专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20050195579A1 Apparatus and method for improving AC coupling on circuit boards 有权
公开(公告)号：US20050195579A1
公开(公告)日：2005-09-08
申请号：US11120393
申请日：2005-05-02
申请人： Weston Roth , Damion Searls , James Jackson
发明人： Weston Roth , Damion Searls , James Jackson
IPC分类号： H01L23/64 , H05K1/02 , H05K1/16 , H05K3/02 , H05K3/00 , B05D5/12 , B29B15/10 , C23C28/00 , H05K1/00
CPC分类号： H01L23/642 , H01L2924/0002 , H05K1/0216 , H05K1/162 , H05K3/02 , H05K2201/093 , H05K2201/09663 , H05K2203/0315 , H05K2203/0796 , H05K2203/095 , H05K2203/1142 , H01L2924/00
摘要： The invention relates to an apparatus and method for improving AC coupling between adjacent signal traces and between plane splits and signals spanning plane splits on circuit boards. A circuit board includes adjacent conductive means and an oxide means interposed there between. The oxide means is a copper oxide, e.g., cupric or cuprous oxide. In one embodiment, the adjacent conductive means are adjacent voltage reference planes with a split interposed between the conductive means. The copper oxide fills the split. In another embodiment, the adjacent conductive means are differential signal traces. The copper oxide fills a gap between the differential signal traces. The copper oxide is a non-conductive material with an increased dielectric constant as compared to other common dielectric materials used as fillers. The increased dielectric constant increases capacitance, in turn, increasing AC coupling.

2. 发明申请

US20060024002A1 Electro-optic surface mount light pipe and connector 有权
标题翻译：电光表面贴装灯管和连接器
公开(公告)号：US20060024002A1
公开(公告)日：2006-02-02
申请号：US10909746
申请日：2004-08-02
申请人： Weston Roth , Damion Searls , Thomas Morgan , James Jackson
发明人： Weston Roth , Damion Searls , Thomas Morgan , James Jackson
IPC分类号： G02B6/42
CPC分类号： G02B6/43 , G02B6/423 , G02B6/4238
摘要： A method includes providing a light pipe having a metallized end surface, and soldering the metallized end surface of the light pipe to a surface of a substrate. Other embodiments are described and claimed.
摘要翻译：一种方法包括提供具有金属化端面的光管，以及将光管的金属化端面焊接到基板的表面。描述和要求保护其他实施例。

3. 发明申请

US20050068788A1 Electro-optic through-hole mount light pipe and connector 审中-公开
标题翻译：电光通孔安装灯管和连接器
公开(公告)号：US20050068788A1
公开(公告)日：2005-03-31
申请号：US10676627
申请日：2003-09-30
申请人： Weston Roth , Damion Searls , Thomas Morgan , James Jackson
发明人： Weston Roth , Damion Searls , Thomas Morgan , James Jackson
IPC分类号： G02B6/36 , G02B6/42 , G02B6/00
CPC分类号： G02B6/4238 , G02B6/3644 , G02B6/3664
摘要： A light pipe component designed with optically transparent material capable of transmitting and/or guiding optical wavelengths. The outer surface of each light pipe being coated with a metallic surface finish, with the exception of the ends of the light pipe. The light pipe component being placed on a PCB to form solder joints between the metallic surface finish of the light pipes and the PTH. The solder joints may now be used for transmitting both optical signals and electrical signals per each physical connection of the light pipes.
摘要翻译：一种光管部件，设计有能够传输和/或引导光波长的光学透明材料。除了光管的端部之外，每个光管的外表面被涂覆有金属表面光洁度。光管部件被放置在PCB上以在光管的金属表面光洁度和PTH之间形成焊接接头。焊点可以用于每个光管的每个物理连接传输光信号和电信号。

