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    • 7. 发明申请
    • HIGH SPEED OPTICAL SUB-ASSEMBLY WITH CERAMIC CARRIER
    • 高速光电子组件与陶瓷载体
    • US20060162104A1
    • 2006-07-27
    • US11278520
    • 2006-04-03
    • Kevin MaloneChristine MollenkopfJason YorksLance ThompsonBlake MynattMark StiehlTess AbidiWilliam DeanRobert ArnoldRichard AdamsGeorge JarrielDale Isaacson
    • Kevin MaloneChristine MollenkopfJason YorksLance ThompsonBlake MynattMark StiehlTess AbidiWilliam DeanRobert ArnoldRichard AdamsGeorge JarrielDale Isaacson
    • G11B23/50
    • G02B6/4232G02B6/4201G02B6/4204G02B6/4292H01L25/167H01L2224/48091H01L2924/30107H01L2924/3011H01L2924/3025H01S5/02248H01S5/02276H01S5/02284H01S5/02296H01S5/026H01S5/0262H01S5/0683H01S5/183H01L2924/00014H01L2924/00
    • A multilayer ceramic carrier for an optical element includes a terraced cavity for retaining a vertically receiving or vertically emitting optical element. The multilayer ceramic carrier includes conductive traces interposed between the ceramic layers and which extend into the terraced cavity along the trenches formed in the cavity. A vertical cavity surface emitting laser or vertically receiving optical element is wire bonded to the conductive traces which extend into the cavity. In one embodiment, the terraced cavity of the multilayer ceramic carrier includes a VCSEL and photodetector therein, the photodetector capable of monitoring the output optical power of the VCSEL. The method for forming the multilayer ceramic carrier includes forming a plurality of layers of ceramic tape, joining the layers, then co-firing the stacked layers. The multilayer ceramic carrier is joined to a plastic optical housing which includes an aperture for securing an optical fiber. The fiber launch direction is generally orthogonal to the optical surface of the vertically emitting or vertically receiving optical element secured within the ceramic carrier. The optical subassembly comprising the plastic optical housing and ceramic carrier is mounted on the surface of a printed circuit board or adjacent the edge of a printed circuit board, such that the light emitted or detected by the optical element, preferably travels along a fiber launch direction parallel to the surface of the printed circuit board. The optical assembly may be joined to the printed circuit board using various connectors capable of carrying an electrical signal.
    • 用于光学元件的多层陶瓷载体包括用于保持垂直接收或垂直发射的光学元件的梯形腔。 多层陶瓷载体包括介于陶瓷层之间并沿着形成在空腔中的沟槽延伸到梯形腔中的导电迹线。 垂直空腔表面发射激光器或垂直接收光学元件被引线接合到延伸到空腔中的导电迹线。 在一个实施例中,多层陶瓷载体的梯形空腔包括VCSEL和其中的光电检测器,该光电检测器能够监测VCSEL的输出光功率。 形成多层陶瓷载体的方法包括形成多层陶瓷带,连接层,然后共烧烧层叠层。 多层陶瓷载体连接到塑料光学外壳,该外壳包括用于固定光纤的孔。 光纤发射方向通常垂直于固定在陶瓷载体内的垂直发射或垂直接收的光学元件的光学表面。 包括塑料光学壳体和陶瓷载体的光学子组件安装在印刷电路板的表面上或与印刷电路板的边缘相邻,使得由光学元件发射或检测到的光优选沿着光纤发射方向 平行于印刷电路板的表面。 光学组件可以使用能够承载电信号的各种连接器连接到印刷电路板。