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1. 发明授权

US5844312A Solderable transistor clip and heat sink 失效
标题翻译：可焊接晶体管夹和散热片
公开(公告)号：US5844312A
公开(公告)日：1998-12-01
申请号：US786408
申请日：1997-01-20
申请人： Howard G. Hinshaw , William D. Jordan , Matthew Smithers
发明人： Howard G. Hinshaw , William D. Jordan , Matthew Smithers
IPC分类号： H01L23/40 , H01L23/34
CPC分类号： H01L23/4093 , H01L2924/0002
摘要： A clip secures a heat sink having a slot with grooves on opposing sides thereof to a transistor. The frame has sides with a width therebetween which can be wedged into grooves on opposing sides of a slot in the heat sink. A portion of the frame is raised up between two parallel cuts in the frame. A transistor is wedged under the raised up portion. The clip has legs which are insertable into a printed circuit board for easy assembly of a heat sink, transistor, clip and printed circuit board.
摘要翻译：夹子将具有槽的散热器固定在其相对侧上的槽中，以形成晶体管。框架具有其间的宽度的侧面，其可以楔入散热器中的狭槽的相对侧上的凹槽中。框架的一部分在框架中的两个平行切口之间升高。晶体管楔入升高的部分。夹子具有可插入印刷电路板的腿，用于容易地组装散热器，晶体管，夹子和印刷电路板。

2. 发明授权

US5486980A Method and apparatus for dissipating thermal energy 失效
标题翻译：耗散热能的方法和装置
公开(公告)号：US5486980A
公开(公告)日：1996-01-23
申请号：US302336
申请日：1994-09-08
申请人： William D. Jordan , Howard G. Hinshaw
发明人： William D. Jordan , Howard G. Hinshaw
IPC分类号： H01L23/36 , H01L23/467 , H05K7/20
CPC分类号： H05K7/20909 , H01L23/467 , H01L2924/0002 , H01L2924/3011
摘要： Heat sink apparatus for cooling large electronic devices is formed with a heat sink body having a plurality of pins extending outwardly from the base of the heat sink body and a rotary fan having a blowing surface mounted adjacent the outer extremity of the pins. The pins are separated by intersecting grooves providing a large surface area for the heat sink body. The surface area of the heat sink body is sufficiently large to provide a thermal impedance of substantially less than 1.0.degree. C./W and the volume occupied by the heat sink is sufficiently small to provide a volume performance value of less than about 6.degree. C. in.sup.3 /W.
摘要翻译：用于冷却大型电子设备的散热装置形成有散热体，该散热体具有从散热体本体的底部向外延伸的多个销，以及具有邻近销的外部末端安装的吹风表面的旋转风扇。引脚由相交的槽分开，为散热器主体提供大的表面积。散热体的表面积足够大，以提供基本上小于1.0℃/ W的热阻抗，并且散热器占据的体积足够小以提供小于约6℃的体积性能值 in3 / W。

3. 发明授权

US4446504A Mounting means with solderable studs 失效
标题翻译：带可焊接螺柱的安装方式
公开(公告)号：US4446504A
公开(公告)日：1984-05-01
申请号：US532085
申请日：1983-09-13
申请人： William D. Jordan , Howard G. Hinshaw , Donald L. Clemens
发明人： William D. Jordan , Howard G. Hinshaw , Donald L. Clemens
IPC分类号： H01L23/40 , H05K7/12 , H05K7/20
CPC分类号： H05K7/12 , H01L23/4006 , H01L2023/4031 , H01L2023/405 , H01L2023/4087 , H01L2924/0002
摘要： Disclosed is means for mounting semiconductor device cases on mounting substrates such as circuit boards. The mounting means includes studs passing transversely through the body of the mounting means for mounting a semiconductor case or semiconductor case and heat sink on one side of the body. The opposite ends of the studs are coated with a solder-promoting material so that the studs may be soldered directly to the circuit board. The body may include electrically conductive pin receptacles for mating with pins extending from the semiconductor case. The pin receptacles have solderable shanks extending from the opposite side of the socket body. Stand-off bosses are also disclosed for spacing the mounting body from the surface of the circuit board and for spacing the heat sink from the surface of the mounting body.
摘要翻译：公开了用于将半导体器件壳体安装在诸如电路板的基板上的装置。安装装置包括穿过安装装置的主体的螺栓，用于将半导体壳体或半导体壳体和散热器安装在主体的一侧。螺柱的相对端部涂覆有促进焊料的材料，使得螺柱可以直接焊接到电路板。主体可以包括用于与从半导体壳延伸的销配合的导电插座。销插座具有从插座主体的相对侧延伸的可焊接柄。还公开了分离凸台以将安装体与电路板的表面间隔开并且用于将散热器与安装体的表面间隔开。

