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1. 发明授权

US5027254A Apparatus for cooling electronics components 失效
标题翻译：电子部件冷却装置
公开(公告)号：US5027254A
公开(公告)日：1991-06-25
申请号：US434963
申请日：1989-11-09
申请人： William D. Corfits , Maurice F. Holahan , Susan J. Martino , David R. Motschman , James R. Thorpe
发明人： William D. Corfits , Maurice F. Holahan , Susan J. Martino , David R. Motschman , James R. Thorpe
IPC分类号： G06F1/20 , H05K7/14 , H05K7/20
CPC分类号： H05K7/1424 , G06F1/20
摘要： A side-by-side double row of electronics packages plug into a common backplane. Cooling air flows in an (upside down) omega-shaped path turning into one row of packages, flowing through that row, turning through an air-moving device into a plenum chamber, then turning into the second row of packages, and out of the second row turning again to an outlet.

2. 发明授权

US08489217B2 Thermal cycling and gradient management in three-dimensional stacked architectures 有权
标题翻译：三维堆叠架构中的热循环和梯度管理
公开(公告)号：US08489217B2
公开(公告)日：2013-07-16
申请号：US12984096
申请日：2011-01-04
申请人： Chen-Yong Cher , Wilfried E. Haensch , Eren Kursun , David R. Motschman
发明人： Chen-Yong Cher , Wilfried E. Haensch , Eren Kursun , David R. Motschman
IPC分类号： G06F19/00
CPC分类号： G06F1/3234 , G06F1/206
摘要： A mechanism is provided for minimizing reliability problems in a three-dimensional (3D) integrated circuit. A set of sensors are interrogated for current data. A direction of force and a magnitude of the force are determined based on the current data for each sensor in the set of sensors for each of one or more directions between the sensor and at least one neighboring sensor thereby forming a set of forces. Each of the set of forces is used to identify one or more points of stress that are at or above the predetermined force threshold. Responsive to identifying at least one point of stress that is at or above the predetermined force threshold, one or more temperature actuation actions are initiated in order to reduce at least one point of stress in the region where the at least one point of stress is identified.
摘要翻译：提供了一种用于最小化三维（3D）集成电路中的可靠性问题的机制。一组传感器被询问用于当前数据。基于用于传感器和至少一个相邻传感器之间的一个或多个方向中的每一个的传感器组中的每个传感器的当前数据来确定力的方向和力的大小，从而形成一组力。所述一组力中的每一个用于识别处于或高于预定力阈值的一个或多个应力点。响应于识别处于或高于预定力阈值的至少一个应力点，启动一个或多个温度致动动作，以便在识别出至少一个应力点的区域中减少至少一个应力点。

3. 发明授权

US08299608B2 Enhanced thermal management of 3-D stacked die packaging 有权
标题翻译： 3-D堆叠模具封装的增强热管理
公开(公告)号：US08299608B2
公开(公告)日：2012-10-30
申请号：US12832732
申请日：2010-07-08
申请人： Gerald K. Bartley , David R. Motschman , Kamal K. Sikka , Jamil A. Wakil , Xiaojin Wei , Jiantao Zheng
发明人： Gerald K. Bartley , David R. Motschman , Kamal K. Sikka , Jamil A. Wakil , Xiaojin Wei , Jiantao Zheng
IPC分类号： H01L23/36 , H01L21/58
CPC分类号： H01L23/49827 , H01L23/055 , H01L23/14 , H01L23/147 , H01L23/3677 , H01L23/42 , H01L23/433 , H01L24/16 , H01L25/0657 , H01L2224/16145 , H01L2224/16146 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2224/3003 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/3303 , H01L2224/73204 , H01L2224/73253 , H01L2225/06513 , H01L2225/06517 , H01L2225/06572 , H01L2225/06589 , H01L2924/00014 , H01L2924/01004 , H01L2924/10253 , H01L2924/10271 , H01L2924/16195 , H01L2924/163 , H01L2924/167 , H01L2924/00 , H01L2224/0401
摘要： A die stack package is provided and includes a substrate, a stack of computing components, at least one thermal plate, which is thermally communicative with the stack and a lid supported on the substrate to surround the stack and the at least one thermal plate to thereby define a first heat transfer path extending from one of the computing components to the lid via the at least one thermal plate and a fin coupled to a surface of the lid and the at least one thermal plate, and a second heat transfer path extending from the one of the computing components to the lid surface without passing through the at least one thermal plate.
摘要翻译：提供了一个管芯堆叠封装，包括一个基板，一堆计算部件，至少一个与该堆叠热交换的热板，以及一个支撑在基板上的盖子，以围绕堆叠和至少一个热板，从而限定从所述计算部件之一经由所述至少一个热板和联接到所述盖的表面和所述至少一个热板的翅片延伸到所述盖的第一热传递路径，以及从所述至少一个热板延伸的第二传热路径计算组件之一到盖表面而不通过至少一个热板。

