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1. 发明授权

US4961125A Apparatus and method of attaching an electronic device package and a heat sink to a circuit board 失效
标题翻译：将电子器件封装和散热器附接到电路板的装置和方法
公开(公告)号：US4961125A
公开(公告)日：1990-10-02
申请号：US395661
申请日：1989-08-18
申请人： William D. Jordan , Donald L. Clemens
发明人： William D. Jordan , Donald L. Clemens
IPC分类号： H01L23/40 , H05K7/20
CPC分类号： H01L23/4093 , H01L2924/0002
摘要： Disclosed are apparatus and methods for attaching an electronic device package and a heat sink to a circuit board or the like. The electronic device package has a body with a planar bottom and leads extending from the body. The distal ends of the leads are coplanar with the bottom of the electronic device package. The heat sink has a base, heat-dissipating fins or the like and a clip for securing the electronic device package to the heat sink. A pair of dimples project downward from the base of the heat sink to tilt the bottom of the electronic device package. Tilting the electronic device package causes the ends of the leads to contact the circuit board so that the leads can be easily soldered to the circuit board. The dimples and the front edge of the heat sink can also be soldered to the circuit board.
摘要翻译：公开了将电子装置封装和散热器附接到电路板等的装置和方法。电子器件封装具有平面底部的本体和从主体延伸的引线。引线的远端与电子器件封装的底部共面。散热器具有基座，散热翅片等，以及用于将电子设备封装固定到散热器的夹子。一对凹坑从散热器的底部向下突出，以倾斜电子设备包装的底部。倾斜电子器件封装导致引线的端部接触电路板，使得引线可以容易地焊接到电路板。散热器的凹坑和前边缘也可以焊接到电路板。

2. 发明授权

US4847449A Alignment apparatus for use in mounting electronic components and heat sinks on circuit boards 失效
标题翻译：用于将电子部件和散热器安装在电路板上的对准装置
公开(公告)号：US4847449A
公开(公告)日：1989-07-11
申请号：US207645
申请日：1988-06-16
申请人： William D. Jordan , Donald L. Clemens
发明人： William D. Jordan , Donald L. Clemens
IPC分类号： H01L23/40 , H05K3/30 , H05K3/34
CPC分类号： H05K3/301 , H01L23/4093 , H01L2924/0002 , H05K2201/10287 , H05K2201/10568 , H05K2201/10606 , H05K2203/167 , H05K3/3447
摘要： Alignment apparatus for receiving, aligning and retaining the pin connectors of an electronic component package in predetermined relationship is used to maintain proper alignment of the pin connectors with preformed holes or mounting pads on a printed circuit board or the like when the sub-assembly of a heat sink and an electronic component package is mounted on a printed circuit board or the like.
摘要翻译：用于以预定关系接收，对准和保持电子部件封装的针式连接器的对准装置用于在将印制电路板的子组件或类似物时将针式连接器与预先形成的孔或安装衬垫正确对准在印刷电路板等上散热器和电子部件封装安装在印刷电路板等上。

3. 发明授权

US4709302A Alignment apparatus for electronic device package 失效
标题翻译：电子器件封装对准装置
公开(公告)号：US4709302A
公开(公告)日：1987-11-24
申请号：US942097
申请日：1986-12-16
申请人： William D. Jordan , Donald L. Clemens
发明人： William D. Jordan , Donald L. Clemens
IPC分类号： H01L23/32 , H05K1/18 , H05K3/30 , H05K7/12 , H05K7/20
CPC分类号： H05K3/306 , H01R12/7005 , H05K7/12 , H05K2201/10424 , H05K2201/10704 , H05K2201/10863 , H05K3/301
摘要： Disclosed is apparatus for mounting electronic device packages and heat sinks on printed circuit boards with the pin connectors of the electronic device package held in alignment with preformed locations on the printed circuit boards. The alignment apparatus includes means for securing the electronic device package in intimate thermal contact with the heat sink for rapid dissipation of heat therefrom.
摘要翻译：公开了用于将电子设备封装和散热器安装在印刷电路板上的装置，其中电子器件封装的引脚连接器与印刷电路板上的预先形成的位置保持一致。对准装置包括用于固定电子装置包装件与散热器紧密热接触的装置，用于从其快速散发热量。

