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1. 发明授权

US07282647B2 Apparatus for improving coupling across plane discontinuities on circuit boards 有权
标题翻译：用于改善电路板上平面不连续性的耦合的装置
公开(公告)号：US07282647B2
公开(公告)日：2007-10-16
申请号：US10329188
申请日：2002-12-23
申请人： Weston Roth , Jayne L. Mershon , Xang Moua , Jason A. Mix
发明人： Weston Roth , Jayne L. Mershon , Xang Moua , Jason A. Mix
IPC分类号： H05K1/03
CPC分类号： H05K1/0234 , H05K1/0225 , H05K1/0227 , H05K1/023 , H05K1/167 , H05K2201/0195 , H05K2201/0323 , H05K2201/093 , H05K2201/09309 , H05K2201/09663 , Y10T29/49117 , Y10T29/49126 , Y10T29/49155 , Y10T29/49163 , Y10T29/49165
摘要： The invention relates to an apparatus and method for improving coupling across plane discontinuities on circuit boards. A circuit board includes a discontinuity, e.g., a split, slot, or cutout, formed on a voltage reference plane. A conductive layer overlies the discontinuity. The conductive layer has a first portion connected to the underlying reference plane and a second portion spanning the discontinuity. The first portion is connected to the reference plane using a slot or vias. And the conductive layer has a third portion extending over the reference plane but remaining disconnected from it. The conductive layer might be graphite or carbon black.
摘要翻译：本发明涉及一种用于改善电路板上的平面不连续性的耦合的装置和方法。电路板包括形成在电压参考平面上的不连续性，例如分裂，槽或切口。导电层覆盖不连续点。导电层具有连接到下面的参考平面的第一部分和跨越不连续部分的第二部分。第一部分使用插槽或通孔连接到参考平面。并且导电层具有在参考平面上延伸但保持与其断开的第三部分。导电层可以是石墨或炭黑。

2. 发明授权

US07334325B2 Apparatus and method for improving coupling across plane discontinuities on circuit boards 有权
标题翻译：用于改善电路板上的平面不连续性的耦合的装置和方法
公开(公告)号：US07334325B2
公开(公告)日：2008-02-26
申请号：US10990740
申请日：2004-11-16
申请人： Weston Roth , Jayne L. Mershon , Xang Moua , Jason A. Mix
发明人： Weston Roth , Jayne L. Mershon , Xang Moua , Jason A. Mix
IPC分类号： H01K4/10
CPC分类号： H05K1/0234 , H05K1/0225 , H05K1/0227 , H05K1/023 , H05K1/167 , H05K2201/0195 , H05K2201/0323 , H05K2201/093 , H05K2201/09309 , H05K2201/09663 , Y10T29/49117 , Y10T29/49126 , Y10T29/49155 , Y10T29/49163 , Y10T29/49165
摘要： The invention relates to an apparatus and method for improving coupling across plane discontinuities on circuit boards. A circuit board includes a discontinuity, e.g., a split, slot, or cutout, formed on a voltage reference plane. A conductive layer overlies the discontinuity. The conductive layer has a first portion connected to the underlying reference plane and a second portion spanning the discontinuity. The first portion is connected to the reference plane using a slot or vias. And the conductive layer has a third portion extending over the reference plane but remaining disconnected from it. The conductive layer might be graphite or carbon black.
摘要翻译：本发明涉及一种用于改善电路板上的平面不连续性的耦合的装置和方法。电路板包括形成在电压参考平面上的不连续性，例如分裂，槽或切口。导电层覆盖不连续点。导电层具有连接到下面的参考平面的第一部分和跨越不连续部分的第二部分。第一部分使用插槽或通孔连接到参考平面。并且导电层具有在参考平面上延伸但保持与其断开的第三部分。导电层可以是石墨或炭黑。