4. 发明授权

US08367478B2 Method and system for internal layer-layer thermal enhancement 有权
标题翻译：内层热增强方法和系统
公开(公告)号：US08367478B2
公开(公告)日：2013-02-05
申请号：US13151672
申请日：2011-06-02
申请人： Gerald K. Bartley , Charles L. Johnson , John E. Kelly, III , David R. Motschman
发明人： Gerald K. Bartley , Charles L. Johnson , John E. Kelly, III , David R. Motschman
IPC分类号： H01L21/50 , H01L21/48 , H01L23/34 , H01L23/52 , H01L23/48 , H01L23/40 , H01L23/538
CPC分类号： H01L29/0657 , H01L23/3677 , H01L23/4275 , H01L25/0657 , H01L2224/16145 , H01L2225/06513 , H01L2225/06541 , H01L2225/06589
摘要： The exemplary embodiments of the present invention provide a method and apparatus for enhancing the cooling of a chip stack of semiconductor chips. The method includes creating a first chip with circuitry on a first side and creating a second chip electrically and mechanically coupled to the first chip by a grid of connectors. The method further includes creating a cavity in a second side of the first chip between the connectors and filling the cavity with a thermal material. The chip stack of semiconductor chips with enhanced cooling apparatus includes a first chip with circuitry on a first side and a second chip electrically and mechanically coupled to the first chip by a grid of connectors. The apparatus further includes wherein portions of a second side of the first chip between the connectors is removed to provide a cavity in which a thermal material is placed.
摘要翻译：本发明的示例性实施例提供了一种用于增强半导体芯片的芯片堆叠的冷却的方法和装置。该方法包括在第一侧上创建具有电路的第一芯片，并通过连接器网格将第二芯片电连接并机械耦合到第一芯片。该方法还包括在连接器之间的第一芯片的第二侧中形成空腔，并用热材料填充空腔。具有增强的冷却装置的半导体芯片的芯片堆叠包括具有第一侧上的电路的第一芯片和通过连接器格栅电和机械地耦合到第一芯片的第二芯片。该装置还包括：其中，连接器之间的第一芯片的第二侧的部分被去除以提供放置热材料的空腔。

5. 发明申请

US20120173036A1 Thermal Cycling and Gradient Management in Three-Dimensional Stacked Architectures 有权
标题翻译：三维堆叠架构中的热循环和梯度管理
公开(公告)号：US20120173036A1
公开(公告)日：2012-07-05
申请号：US12984096
申请日：2011-01-04
申请人： Chen-Yong Cher , Wilfried E. Haensch , Eren Kursun , David R. Motschman
发明人： Chen-Yong Cher , Wilfried E. Haensch , Eren Kursun , David R. Motschman
IPC分类号： G05D23/19
CPC分类号： G06F1/3234 , G06F1/206
摘要： A mechanism is provided for minimizing reliability problems in a three-dimensional (3D)) integrated circuit. A set of sensors are interrogated for current data. A direction of force and a magnitude of the force are determined based on the current data for each sensor in the set of sensors for each of one or more directions between the sensor and at least one neighboring sensor thereby forming a set of forces. Each of the set of forces is used to identify one or more points of stress that are at or above the predetermined force threshold. Responsive to identifying at least one point of stress that is at or above the predetermined force threshold, one or more temperature actuation actions are initiated in order to reduce at least one point of stress in the region where the at least one point of stress is identified.
摘要翻译：提供了用于最小化三维（3D））集成电路中的可靠性问题的机制。一组传感器被询问用于当前数据。基于用于传感器和至少一个相邻传感器之间的一个或多个方向中的每一个的传感器组中的每个传感器的当前数据来确定力的方向和力的大小，从而形成一组力。所述一组力中的每一个用于识别处于或高于预定力阈值的一个或多个应力点。响应于识别处于或高于预定力阈值的至少一个应力点，启动一个或多个温度致动动作，以便在识别出至少一个应力点的区域中减少至少一个应力点。

