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1. 发明申请

US20050259700A1 Optically pumpable surface-emitting semiconductor laser device 审中-公开
标题翻译：光泵浦表面发射半导体激光器件
公开(公告)号：US20050259700A1
公开(公告)日：2005-11-24
申请号：US11188203
申请日：2005-07-22
申请人： Werner Spath , Johann Luft , Stephan Lutgen , Norbert Linder , Tony Albrecht , Ulrich Steegmuller
发明人： Werner Spath , Johann Luft , Stephan Lutgen , Norbert Linder , Tony Albrecht , Ulrich Steegmuller
IPC分类号： H01S5/026 , H01S5/04 , H01S5/062 , H01S5/10 , H01S5/14 , H01S5/183 , H01S3/10
CPC分类号： H01S5/141 , H01S5/026 , H01S5/041 , H01S5/06226 , H01S5/1032 , H01S5/1071 , H01S5/18305 , H01S5/1835 , H01S5/4056
摘要： In an optically pumpable surface-emitting semiconductor laser device with a vertical emitter with a radiation-generating active layer, at least one modulation radiation source for modulating the output power of the surface-emitting semiconductor device is provided. The modulation radiation source is formed by an edge-emitting semiconductor structure with an active layer, and which is disposed such that during operation it radiates into the radiation-generating active layer of the vertical emitter. This produces an easily modulatable surface-emitting laser source of high power and high beam quality. A pumping radiation source for optically pumping the active layer of the vertical emitter is preferably provided in the semiconductor laser device.
摘要翻译：在具有具有辐射发生有源层的垂直发射器的可光学泵浦的表面发射半导体激光器件中，提供用于调制表面发射半导体器件的输出功率的至少一个调制辐射源。调制辐射源由具有有源层的边缘发射半导体结构形成，并且其被设置为使得在操作期间辐射到垂直发射极的辐射生成有源层。这产生了高功率和高光束质量的容易调制的表面发射激光源。优选地，在半导体激光器件中设置用于光学泵浦垂直发射极的有源层的泵浦辐射源。

2. 发明申请

US20090201958A1 Lateral optically pumped surface-emitting semiconductor laser on a heat sink 有权
标题翻译：横向光泵浦表面发射半导体激光器在散热片上
公开(公告)号：US20090201958A1
公开(公告)日：2009-08-13
申请号：US11663617
申请日：2005-09-20
申请人： Tony Albrecht , Stephan Lutgen , Wolfgang Reill , Thomas Schwarz , Ulrich Steegmuller
发明人： Tony Albrecht , Stephan Lutgen , Wolfgang Reill , Thomas Schwarz , Ulrich Steegmuller
IPC分类号： H01S3/04 , H01L21/00 , H01S5/026
CPC分类号： H01S5/02248 , H01L2224/48091 , H01L2224/48227 , H01L2924/19107 , H01S3/0815 , H01S3/109 , H01S5/0217 , H01S5/0224 , H01S5/02272 , H01S5/02476 , H01S5/026 , H01S5/041 , H01S5/141 , H01S5/183 , H01S5/2027 , H01S5/4056 , H01L2924/00014
摘要： A surface emitting semiconductor laser device comprising at least one surface emitting semiconductor laser (21) having a vertical emitter (1) and at least one pump radiation source (2), which are monolithically integrated alongside one another onto a common substrate (13), is described. The semiconductor laser device additionally has a heat-conducting element (18), which is in thermal contact with the semiconductor laser (21) and has a mounting area provided for mounting on a carrier (27). Methods for producing such a surface emitting semiconductor laser device are furthermore described.
摘要翻译：一种表面发射半导体激光器件，包括至少一个具有垂直发射极（1）和至少一个泵浦辐射源（2）的表面发射半导体激光器（21），所述至少一个表面发射半导体激光器（21）沿着彼此一体地堆叠在共同的衬底（13）上，被描述。半导体激光装置还具有与半导体激光器（21）热接触的导热元件（18），并且具有设置用于安装在载体（27）上的安装区域。进一步描述制造这种表面发射半导体激光器件的方法。

3. 发明申请

US20070246721A1 Semiconductor component having a curved mirror and method for producing a semiconductor component having a curved semiconductor body 审中-公开
标题翻译：具有曲面镜的半导体元件及具有弯曲半导体本体的半导体元件的制造方法
公开(公告)号：US20070246721A1
公开(公告)日：2007-10-25
申请号：US11209558
申请日：2005-08-23
申请人： Wolfgang Reill , Ulrich Steegmuller , Tony Albrecht , Wolfgang Schmid
发明人： Wolfgang Reill , Ulrich Steegmuller , Tony Albrecht , Wolfgang Schmid
IPC分类号： H01L29/06 , H01L33/00 , H01L31/00 , H01L31/12 , H01L29/22 , H01L27/15
CPC分类号： H01S5/18388 , H01S3/109 , H01S5/0224 , H01S5/041 , H01S5/141 , H01S5/18383 , H01S5/4056
摘要： A semiconductor component having a semiconductor body, the semiconductor body comprising a curved mirror (3), which is monolithically integrated in the semiconductor body. A method for curving a semiconductor body is also disclosed.
摘要翻译：一种具有半导体本体的半导体部件，该半导体本体包括一个整体地集成在半导体本体中的曲面镜（3）。还公开了一种用于弯曲半导体本体的方法。