4. 外观设计

USD269606S Heat sink or similar article 失效
公开(公告)号：USD269606S
公开(公告)日：1983-07-05
申请号：US267359
申请日：1981-05-26
申请人： William D. Jordan , Howard G. Hinshaw
设计人： William D. Jordan , Howard G. Hinshaw

5. 发明授权

US4961125A Apparatus and method of attaching an electronic device package and a heat sink to a circuit board 失效
标题翻译：将电子器件封装和散热器附接到电路板的装置和方法
公开(公告)号：US4961125A
公开(公告)日：1990-10-02
申请号：US395661
申请日：1989-08-18
申请人： William D. Jordan , Donald L. Clemens
发明人： William D. Jordan , Donald L. Clemens
IPC分类号： H01L23/40 , H05K7/20
CPC分类号： H01L23/4093 , H01L2924/0002
摘要： Disclosed are apparatus and methods for attaching an electronic device package and a heat sink to a circuit board or the like. The electronic device package has a body with a planar bottom and leads extending from the body. The distal ends of the leads are coplanar with the bottom of the electronic device package. The heat sink has a base, heat-dissipating fins or the like and a clip for securing the electronic device package to the heat sink. A pair of dimples project downward from the base of the heat sink to tilt the bottom of the electronic device package. Tilting the electronic device package causes the ends of the leads to contact the circuit board so that the leads can be easily soldered to the circuit board. The dimples and the front edge of the heat sink can also be soldered to the circuit board.
摘要翻译：公开了将电子装置封装和散热器附接到电路板等的装置和方法。电子器件封装具有平面底部的本体和从主体延伸的引线。引线的远端与电子器件封装的底部共面。散热器具有基座，散热翅片等，以及用于将电子设备封装固定到散热器的夹子。一对凹坑从散热器的底部向下突出，以倾斜电子设备包装的底部。倾斜电子器件封装导致引线的端部接触电路板，使得引线可以容易地焊接到电路板。散热器的凹坑和前边缘也可以焊接到电路板。

6. 发明授权

US3970850A Pool cooling infrared telescope 失效
标题翻译：池冷却红外望远镜
公开(公告)号：US3970850A
公开(公告)日：1976-07-20
申请号：US579168
申请日：1975-05-20
申请人： William D. Jordan
发明人： William D. Jordan
IPC分类号： F17C13/00 , F25B9/00 , F25J1/00 , G01J5/06 , G01J3/02 , F17C7/00
CPC分类号： F25B9/00 , G01J5/061
摘要： An infrared telescope that has a detector therein that must be cooled to r 20.degree.K in order to function properly is cooled by freezing a pool of liquid cryogen through rapid venting of a chamber containing the cryogen to a low pressure to cause the cryogen to freeze by the pressure of the liquid cryogen being dropped below the fluid triple point pressure. In this way, the frozen pool of liquid cryogen which is in contact with the detector maintains the detector in a cooled and operating range.
摘要翻译：将其中具有检测器的红外望远镜，必须冷却至接近20°K才能正常工作，通过将包含冷冻剂的腔室快速排空至低压使冷冻液体冷冻液池冷却，使冷冻剂冻结通过液体冷冻剂的压力下降到液体三重点压力以下。以这种方式，与检测器接触的液体冷冻剂的冷冻池将检测器保持在冷却和操作范围内。

7. 发明授权

US3970851A Spray cooling for infrared telescope 失效
标题翻译：红外望远镜喷雾冷却
公开(公告)号：US3970851A
公开(公告)日：1976-07-20
申请号：US579167
申请日：1975-05-20
申请人： William D. Jordan
发明人： William D. Jordan
IPC分类号： F17C13/00 , F25B9/00 , F25J1/00 , G01J5/06 , G01J3/02 , F17C7/00
CPC分类号： F25J1/0276 , F25B9/00 , G01J5/061
摘要： A detector of an infrared telescope that must be cooled to near 20.degree4.degree. K in order to function properly is cooled by spraying a liquid cryogenic fluid through a small nozzle into a vented chamber of subatmospheric pressure to cause the pressure of the cryogenic fluid to be dropped below its fluid triple point pressure and thereby freeze to deposit frozen crystals on the detector and thereby cool the detector to the required temperature for proper functioning of the detector. The frozen crystals deposited on the detector will be sublimed therefrom by the heat leaked and generated in the detector.
摘要翻译：为了正常工作，必须冷却到接近20°-24°K的红外望远镜的探测器通过将液体低温流体通过小喷嘴喷射到低于大气压的排气室来冷却，使低温流体的压力降低到其流体三重点压力以下，从而冻结以将冻结的晶体沉积在检测器上，从而将检测器冷却至所需温度以使检测器正常工作。沉积在检测器上的冷冻晶体将通过在检测器中泄漏并产生的热量升华。