6. 发明授权

US09111899B2 Horizontally and vertically aligned graphite nanofibers thermal interface material for use in chip stacks 有权
标题翻译：水平和垂直排列的石墨纳米纤维热界面材料用于芯片堆叠
公开(公告)号：US09111899B2
公开(公告)日：2015-08-18
申请号：US13613564
申请日：2012-09-13
申请人： Gerald K. Bartley , Charles L. Johnson , John E. Kelly, III , Joseph Kuczynski , David R. Motschman , Arvind K. Sinha , Kevin A. Splittstoesser , Timothy J. Tofil
发明人： Gerald K. Bartley , Charles L. Johnson , John E. Kelly, III , Joseph Kuczynski , David R. Motschman , Arvind K. Sinha , Kevin A. Splittstoesser , Timothy J. Tofil
IPC分类号： H01L23/48 , H01L23/10 , H01L23/34 , H01L23/367 , H01L23/00 , H01L21/02 , H01L23/373 , H01L23/427 , H01L25/065
CPC分类号： H01L23/367 , H01L21/02656 , H01L23/3677 , H01L23/373 , H01L23/4275 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/81 , H01L24/95 , H01L25/0657 , H01L2224/10165 , H01L2224/13014 , H01L2224/13025 , H01L2224/131 , H01L2224/16145 , H01L2224/16146 , H01L2224/17181 , H01L2224/17519 , H01L2224/32145 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2224/8114 , H01L2224/81191 , H01L2224/81815 , H01L2224/83909 , H01L2225/06513 , H01L2225/06541 , H01L2225/06565 , H01L2225/06589 , H01L2924/01322 , H01L2924/00014 , H01L2924/00 , H01L2924/014
摘要： The chip stack of semiconductor chips with enhanced cooling apparatus includes a first chip with circuitry on a first side and a second chip electrically and mechanically coupled to the first chip by a grid of connectors. The apparatus further includes a thermal interface material pad placed between the first chip and the second chip, wherein the thermal interface material pad includes nanofibers aligned parallel to mating surfaces of the first chip and the second chip and nanofibers aligned perpendicular to mating surfaces of the first chip and the second chip.
摘要翻译：具有增强的冷却装置的半导体芯片的芯片堆叠包括具有第一侧上的电路的第一芯片和通过连接器格栅电和机械地耦合到第一芯片的第二芯片。该装置还包括放置在第一芯片和第二芯片之间的热界面材料垫，其中热界面材料垫包括平行于第一芯片和第二芯片的配合表面排列的纳米纤维，并且纳米纤维垂直于第一芯片和第二芯片的配合表面对齐芯片和第二芯片。