4. 发明申请

US20050134507A1 Ceramic embedded wireless antenna 有权
标题翻译：陶瓷嵌入式无线天线
公开(公告)号：US20050134507A1
公开(公告)日：2005-06-23
申请号：US10746462
申请日：2003-12-23
申请人： Terrance Dishongh , Weston Roth , Damion Searls , Tom Pearson
发明人： Terrance Dishongh , Weston Roth , Damion Searls , Tom Pearson
IPC分类号： H01L21/00 , H01L21/56 , H01L21/8238 , H01L23/36 , H01L23/367 , H01L23/373 , H01L23/66 , H01Q1/40
CPC分类号： H01L23/66 , H01L21/563 , H01L23/36 , H01L23/3675 , H01L23/3677 , H01L23/3731 , H01L2223/6677 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2924/00014 , H01L2924/0102 , H01L2924/01079 , H01L2924/09701 , H01L2924/15192 , H01L2924/16152 , H01Q1/40 , H01L2924/00 , H01L2224/05599
摘要： Apparatus and methods of fabricating antennae embedded within a ceramic material, such as a low temperature co-fired ceramic. Such ceramic material has a low coefficient of thermal expansion which reduces expansion and contraction stresses that can cause the signal transmission frequency to change and thereby affecting proper signal transmission.
摘要翻译：嵌入在陶瓷材料（如低温共烧陶瓷）中的天线的制造装置和方法。这种陶瓷材料具有低的热膨胀系数，其减小了可能导致信号传输频率改变并从而影响适当的信号传输的伸缩应力。

5. 发明申请

US20120224331A1 LOW PROFILE SOLDER GRID ARRAY TECHNOLOGY FOR PRINTED CIRCUIT BOARD SURFACE MOUNT COMPONENTS 审中-公开
标题翻译：印刷电路板表面安装组件的低剖面焊盘阵列技术
公开(公告)号：US20120224331A1
公开(公告)日：2012-09-06
申请号：US13473847
申请日：2012-05-17
申请人： Weston Roth , Kevin Byrd , Damion Searls , James D. Jackson
发明人： Weston Roth , Kevin Byrd , Damion Searls , James D. Jackson
IPC分类号： H05K7/00
CPC分类号： H05K3/3484 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2924/00014 , H01L2924/01322 , H01L2924/01327 , H01L2924/15311 , H05K3/3436 , H05K3/3463 , H05K2201/10719 , H05K2201/10992 , H05K2203/043 , Y02P70/613 , H01L2924/00 , H01L2224/05599
摘要： A standoff contact array is disposed between a mounting substrate of a flip-chip package and a board. The standoff contact array is formable by mating a low-profile solder bump on the mounting substrate with a low-profile solder paste on the board. Thereafter, the standoff contact array is formed by reflowing the low-profile solder paste on the board against the low-profile solder bump on the mounting substrate.
摘要翻译：间隔接触阵列设置在倒装芯片封装的安装基板和基板之间。通过将安装基板上的低轮廓焊料凸块与板上的低轮廓焊膏配合，可以形成对位接触阵列。此后，通过将板上的低轮廓焊膏回流到安装基板上的低轮廓焊料凸块上来形成间隔接触阵列。

6. 发明授权

US06884087B2 Socket with multiple contact pad area socket contacts 有权
标题翻译：插座带有多个接触垫区域插座触点
公开(公告)号：US06884087B2
公开(公告)日：2005-04-26
申请号：US10671133
申请日：2003-09-24
申请人： Damion Searls , Thomas Morgan , Weston Roth
发明人： Damion Searls , Thomas Morgan , Weston Roth
IPC分类号： H01R12/00
CPC分类号： H01R12/57 , H01R12/52
摘要： A socket including multiple contact areas socket contacts is provided. The multiple contact areas enable the placement of components, such as capacitors, resistors, diodes and the like between the socket and a substrate.
摘要翻译：提供了包括多个接触区域插座触点的插座。多个接触区域能够在插座和基板之间放置诸如电容器，电阻器，二极管等的部件。

7. 发明申请

US20090310320A1 Low profile solder grid array technology for printed circuit board surface mount components 审中-公开
标题翻译：薄型焊料阵列技术用于印刷电路板表面贴装元件
公开(公告)号：US20090310320A1
公开(公告)日：2009-12-17
申请号：US12214006
申请日：2008-06-16
申请人： Weston Roth , Kevin Byrd , Damion Searls , James D. Jackson
发明人： Weston Roth , Kevin Byrd , Damion Searls , James D. Jackson
IPC分类号： H05K7/06 , H05K3/34
CPC分类号： H05K3/3484 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2924/00014 , H01L2924/01322 , H01L2924/01327 , H01L2924/15311 , H05K3/3436 , H05K3/3463 , H05K2201/10719 , H05K2201/10992 , H05K2203/043 , Y02P70/613 , H01L2924/00 , H01L2224/05599
摘要： A standoff contact array is disposed between a mounting substrate of a flip-chip package and a board. The standoff contact array is formable by mating a low-profile solder bump on the mounting substrate with a low-profile solder paste on the board. Thereafter, the standoff contact array is formed by reflowing the low-profile solder paste on the board against the low-profile solder bump on the mounting substrate.
摘要翻译：间隔接触阵列设置在倒装芯片封装的安装基板和基板之间。通过将安装基板上的低轮廓焊料凸块与板上的低轮廓焊膏配合，可以形成对位接触阵列。此后，通过将板上的低轮廓焊膏回流到安装基板上的低轮廓焊料凸块上来形成间隔接触阵列。