4. 发明申请

US20060221439A1 Laser device 审中-公开
标题翻译：激光设备
公开(公告)号：US20060221439A1
公开(公告)日：2006-10-05
申请号：US11388771
申请日：2006-03-23
申请人： Michael Kuhnelt , Thomas Schwarz , Ulrich Steegmuller , Frank Singer
发明人： Michael Kuhnelt , Thomas Schwarz , Ulrich Steegmuller , Frank Singer
IPC分类号： H01S3/00
CPC分类号： H01S3/16 , H01S3/005 , H01S3/025 , H01S3/042 , H01S3/0602 , H01S3/0612 , H01S3/0627 , H01S3/09415 , H01S3/109 , H01S3/1611 , H01S3/1643 , H01S3/1673 , H01S3/2383
摘要： A laser device includes a crystal array comprising a laser gain crystal and an optically nonlinear frequency conversion crystal, plus a pump source suitable for coupling at least two mutually spatially separated pump beams into said crystal array.
摘要翻译：激光装置包括包括激光增益晶体和光学非线性频率转换晶体的晶体阵列，以及适于将至少两个相互空间分离的泵浦光束耦合到所述晶体阵列中的泵浦源。

5. 发明申请

US20070081564A1 Optically pumped surface-emitting semiconductor laser and optical projection apparatus having a semiconductor laser such as this 有权
标题翻译：光泵浦表面发射半导体激光器和具有这种半导体激光器的光学投影装置
公开(公告)号：US20070081564A1
公开(公告)日：2007-04-12
申请号：US11529976
申请日：2006-09-28
申请人： Michael Kuhnelt , Ulrich Steegmuller , Wolfgang Reill , Thomas Schwarz , Frank Singer
发明人： Michael Kuhnelt , Ulrich Steegmuller , Wolfgang Reill , Thomas Schwarz , Frank Singer
IPC分类号： H01S3/098 , H01S3/091
CPC分类号： H01S5/141 , H01S3/0805 , H01S3/109 , H01S5/024 , H01S5/041 , H01S5/18394 , H01S2301/18 , H04N9/3129
摘要： An optically pumped, surface-emitting semiconductor laser having a mode-selective apparatus (7) which is intended for suppression of predeterminable, higher resonator modes of the semiconductor laser. The mode-selective apparatus is arranged in the beam path of a pump beam source (2) of the surface-emitting semiconductor laser.
摘要翻译：一种具有模式选择装置（7）的光泵浦的表面发射半导体激光器，其旨在用于抑制半导体激光器的可预先确定的较高谐振器模式。模式选择装置被布置在表面发射半导体激光器的泵浦光源（2）的光束路径中。

6. 发明申请

US20050226304A1 Surface emitting semiconductor laser having an interference filter 有权
标题翻译：具有干涉滤光片的表面发射半导体激光器
公开(公告)号：US20050226304A1
公开(公告)日：2005-10-13
申请号：US11048269
申请日：2005-01-31
申请人： Thomas Schwarz , Ulrich Steegmuller , Michael Kuhnelt
发明人： Thomas Schwarz , Ulrich Steegmuller , Michael Kuhnelt
IPC分类号： G02F1/37 , H01S5/0687 , H01S5/14 , H01S5/183 , H01S3/08
CPC分类号： H01S5/183 , H01S3/109 , H01S5/041 , H01S5/141
摘要： A surface emitting semiconductor laser includes a semiconductor chip (1), which emits radiation (12) and contains a first resonator mirror (3). A second resonator mirror (6) is arranged outside the semiconductor chip (1). The first resonator mirror (3) and the second resonator mirror (6) form a laser resonator for the radiation (12) emitted by the semiconductor chip (1). The laser resonator contains an interference filter (9, 17), which is formed from an interference layer system comprising a plurality of dielectric layers.
摘要翻译：表面发射半导体激光器包括发射辐射（12）并包含第一谐振镜（3）的半导体芯片（1）。第二谐振器反射镜（6）布置在半导体芯片（1）的外部。第一谐振镜（3）和第二谐振镜（6）形成用于由半导体芯片（1）发射的辐射（12）的激光谐振器。激光谐振器包含由包括多个电介质层的干涉层系统形成的干涉滤光器（9,17）。