3. 发明申请

US20050082088A1 Apparatus and method for improving coupling across plane discontinuities on circuit boards 有权
标题翻译：用于改善电路板上的平面不连续性的耦合的装置和方法
公开(公告)号：US20050082088A1
公开(公告)日：2005-04-21
申请号：US10990740
申请日：2004-11-16
申请人： Weston Roth , Jayne Mershon , Xang Moua , Jason Mix
发明人： Weston Roth , Jayne Mershon , Xang Moua , Jason Mix
IPC分类号： H05K1/02 , H05K1/16 , H03H9/00
CPC分类号： H05K1/0234 , H05K1/0225 , H05K1/0227 , H05K1/023 , H05K1/167 , H05K2201/0195 , H05K2201/0323 , H05K2201/093 , H05K2201/09309 , H05K2201/09663 , Y10T29/49117 , Y10T29/49126 , Y10T29/49155 , Y10T29/49163 , Y10T29/49165
摘要： The invention relates to an apparatus and method for improving coupling across plane discontinuities on circuit boards. A circuit board includes a discontinuity, e.g., a split, slot, or cutout, formed on a voltage reference plane. A conductive layer overlies the discontinuity. The conductive layer has a first portion connected to the underlying reference plane and a second portion spanning the discontinuity. The first portion is connected to the reference plane using a slot or vias. And the conductive layer has a third portion extending over the reference plane but remaining disconnected from it. The conductive layer might be graphite or carbon black.
摘要翻译：本发明涉及一种用于改善电路板上的平面不连续性的耦合的装置和方法。电路板包括形成在电压参考平面上的不连续性，例如分裂，槽或切口。导电层覆盖不连续点。导电层具有连接到下面的参考平面的第一部分和跨越不连续部分的第二部分。第一部分使用插槽或通孔连接到参考平面。并且导电层具有在参考平面上延伸但保持与其断开的第三部分。导电层可以是石墨或炭黑。

4. 发明申请

US20060024060A1 Apparatus and method for optical interconnects on a carrier substrate 审中-公开
标题翻译：载体基板上的光学互连的装置和方法
公开(公告)号：US20060024060A1
公开(公告)日：2006-02-02
申请号：US10902979
申请日：2004-07-30
申请人： Weston Roth , James Jackson
发明人： Weston Roth , James Jackson
IPC分类号： H04B10/00
CPC分类号： G02B6/43
摘要： Numerous embodiments are described of an apparatus and method for line-of-sight, optical signal channel propagating in free-space for interconnectivity between semiconductor packages on a carrier substrate. In one embodiment, a first semiconductor package and a second semiconductor package are coupled to the carrier substrate. A free-space, line-of-sight optical signaling channel is formed between a first semiconductor package and a second semiconductor package. An optical emitter on the first semiconductor package propagates an optical signal to an optical detector on the second semiconductor package along the free-space, line-of-sight optical signaling channel.
摘要翻译：描述了用于在自由空间中传播用于视线的光信号通道的装置和方法的许多实施例，用于载体衬底上的半导体封装之间的互连。在一个实施例中，第一半导体封装和第二半导体封装耦合到载体衬底。在第一半导体封装和第二半导体封装之间形成自由空间的视线光信号通道。第一半导体封装上的光发射器沿着自由空间的视线光信令通道将光信号传播到第二半导体封装上的光检测器。

5. 发明申请

US20050134507A1 Ceramic embedded wireless antenna 有权
标题翻译：陶瓷嵌入式无线天线
公开(公告)号：US20050134507A1
公开(公告)日：2005-06-23
申请号：US10746462
申请日：2003-12-23
申请人： Terrance Dishongh , Weston Roth , Damion Searls , Tom Pearson
发明人： Terrance Dishongh , Weston Roth , Damion Searls , Tom Pearson
IPC分类号： H01L21/00 , H01L21/56 , H01L21/8238 , H01L23/36 , H01L23/367 , H01L23/373 , H01L23/66 , H01Q1/40
CPC分类号： H01L23/66 , H01L21/563 , H01L23/36 , H01L23/3675 , H01L23/3677 , H01L23/3731 , H01L2223/6677 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2924/00014 , H01L2924/0102 , H01L2924/01079 , H01L2924/09701 , H01L2924/15192 , H01L2924/16152 , H01Q1/40 , H01L2924/00 , H01L2224/05599
摘要： Apparatus and methods of fabricating antennae embedded within a ceramic material, such as a low temperature co-fired ceramic. Such ceramic material has a low coefficient of thermal expansion which reduces expansion and contraction stresses that can cause the signal transmission frequency to change and thereby affecting proper signal transmission.
摘要翻译：嵌入在陶瓷材料（如低温共烧陶瓷）中的天线的制造装置和方法。这种陶瓷材料具有低的热膨胀系数，其减小了可能导致信号传输频率改变并从而影响适当的信号传输的伸缩应力。