8. 发明申请

US20050064739A1 SOCKET WITH MULTIPLE CONTACT PAD AREA SOCKET CONTACTS 有权
标题翻译：带多个接触垫片区域插座联系人
公开(公告)号：US20050064739A1
公开(公告)日：2005-03-24
申请号：US10671133
申请日：2003-09-24
申请人： Damion Searls , Thomas Morgan , Weston Roth
发明人： Damion Searls , Thomas Morgan , Weston Roth
IPC分类号： H01R12/00
CPC分类号： H01R12/57 , H01R12/52
摘要： A socket including multiple contact areas socket contacts is provided. The multiple contact areas enable the placement of components, such as capacitors, resistors, diodes and the like between the socket and a substrate.
摘要翻译：提供了包括多个接触区域插座触点的插座。多个接触区域能够在插座和基板之间放置诸如电容器，电阻器，二极管等的部件。

9. 发明申请

US20070092689A1 METHOD OF FABRICATING FLEXIBLE DISPLAY 有权
标题翻译：制造柔性显示的方法
公开(公告)号：US20070092689A1
公开(公告)日：2007-04-26
申请号：US11561068
申请日：2006-11-17
申请人： James Jackson , Terrance Dishongh , Damion Searls
发明人： James Jackson , Terrance Dishongh , Damion Searls
IPC分类号： B32B3/06 , G09G3/34 , B32B5/16
CPC分类号： G02F1/091 , G09F9/375 , Y10T428/24008 , Y10T428/25
摘要： A method of fabricating a flexible display, the method comprising selecting a first flexible sheet and a second flexible sheet; and forming a number of magnetic display elements having magnetically controllable reflectivity between the first flexible sheet and the second flexible sheet. In some embodiments, a display includes pixels having a magnetically controllable reflectivity. The pixels are formed between a pair of flexible non-conductive sheets. Each of the magnetically controllable pixels includes a flexible ring located between the flexible non-conductive sheets. Each of the magnetically controllable pixels also includes magnetic particles located within the flexible ring. The location of the magnetic particles with respect to the flexible non-conductive sheets determines the reflectivity of the pixel. The display is especially suitable for use in connection with portable electronic devices.
摘要翻译：一种制造柔性显示器的方法，所述方法包括选择第一柔性片和第二柔性片; 以及在所述第一柔性片和所述第二柔性片之间形成具有磁性可控反射率的多个磁性显示元件。在一些实施例中，显示器包括具有磁可控反射率的像素。像素形成在一对柔性非导电片之间。每个磁性可控像素包括位于柔性非导电片之间的柔性环。每个磁性可控像素还包括位于柔性环内的磁性颗粒。磁性颗粒相对于柔性非导电片的位置确定像素的反射率。显示器特别适用于便携式电子设备的使用。

10. 发明授权

US06906921B2 Channeled heat dissipation device and a method of fabrication 失效
标题翻译：引导散热装置及其制造方法
公开(公告)号：US06906921B2
公开(公告)日：2005-06-14
申请号：US10756703
申请日：2004-01-12
申请人： Damion Searls , Tom Pearson , James Jackson
发明人： Damion Searls , Tom Pearson , James Jackson
IPC分类号： H01L23/467 , H05K7/20
CPC分类号： H01L23/467 , H01L2224/16 , H01L2224/73253 , H01L2924/00014 , H01L2224/0401
摘要： Numerous embodiments of a channeled heat dissipation device and a method of fabrication are disclosed. In one embodiment, a channeled heat dissipation device comprises a base portion having a dissipation surface and a substantially opposed mounting surface, and at least one channel defined in the base portion, wherein said at least one channel extends from said dissipation surface to said mounting surface.
摘要翻译：公开了通道散热装置和制造方法的许多实施例。在一个实施例中，通道散热装置包括具有耗散表面和基本上相对的安装表面的基部以及限定在基部中的至少一个通道，其中所述至少一个通道从所述耗散表面延伸到所述安装表面。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式