4. 发明授权

US5038858A Finned heat sink and method of manufacture 失效
标题翻译：翅片散热片及制造方法
公开(公告)号：US5038858A
公开(公告)日：1991-08-13
申请号：US492926
申请日：1990-03-13
申请人： William D. Jordan , Donald L. Clemens
发明人： William D. Jordan , Donald L. Clemens
IPC分类号： H01L23/367 , H05K7/20
CPC分类号： H01L23/3672 , H01L2924/0002
摘要： A finned heat sink is constructed from a base having parallel grooves with a latching lip. The fins are individually formed with a retaining boss adjacent one edge which is adapted to mate with the latching lip to secure the fin in the groove. Spacing tabs are formed on the fins to assure uniform parallel spacing between the fins when assembled.
摘要翻译：鳍状散热器由具有带有闩锁唇的平行凹槽的底座构成。翅片分别形成有邻近一个边缘的保持凸台，其适于与闩锁唇缘配合以将翅片固定在凹槽中。翼片上形成有间隔片，以便在组装时确保翅片之间均匀的平行间距。

5. 发明授权

US4625260A Fasteners for surface mounting of printed circuit board components 失效
标题翻译：用于表面安装印刷电路板部件的紧固件
公开(公告)号：US4625260A
公开(公告)日：1986-11-25
申请号：US644038
申请日：1984-08-24
申请人： William D. Jordan , Donald L. Clemens
发明人： William D. Jordan , Donald L. Clemens
IPC分类号： H01L23/40 , H05K3/34 , H05K7/20
CPC分类号： H01L23/4093 , H01L2924/0002 , H05K3/341 , Y10T29/49144 , Y10T403/479
摘要： A fastener is provided for mounting a heat sink to the surface of a circuit board. The fastener includes a body having structure extending from the body for engaging the heat sink. The body further includes structure extending in a direction opposite the engaging structure for contacting the surface of the circuit board. The contacting structure includes a surface parallel to the surface of the circuit board and is coated with a solder-promoting material for surface mounting the heat sink to the circuit board.
摘要翻译：提供了用于将散热器安装到电路板的表面的紧固件。紧固件包括具有从主体延伸以结合散热器的结构的主体。主体还包括沿与接合结构相反的方向延伸的结构，用于接触电路板的表面。接触结构包括平行于电路板的表面的表面，并且涂覆有用于将散热器表面安装到电路板的助焊材料。

6. 发明授权

US4446504A Mounting means with solderable studs 失效
标题翻译：带可焊接螺柱的安装方式
公开(公告)号：US4446504A
公开(公告)日：1984-05-01
申请号：US532085
申请日：1983-09-13
申请人： William D. Jordan , Howard G. Hinshaw , Donald L. Clemens
发明人： William D. Jordan , Howard G. Hinshaw , Donald L. Clemens
IPC分类号： H01L23/40 , H05K7/12 , H05K7/20
CPC分类号： H05K7/12 , H01L23/4006 , H01L2023/4031 , H01L2023/405 , H01L2023/4087 , H01L2924/0002
摘要： Disclosed is means for mounting semiconductor device cases on mounting substrates such as circuit boards. The mounting means includes studs passing transversely through the body of the mounting means for mounting a semiconductor case or semiconductor case and heat sink on one side of the body. The opposite ends of the studs are coated with a solder-promoting material so that the studs may be soldered directly to the circuit board. The body may include electrically conductive pin receptacles for mating with pins extending from the semiconductor case. The pin receptacles have solderable shanks extending from the opposite side of the socket body. Stand-off bosses are also disclosed for spacing the mounting body from the surface of the circuit board and for spacing the heat sink from the surface of the mounting body.
摘要翻译：公开了用于将半导体器件壳体安装在诸如电路板的基板上的装置。安装装置包括穿过安装装置的主体的螺栓，用于将半导体壳体或半导体壳体和散热器安装在主体的一侧。螺柱的相对端部涂覆有促进焊料的材料，使得螺柱可以直接焊接到电路板。主体可以包括用于与从半导体壳延伸的销配合的导电插座。销插座具有从插座主体的相对侧延伸的可焊接柄。还公开了分离凸台以将安装体与电路板的表面间隔开并且用于将散热器与安装体的表面间隔开。

7. 发明授权

US3970850A Pool cooling infrared telescope 失效
标题翻译：池冷却红外望远镜
公开(公告)号：US3970850A
公开(公告)日：1976-07-20
申请号：US579168
申请日：1975-05-20
申请人： William D. Jordan
发明人： William D. Jordan
IPC分类号： F17C13/00 , F25B9/00 , F25J1/00 , G01J5/06 , G01J3/02 , F17C7/00
CPC分类号： F25B9/00 , G01J5/061
摘要： An infrared telescope that has a detector therein that must be cooled to r 20.degree.K in order to function properly is cooled by freezing a pool of liquid cryogen through rapid venting of a chamber containing the cryogen to a low pressure to cause the cryogen to freeze by the pressure of the liquid cryogen being dropped below the fluid triple point pressure. In this way, the frozen pool of liquid cryogen which is in contact with the detector maintains the detector in a cooled and operating range.
摘要翻译：将其中具有检测器的红外望远镜，必须冷却至接近20°K才能正常工作，通过将包含冷冻剂的腔室快速排空至低压使冷冻液体冷冻液池冷却，使冷冻剂冻结通过液体冷冻剂的压力下降到液体三重点压力以下。以这种方式，与检测器接触的液体冷冻剂的冷冻池将检测器保持在冷却和操作范围内。

