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    • 7. 发明授权
    • Apparatus for ROM cells
    • ROM电池装置
    • US08750011B2
    • 2014-06-10
    • US13423968
    • 2012-03-19
    • Jhon-Jhy Liaw
    • Jhon-Jhy Liaw
    • G11C5/06
    • G11C17/12H01L27/0207H01L27/0924H01L27/11226H01L27/1211
    • A ROM cell comprises a first first-level contact formed on a first active region of a transistor of a memory cell, a first second-level contact formed on the first first-level contact, wherein the first second-level contact shifts in a first direction with reference to the first first-level contact. The ROM cell further comprises a second first-level contact formed on a second active region of the transistor of the memory cell, wherein the second first-level contact is aligned with the first first-level contact and a second second-level formed on the second first-level contact, wherein the second second-level contact shifts in a second direction with reference to the second first-level contact, and wherein the first direction is opposite to the second direction.
    • ROM单元包括形成在存储单元的晶体管的第一有源区上的第一第一电平触点,形成在第一第一级触点上的第一二级触点,其中第一二级触点以第一 方向参考第一级联系人。 ROM单元还包括形成在存储器单元的晶体管的第二有源区上的第二第一电平触点,其中第二第一电平触点与第一第一电平触点对准,第二二级触点形成在第二电平触点上 第二第一级触点,其中所述第二二级触头相对于所述第二第一级触点沿第二方向移动,并且其中所述第一方向与所述第二方向相反。
    • 8. 发明授权
    • Memory cell
    • US08625334B2
    • 2014-01-07
    • US13328685
    • 2011-12-16
    • Jhon-Jhy Liaw
    • Jhon-Jhy Liaw
    • G11C11/00
    • G11C11/412H01L27/1104
    • A memory cell and array and a method of forming a memory cell and array are described. A memory cell includes first and second pull-up transistors, first and second pull-down transistors, first and second pass-gate transistors, and first and second isolation transistors. Drains of the first pull-up and first pull-down transistors are electrically coupled together at a first node. Drains of the second pull-up and second pull-down transistors are electrically coupled together at a second node. Gates of the second pull-up and second pull-down transistors are electrically coupled to the first node, and gates of the first pull-up and first pull-down transistors are electrically coupled to the second node. The first and second pass-gate transistors are electrically coupled to the first and second nodes, respectively. The first and second isolation transistors are electrically coupled to the first and second nodes, respectively.
    • 10. 发明授权
    • Shallow trench isolation with improved structure and method of forming
    • 浅沟隔离具有改进的结构和成型方法
    • US08409964B2
    • 2013-04-02
    • US13399488
    • 2012-02-17
    • Jhon-Jhy LiawChao-Cheng ChenChia-Wei Chang
    • Jhon-Jhy LiawChao-Cheng ChenChia-Wei Chang
    • H01L21/76
    • H01L21/823878H01L21/76232
    • A shallow trench isolation (STI) structure and methods of forming a STI structure are disclosed. An embodiment is a method for forming a semiconductor structure. The method includes forming a recess in a semiconductor substrate; forming a first material on sidewalls of the recess; forming a widened recessed portion through a bottom surface of the recess; removing the first material from the sidewalls of the recess; and forming a dielectric material in the recess and the widened recessed portion. The bottom surface of the recess is exposed through the first material, and the bottom surface of the recess has a first width. The widened recessed portion has a second width. The second width is greater than the first width.
    • 公开了浅沟槽隔离(STI)结构和形成STI结构的方法。 实施例是形成半导体结构的方法。 该方法包括在半导体衬底中形成凹陷; 在所述凹部的侧壁上形成第一材料; 通过所述凹部的底面形成加宽的凹部; 从所述凹部的侧壁去除所述第一材料; 以及在所述凹部和所述加宽的凹部中形成介电材料。 凹部的底面通过第一材料露出,凹部的底面具有第一宽度。 加宽的凹部具有第二宽度。 第二宽度大于第一宽度。