7. 发明授权

US08139355B2 Memory module connector having memory module cooling structures 有权
标题翻译：具有存储模块冷却结构的内存模块连接器
公开(公告)号：US08139355B2
公开(公告)日：2012-03-20
申请号：US12786067
申请日：2010-05-24
申请人： David R. Motschman , Mark E. Steinke, Jr. , Aparna Vallury
发明人： David R. Motschman , Mark E. Steinke, Jr. , Aparna Vallury
IPC分类号： H05K7/20
CPC分类号： G06F1/20 , H01L23/3672 , H01L23/3675 , H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： One embodiment of the present invention provides a computer memory system that includes at least one DIMM connector having a DIMM socket for releasably receiving a terminal edge of a DIMM. A metallic or otherwise highly heat-conductive base is secured to the DIMM connector. A pair of heat spreaders is secured to the base on opposing sides of the DIMM socket. Each heat spreader includes a DIMM-engagement portion spaced from the base. The heat spreaders are nondestructively moveable between an open position spaced apart for receiving the DIMM between the heat spreaders and a closed position for thermally engaging opposing faces of the DIMM. The heat spreaders provide a continuous thermally-conductive pathway between the DIMM-engagement portion and the base. Heatsink fins extend laterally from the base to provide cooling.
摘要翻译：本发明的一个实施例提供了一种计算机存储器系统，其包括具有用于可释放地接收DIMM的终端边缘的DIMM插槽的至少一个DIMM连接器。金属或其他高度导热的基座固定到DIMM连接器。一对散热器在DIMM插槽的相对侧固定到基座。每个散热器包括与基座间隔开的DIMM接合部分。散热器在间隔开的开放位置之间是非破坏性的，以在散热器之间接收DIMM，并且用于热接合DIMM的相对面的闭合位置。散热器在DIMM接合部分和基座之间提供连续的导热通路。散热片从基座横向延伸以提供冷却。

8. 发明申请

US20140070393A1 HORIZONTALLY AND VERTICALLY ALIGNED GRAPHITE NANOFIBERS THERMAL INTERFACE MATERIAL FOR USE IN CHIP STACKS 有权
标题翻译：水平和垂直对准的石墨纳米纤维片用于芯片堆叠的热界面材料
公开(公告)号：US20140070393A1
公开(公告)日：2014-03-13
申请号：US13613564
申请日：2012-09-13
申请人： Gerald K. Bartley , Charles L. Johnson , John E. Kelly, III , Joseph Kuczynski , David R. Motschman , Arvind K. Sinha , Kevin A. Splittstoesser , Timothy J. Tofil
发明人： Gerald K. Bartley , Charles L. Johnson , John E. Kelly, III , Joseph Kuczynski , David R. Motschman , Arvind K. Sinha , Kevin A. Splittstoesser , Timothy J. Tofil
IPC分类号： H01L23/367 , H01L21/02 , H01L23/00
CPC分类号： H01L23/367 , H01L21/02656 , H01L23/3677 , H01L23/373 , H01L23/4275 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/81 , H01L24/95 , H01L25/0657 , H01L2224/10165 , H01L2224/13014 , H01L2224/13025 , H01L2224/131 , H01L2224/16145 , H01L2224/16146 , H01L2224/17181 , H01L2224/17519 , H01L2224/32145 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2224/8114 , H01L2224/81191 , H01L2224/81815 , H01L2224/83909 , H01L2225/06513 , H01L2225/06541 , H01L2225/06565 , H01L2225/06589 , H01L2924/01322 , H01L2924/00014 , H01L2924/00 , H01L2924/014
摘要： The chip stack of semiconductor chips with enhanced cooling apparatus includes a first chip with circuitry on a first side and a second chip electrically and mechanically coupled to the first chip by a grid of connectors. The apparatus further includes a thermal interface material pad placed between the first chip and the second chip, wherein the thermal interface material pad includes nanofibers aligned parallel to mating surfaces of the first chip and the second chip and nanofibers aligned perpendicular to mating surfaces of the first chip and the second chip
摘要翻译：具有增强的冷却装置的半导体芯片的芯片堆叠包括具有第一侧上的电路的第一芯片和通过连接器格栅电和机械地耦合到第一芯片的第二芯片。该装置还包括放置在第一芯片和第二芯片之间的热界面材料垫，其中热界面材料垫包括平行于第一芯片和第二芯片的配合表面排列的纳米纤维，并且纳米纤维垂直于第一芯片和第二芯片的配合表面对齐芯片和第二芯片