8. 发明授权

US5844312A Solderable transistor clip and heat sink 失效
标题翻译：可焊接晶体管夹和散热片
公开(公告)号：US5844312A
公开(公告)日：1998-12-01
申请号：US786408
申请日：1997-01-20
申请人： Howard G. Hinshaw , William D. Jordan , Matthew Smithers
发明人： Howard G. Hinshaw , William D. Jordan , Matthew Smithers
IPC分类号： H01L23/40 , H01L23/34
CPC分类号： H01L23/4093 , H01L2924/0002
摘要： A clip secures a heat sink having a slot with grooves on opposing sides thereof to a transistor. The frame has sides with a width therebetween which can be wedged into grooves on opposing sides of a slot in the heat sink. A portion of the frame is raised up between two parallel cuts in the frame. A transistor is wedged under the raised up portion. The clip has legs which are insertable into a printed circuit board for easy assembly of a heat sink, transistor, clip and printed circuit board.
摘要翻译：夹子将具有槽的散热器固定在其相对侧上的槽中，以形成晶体管。框架具有其间的宽度的侧面，其可以楔入散热器中的狭槽的相对侧上的凹槽中。框架的一部分在框架中的两个平行切口之间升高。晶体管楔入升高的部分。夹子具有可插入印刷电路板的腿，用于容易地组装散热器，晶体管，夹子和印刷电路板。

9. 发明授权

US5486980A Method and apparatus for dissipating thermal energy 失效
标题翻译：耗散热能的方法和装置
公开(公告)号：US5486980A
公开(公告)日：1996-01-23
申请号：US302336
申请日：1994-09-08
申请人： William D. Jordan , Howard G. Hinshaw
发明人： William D. Jordan , Howard G. Hinshaw
IPC分类号： H01L23/36 , H01L23/467 , H05K7/20
CPC分类号： H05K7/20909 , H01L23/467 , H01L2924/0002 , H01L2924/3011
摘要： Heat sink apparatus for cooling large electronic devices is formed with a heat sink body having a plurality of pins extending outwardly from the base of the heat sink body and a rotary fan having a blowing surface mounted adjacent the outer extremity of the pins. The pins are separated by intersecting grooves providing a large surface area for the heat sink body. The surface area of the heat sink body is sufficiently large to provide a thermal impedance of substantially less than 1.0.degree. C./W and the volume occupied by the heat sink is sufficiently small to provide a volume performance value of less than about 6.degree. C. in.sup.3 /W.
摘要翻译：用于冷却大型电子设备的散热装置形成有散热体，该散热体具有从散热体本体的底部向外延伸的多个销，以及具有邻近销的外部末端安装的吹风表面的旋转风扇。引脚由相交的槽分开，为散热器主体提供大的表面积。散热体的表面积足够大，以提供基本上小于1.0℃/ W的热阻抗，并且散热器占据的体积足够小以提供小于约6℃的体积性能值 in3 / W。

10. 发明授权

US3970851A Spray cooling for infrared telescope 失效
标题翻译：红外望远镜喷雾冷却
公开(公告)号：US3970851A
公开(公告)日：1976-07-20
申请号：US579167
申请日：1975-05-20
申请人： William D. Jordan
发明人： William D. Jordan
IPC分类号： F17C13/00 , F25B9/00 , F25J1/00 , G01J5/06 , G01J3/02 , F17C7/00
CPC分类号： F25J1/0276 , F25B9/00 , G01J5/061
摘要： A detector of an infrared telescope that must be cooled to near 20.degree4.degree. K in order to function properly is cooled by spraying a liquid cryogenic fluid through a small nozzle into a vented chamber of subatmospheric pressure to cause the pressure of the cryogenic fluid to be dropped below its fluid triple point pressure and thereby freeze to deposit frozen crystals on the detector and thereby cool the detector to the required temperature for proper functioning of the detector. The frozen crystals deposited on the detector will be sublimed therefrom by the heat leaked and generated in the detector.
摘要翻译：为了正常工作，必须冷却到接近20°-24°K的红外望远镜的探测器通过将液体低温流体通过小喷嘴喷射到低于大气压的排气室来冷却，使低温流体的压力降低到其流体三重点压力以下，从而冻结以将冻结的晶体沉积在检测器上，从而将检测器冷却至所需温度以使检测器正常工作。沉积在检测器上的冷冻晶体将通过在检测器中泄漏并产生的热量升华。

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