321907A1
公开(公告)日：2015-11-12
申请号：US14804110
申请日：2015-07-20
申请人： Philip H. Bowles , Stephen R. Hooper
发明人： Philip H. Bowles , Stephen R. Hooper
IPC分类号： B81B7/04 , B81B7/00
CPC分类号： B81B7/04 , B81B7/0029 , B81B7/0041 , B81B2201/0235 , B81B2201/0242 , B81B2207/012 , B81C1/0023 , B81C1/00293 , B81C2203/0145 , H01L23/10 , H01L29/66007 , H01L29/84 , H01L2224/11 , H01L2924/0002 , H01L2924/00
摘要： Embodiments of a sensor device include a sensor substrate and a first cap substrate attached to the sensor substrate with a first bond material. The first bond material is arranged to define a first device cavity. A second cap substrate is attached to the sensor substrate with a second bond material. The second bond material is arranged to define a second device cavity. The second bond material has a lower bonding temperature than the first bond material. The second cap substrate is further secured to the sensor substrate by an adhesive material disposed between the sensor substrate and the second cap substrate.
摘要翻译：传感器装置的实施例包括传感器基板和附接到具有第一粘合材料的传感器基板的第一盖基板。第一接合材料布置成限定第一器件腔。用第二粘结材料将第二盖基片连接到传感器基板上。第二接合材料被布置成限定第二器件腔。第二粘合材料具有比第一粘结材料低的结合温度。第二盖基板通过布置在传感器基板和第二盖基板之间的粘合材料进一步固定到传感器基板。

9. 发明申请

US20140015123A1 SENSOR PACKAGE AND METHOD OF FORMING SAME 有权
标题翻译：传感器封装及其形成方法
公开(公告)号：US20140015123A1
公开(公告)日：2014-01-16
申请号：US13546902
申请日：2012-07-11
申请人： Philip H. Bowles , Paige M. Holm , Stephen R. Hooper , Raymond M. Roop
发明人： Philip H. Bowles , Paige M. Holm , Stephen R. Hooper , Raymond M. Roop
IPC分类号： H01L21/56 , H01L23/498 , H01L21/78
CPC分类号： B81B7/0006 , B81B7/0077 , B81B2201/02 , B81C1/0023 , H01L2224/48091 , H01L2224/48464 , H01L2924/1461 , H01L2924/00014 , H01L2924/00
摘要： A method (70) of forming sensor packages (20) entails providing a sensor wafer (74) having sensors (30) formed on a side (26) positioned within areas (34) delineated by bonding perimeters (36), and providing a controller wafer (82) having control circuitry (42) at one side (38) and bonding perimeters (46) on an opposing side (40). The bonding perimeters (46) of the controller wafer (82) are bonded to corresponding bonding perimeters (36) of the sensor wafer (74) to form a stacked wafer structure (48) in which the control circuitry (42) faces outwardly. The controller wafer (82) is sawn to reveal bond pads (32) on the sensor wafer (74) which are wire bonded to corresponding bond pads (44) formed on the same side (38) of the wafer (82) as the control circuitry (42). The structure (48) is encapsulated in packaging material (62) and is singulated to produce the sensor packages (20).
摘要翻译：形成传感器封装（20）的方法（70）需要提供传感器晶片（74），传感器晶片（74）具有形成在位于通过接合周边（36）所描绘的区域（34）内的侧面（26）上的传感器（30），并且提供控制器具有在一侧（38）处的控制电路（42）和在相对侧（40）上的接合周边（46）的晶片（82）。控制器晶片（82）的接合周边（46）被接合到传感器晶片（74）的对应的接合周边（36），以形成其中控制电路（42）面向外的堆叠的晶片结构（48）。锯切控制器晶片（82）以露出传感器晶片（74）上的接合焊盘（32），该接合焊盘引线键合到形成在晶片（82）的同一侧（38）上的对应接合焊盘（44）电路（42）。结构（48）被封装在包装材料（62）中，并被分割以产生传感器封装（20）。

10. 发明授权

US09676611B2 Sensor device packages and related fabrication methods 有权
公开(公告)号：US09676611B2
公开(公告)日：2017-06-13
申请号：US14057262
申请日：2013-10-18
申请人： Stephen R. Hooper , Philip H. Bowles
发明人： Stephen R. Hooper , Philip H. Bowles
IPC分类号： B81B7/00 , B81C1/00
CPC分类号： B81B7/007 , B81B7/0074 , B81B2201/0235 , B81B2201/0242 , B81C1/00238 , B81C1/00301 , H01L2224/16225 , H01L2224/48091 , H01L2924/15311 , H01L2924/181 , H01L2924/19107 , H01L2924/00014 , H01L2924/00012
摘要： Sensor device packages and related fabrication methods are provided. An exemplary sensor device package includes a first structure having a sensing arrangement thereon, a second structure having circuitry thereon, and a conductive structure within the first structure and coupled to the circuitry to provide an electrical connection to the circuitry through the first structure. Thus, circuitry on the second structure may be electrically connected to an interface of the sensor device package through the first structure.

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