9. 发明申请

US20120007229A1 ENHANCED THERMAL MANAGEMENT OF 3-D STACKED DIE PACKAGING 有权
标题翻译： 3-D堆叠式包装的增强热管理
公开(公告)号：US20120007229A1
公开(公告)日：2012-01-12
申请号：US12832732
申请日：2010-07-08
申请人： Gerald K. Bartley , David R. Motschman , Kamal K. Sikka , Jamil A. Wakil , Xiaojin Wei , Jiantao Zheng
发明人： Gerald K. Bartley , David R. Motschman , Kamal K. Sikka , Jamil A. Wakil , Xiaojin Wei , Jiantao Zheng
IPC分类号： H01L23/34 , H01L21/50
CPC分类号： H01L23/49827 , H01L23/055 , H01L23/14 , H01L23/147 , H01L23/3677 , H01L23/42 , H01L23/433 , H01L24/16 , H01L25/0657 , H01L2224/16145 , H01L2224/16146 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2224/3003 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/3303 , H01L2224/73204 , H01L2224/73253 , H01L2225/06513 , H01L2225/06517 , H01L2225/06572 , H01L2225/06589 , H01L2924/00014 , H01L2924/01004 , H01L2924/10253 , H01L2924/10271 , H01L2924/16195 , H01L2924/163 , H01L2924/167 , H01L2924/00 , H01L2224/0401
摘要： A die stack package is provided and includes a substrate, a stack of computing components, at least one thermal plate, which is thermally communicative with the stack and a lid supported on the substrate to surround the stack and the at least one thermal plate to thereby define a first heat transfer path extending from one of the computing components to the lid via the at least one thermal plate and a fin coupled to a surface of the lid and the at least one thermal plate, and a second heat transfer path extending from the one of the computing components to the lid surface without passing through the at least one thermal plate.
摘要翻译：提供了一个管芯堆叠封装，包括一个基板，一堆计算部件，至少一个与该堆叠热交换的热板，以及一个支撑在基板上的盖子，以围绕堆叠和至少一个热板，从而限定从所述计算部件之一经由所述至少一个热板和联接到所述盖的表面和所述至少一个热板的翅片延伸到所述盖的第一热传递路径，以及从所述至少一个热板延伸的第二传热路径计算组件之一到盖表面而不通过至少一个热板。

10. 发明申请

US20110286179A1 MEMORY MODULE CONNECTOR HAVING MEMORY MODULE COOLING STRUCTURES 有权
标题翻译：具有存储模块冷却结构的存储模块连接器
公开(公告)号：US20110286179A1
公开(公告)日：2011-11-24
申请号：US12786067
申请日：2010-05-24
申请人： David R. Motschman , Mark E. Steinke , Aparna Vallury
发明人： David R. Motschman , Mark E. Steinke , Aparna Vallury
IPC分类号： G06F1/20
CPC分类号： G06F1/20 , H01L23/3672 , H01L23/3675 , H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： One embodiment of the present invention provides a computer memory system that includes at least one DIMM connector having a DIMM socket for releasably receiving a terminal edge of a DIMM. A metallic or otherwise highly heat-conductive base is secured to the DIMM connector. A pair of heat spreaders is secured to the base on opposing sides of the DIMM socket. Each heat spreader includes a DIMM-engagement portion spaced from the base. The heat spreaders are nondestructively moveable between an open position spaced apart for receiving the DIMM between the heat spreaders and a closed position for thermally engaging opposing faces of the DIMM. The heat spreaders provide a continuous thermally-conductive pathway between the DIMM-engagement portion and the base. Heatsink fins extend laterally from the base to provide cooling.
摘要翻译：本发明的一个实施例提供了一种计算机存储器系统，其包括具有用于可释放地接收DIMM的终端边缘的DIMM插槽的至少一个DIMM连接器。金属或其他高度导热的基座固定到DIMM连接器。一对散热器在DIMM插槽的相对侧固定到基座。每个散热器包括与基座间隔开的DIMM接合部分。散热器在间隔开的开放位置之间是非破坏性的，以在散热器之间接收DIMM，并且用于热接合DIMM的相对面的闭合位置。散热器在DIMM接合部分和基座之间提供连续的导热通路。散热片从基座横向延伸以提供冷却。

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