8. 发明授权

US5566749A Stamped and formed heat sink 失效
标题翻译：冲压形成散热片
公开(公告)号：US5566749A
公开(公告)日：1996-10-22
申请号：US544060
申请日：1995-10-10
申请人： William D. Jordan , Matthew C. Smithers
发明人： William D. Jordan , Matthew C. Smithers
IPC分类号： H01L23/467 , F28F7/00 , F28F13/12
CPC分类号： H01L23/467 , H01L2924/0002
摘要： A stamped and formed heat sink has a thermally conductive body including a base having a face adapted for attachment to an electronic device package. Stamped and formed heat dissipation elements extend from the edges of the base perpendicular to the base. The heat sink is formed in a progressive punch and die press so that a heat sink is produced on every stroke.
摘要翻译：冲压形成的散热器具有导热体，该导热体包括具有适于附接到电子器件封装的表面的基座。冲压成形的散热元件从底座的边缘垂直于底座延伸。散热器以渐进的冲压和压模形成，使得每个冲程都产生散热器。

9. 发明授权

US5422789A Printed circuit board component mounting device 失效
标题翻译：印刷电路板组件安装装置
公开(公告)号：US5422789A
公开(公告)日：1995-06-06
申请号：US146323
申请日：1993-11-02
申请人： Francis E. Fisher , Robin D. Johnson , William D. Jordan
发明人： Francis E. Fisher , Robin D. Johnson , William D. Jordan
IPC分类号： H05K3/30 , H05K7/12 , H05K7/20
CPC分类号： H05K7/12 , H05K3/301 , H05K3/306 , Y10T24/307
摘要： A sheet metal device for mounting a component on a circuit board is formed by stamping to defining a head portion and a base portion. The head portion is formed for insertion into a slot in a component such as a heat sink and the base portion is formed for insertion into a printed circuit board. The head portion has spade-form members which engage the walls of the slot and retain the head portion in the slot. The component is mounted on a printed circuit board by inserting the base portion into an aperture in the printed circuit board and soldering the base portion to the reverse surface of the board.
摘要翻译：通过冲压形成用于将部件安装在电路板上的金属板装置，以限定头部和基部。头部形成为用于插入诸如散热器的部件中的狭槽中，并且基部形成为用于插入到印刷电路板中。头部具有铲形形状构件，其接合狭槽的壁并将头部部分保持在狭槽中。通过将基部插入印刷电路板的孔中并将基部焊接到基板的相反表面，将部件安装在印刷电路板上。

10. 发明授权

US4521827A Heat sink mounting 失效
标题翻译：散热片安装
公开(公告)号：US4521827A
公开(公告)日：1985-06-04
申请号：US457409
申请日：1983-01-12
申请人： William D. Jordan , Roger C. Hundt , James D. Pritchett
发明人： William D. Jordan , Roger C. Hundt , James D. Pritchett
IPC分类号： H01L23/40 , H05K1/02 , H05K3/30 , H05K7/20 , F28F7/00
CPC分类号： H05K3/301 , H01L23/4006 , H05K7/20 , H01L2023/4087 , H01L2924/0002 , H05K1/0201 , H05K3/306 , Y10T29/49139 , Y10T29/49144
摘要： Disclosed are methods and apparatus for attaching a heat sink mounted semiconductor case to a circuit board employing a stud with a flange near one end. The longer shank is threaded and at least the shorter shank or head stud is tin-plated. The stud may be swaged into a mounting hole in the heat sink and the heat sink and semiconductor case pre-assembled. The pre-assembled unit may then be mounted and soldered to the circuit board along with other circuit components.
摘要翻译：公开了用于将散热器安装的半导体外壳附接到电路板的方法和装置，该电路板采用在一端附近具有凸缘的螺柱。较长的柄是螺纹的，并且至少较短的柄或头螺柱镀锡。螺柱可以挤压到散热器中的安装孔中，并且散热器和半导体外壳预先组装。然后可以将预组装的单元与其他电路部件一起安装和焊接到电路板。

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