6. 发明授权

US07495318B2 Apparatus and method for improving AC coupling on circuit boards 有权
标题翻译：改善电路板上交流耦合的装置和方法
公开(公告)号：US07495318B2
公开(公告)日：2009-02-24
申请号：US11120393
申请日：2005-05-02
申请人： Weston Roth , Damion T. Searls , James D. Jackson
发明人： Weston Roth , Damion T. Searls , James D. Jackson
IPC分类号： H01L23/58
CPC分类号： H01L23/642 , H01L2924/0002 , H05K1/0216 , H05K1/162 , H05K3/02 , H05K2201/093 , H05K2201/09663 , H05K2203/0315 , H05K2203/0796 , H05K2203/095 , H05K2203/1142 , H01L2924/00
摘要： The invention relates to an apparatus and method for improving AC coupling between adjacent signal traces and between plane splits and signals spanning plane splits on circuit boards. A circuit board includes adjacent conductive means and an oxide means interposed there between. The oxide means is a copper oxide, e.g., cupric or cuprous oxide. In one embodiment, the adjacent conductive means are adjacent voltage reference planes with a split interposed between the conductive means. The copper oxide fills the split. In another embodiment, the adjacent conductive means are differential signal traces. The copper oxide fills a gap between the differential signal traces. The copper oxide is a non-conductive material with an increased dielectric constant as compared to other common dielectric materials used as fillers. The increased dielectric constant increases capacitance, in turn, increasing AC coupling.
摘要翻译：本发明涉及一种用于改善相邻信号迹线之间以及平面分裂之间的交流耦合的装置和方法以及跨越电路板上的平面分裂的信号。电路板包括相邻的导电装置和插入其间的氧化物装置。氧化物是氧化铜，例如铜或氧化亚铜。在一个实施例中，相邻的导电装置是相邻的电压参考平面，其间插入在导电装置之间。氧化铜填充分流。在另一个实施例中，相邻的导电装置是差分信号迹线。氧化铜填充差分信号迹线之间的间隙。与用作填料的其它常用绝缘材料相比，氧化铜是一种具有增加的介电常数的非导电材料。增加的介电常数增加了电容，进而增加了交流耦合。

7. 发明授权

US06905979B2 Apparatus and method for improving AC coupling on circuit boards 失效
标题翻译：改善电路板上交流耦合的装置和方法
公开(公告)号：US06905979B2
公开(公告)日：2005-06-14
申请号：US10329210
申请日：2002-12-23
申请人： Weston Roth , Damion T. Searls , James D. Jackson
发明人： Weston Roth , Damion T. Searls , James D. Jackson
IPC分类号： H01L23/64 , H05K1/02 , H05K1/16 , H05K3/02 , H01L21/31
CPC分类号： H01L23/642 , H01L2924/0002 , H05K1/0216 , H05K1/162 , H05K3/02 , H05K2201/093 , H05K2201/09663 , H05K2203/0315 , H05K2203/0796 , H05K2203/095 , H05K2203/1142 , H01L2924/00
摘要： The invention relates to an apparatus and method for improving AC coupling between adjacent signal traces and between plane splits and signals spanning plane splits on circuit boards. A circuit board includes adjacent conductive means and an oxide means interposed there between. The oxide means is a copper oxide, e.g., cupric or cuprous oxide. In one embodiment, the adjacent conductive means are adjacent voltage reference planes with a split interposed between the conductive means. The copper oxide fills the split. In another embodiment, the adjacent conductive means are differential signal traces. The copper oxide fills a gap between the differential signal traces. The copper oxide is a non-conductive material with an increased dielectric constant as compared to other common dielectric materials used as fillers. The increased dielectric constant increases capacitance, in turn, increasing AC coupling.
摘要翻译：本发明涉及一种用于改善相邻信号迹线之间以及平面分裂之间的交流耦合的装置和方法以及跨越电路板上的平面分裂的信号。电路板包括相邻的导电装置和插入其间的氧化物装置。氧化物是氧化铜，例如铜或氧化亚铜。在一个实施例中，相邻的导电装置是相邻的电压参考平面，其间插入在导电装置之间。氧化铜填充分流。在另一个实施例中，相邻的导电装置是差分信号迹线。氧化铜填充差分信号迹线之间的间隙。与用作填料的其它常用绝缘材料相比，氧化铜是一种具有增加的介电常数的非导电材料。增加的介电常数增加了电容，进而增加了交流耦合。

8. 发明申请

US20120224331A1 LOW PROFILE SOLDER GRID ARRAY TECHNOLOGY FOR PRINTED CIRCUIT BOARD SURFACE MOUNT COMPONENTS 审中-公开
标题翻译：印刷电路板表面安装组件的低剖面焊盘阵列技术
公开(公告)号：US20120224331A1
公开(公告)日：2012-09-06
申请号：US13473847
申请日：2012-05-17
申请人： Weston Roth , Kevin Byrd , Damion Searls , James D. Jackson
发明人： Weston Roth , Kevin Byrd , Damion Searls , James D. Jackson
IPC分类号： H05K7/00
CPC分类号： H05K3/3484 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2924/00014 , H01L2924/01322 , H01L2924/01327 , H01L2924/15311 , H05K3/3436 , H05K3/3463 , H05K2201/10719 , H05K2201/10992 , H05K2203/043 , Y02P70/613 , H01L2924/00 , H01L2224/05599
摘要： A standoff contact array is disposed between a mounting substrate of a flip-chip package and a board. The standoff contact array is formable by mating a low-profile solder bump on the mounting substrate with a low-profile solder paste on the board. Thereafter, the standoff contact array is formed by reflowing the low-profile solder paste on the board against the low-profile solder bump on the mounting substrate.
摘要翻译：间隔接触阵列设置在倒装芯片封装的安装基板和基板之间。通过将安装基板上的低轮廓焊料凸块与板上的低轮廓焊膏配合，可以形成对位接触阵列。此后，通过将板上的低轮廓焊膏回流到安装基板上的低轮廓焊料凸块上来形成间隔接触阵列。

9. 发明申请

US20050195579A1 Apparatus and method for improving AC coupling on circuit boards 有权
公开(公告)号：US20050195579A1
公开(公告)日：2005-09-08
申请号：US11120393
申请日：2005-05-02
申请人： Weston Roth , Damion Searls , James Jackson
发明人： Weston Roth , Damion Searls , James Jackson
IPC分类号： H01L23/64 , H05K1/02 , H05K1/16 , H05K3/02 , H05K3/00 , B05D5/12 , B29B15/10 , C23C28/00 , H05K1/00
CPC分类号： H01L23/642 , H01L2924/0002 , H05K1/0216 , H05K1/162 , H05K3/02 , H05K2201/093 , H05K2201/09663 , H05K2203/0315 , H05K2203/0796 , H05K2203/095 , H05K2203/1142 , H01L2924/00
摘要： The invention relates to an apparatus and method for improving AC coupling between adjacent signal traces and between plane splits and signals spanning plane splits on circuit boards. A circuit board includes adjacent conductive means and an oxide means interposed there between. The oxide means is a copper oxide, e.g., cupric or cuprous oxide. In one embodiment, the adjacent conductive means are adjacent voltage reference planes with a split interposed between the conductive means. The copper oxide fills the split. In another embodiment, the adjacent conductive means are differential signal traces. The copper oxide fills a gap between the differential signal traces. The copper oxide is a non-conductive material with an increased dielectric constant as compared to other common dielectric materials used as fillers. The increased dielectric constant increases capacitance, in turn, increasing AC coupling.

10. 发明授权

US06884087B2 Socket with multiple contact pad area socket contacts 有权
标题翻译：插座带有多个接触垫区域插座触点
公开(公告)号：US06884087B2
公开(公告)日：2005-04-26
申请号：US10671133
申请日：2003-09-24
申请人： Damion Searls , Thomas Morgan , Weston Roth
发明人： Damion Searls , Thomas Morgan , Weston Roth
IPC分类号： H01R12/00
CPC分类号： H01R12/57 , H01R12/52
摘要： A socket including multiple contact areas socket contacts is provided. The multiple contact areas enable the placement of components, such as capacitors, resistors, diodes and the like between the socket and a substrate.
摘要翻译：提供了包括多个接触区域插座触点的插座。多个接触区域能够在插座和基板之间放置诸如电容器，电阻器，二极管等的部件。

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