7. 发明申请

US20090246898A1 Vertically Emitting, Optically Pumped Semiconductor Having and External Resonator on a Separate Substrate 有权
标题翻译：垂直发射，光泵浦半导体在独立基板上具有和外部谐振器
公开(公告)号：US20090246898A1
公开(公告)日：2009-10-01
申请号：US12087291
申请日：2006-12-29
申请人： Ulrich Steegmuller , Frank Singer , Thomas Schwarz , Roland Schulz
发明人： Ulrich Steegmuller , Frank Singer , Thomas Schwarz , Roland Schulz
IPC分类号： H01L21/50
CPC分类号： H01S5/14 , H01L2224/48465 , H01L2224/49175 , H01L2924/01012 , H01L2924/01019 , H01L2924/01025 , H01L2924/01057 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/10253 , H01L2924/181 , H01S3/109 , H01S5/005 , H01S5/0071 , H01S5/0206 , H01S5/02248 , H01S5/02272 , H01S5/02407 , H01S5/02415 , H01S5/02438 , H01S5/041 , H01S5/0612 , H01S5/183 , H01S5/4025 , H01L2924/00 , H01L2924/00012
摘要： A method for fabricating an optically pumped semiconductor apparatus, having the following steps: provision of a connection carrier assembly (50) comprising a plurality of connection carriers (14) which are permanently connected to one another mechanically, arrangement of a surface-emitting semiconductor body (1) on a connection carrier (14) in the connection carrier assembly (50), and separation of the connection carrier assembly (50) into individual semiconductor apparatuses.
摘要翻译：一种用于制造光泵浦半导体器件的方法，具有以下步骤：提供包括多个连接载体（14）的连接载体组件（50），所述多个连接载体（14）机械地彼此永久连接，所述表面发射半导体主体（1）连接在连接托架组件（50）中的连接托架（14）上，并且将连接托架组件（50）分离成单独的半导体设备。

8. 发明申请

US20090003393A1 SOLID-STATE LASER DEVICE WITH A CRYSTAL ARRAY 有权
标题翻译：具有晶体阵列的固体激光器件
公开(公告)号：US20090003393A1
公开(公告)日：2009-01-01
申请号：US12170238
申请日：2008-07-09
申请人： Michael Kuhnelt , Thomas Schwarz , Ulrich Steegmuller , Frank Singer
发明人： Michael Kuhnelt , Thomas Schwarz , Ulrich Steegmuller , Frank Singer
IPC分类号： H01S3/10 , H01S3/091
CPC分类号： H01S3/16 , H01S3/005 , H01S3/025 , H01S3/042 , H01S3/0602 , H01S3/0612 , H01S3/0627 , H01S3/09415 , H01S3/109 , H01S3/1611 , H01S3/1643 , H01S3/1673 , H01S3/2383
摘要： In a laser device, a crystal array includes a laser gain crystal and an optically non-linear frequency conversion crystal. A pump source couples at least two mutually spatially separated pump beams into the crystal array. Between two pump beams, a saw kerf of the crystal array extends parallel to the pump beams.
摘要翻译：在激光装置中，晶体阵列包括激光增益晶体和光学非线性变换晶体。泵浦源将至少两个相互空间分离的泵浦光束耦合到晶体阵列中。在两个泵浦梁之间，晶体阵列的锯切平行于泵浦梁延伸。

9. 发明申请

US20050199890A1 Device with a radiation-emitting semiconductor component and procedure for the temperature stabilization of a radiation-emitting semiconductor component 有权
标题翻译：具有辐射发射半导体部件的装置和用于辐射发射半导体部件的温度稳定的程序
公开(公告)号：US20050199890A1
公开(公告)日：2005-09-15
申请号：US11065653
申请日：2005-02-24
申请人： Stefan Morgott , Ulrich Steegmuller , Klaus Friepes
发明人： Stefan Morgott , Ulrich Steegmuller , Klaus Friepes
IPC分类号： H01S5/026 , H01L21/00 , H01L33/00 , H01S5/022 , H01S5/024 , H01S5/06
CPC分类号： H01S5/02453 , H01S5/0612 , H01S5/06804
摘要： A device having at least one radiation-emitting semiconductor component (1), the semiconductor component being assigned at least one electrical heating element (2) designed for heating the semiconductor component. Furthermore, a method for the temperature stabilization of the operating temperature of a radiation-emitting semiconductor component (1) of a device is specified, the semiconductor component being assigned an electrical heating element (2), by means of which the semiconductor component is heated when the operating temperature of the semiconductor component falls below a predetermined desired value of the operating temperature. The semiconductor component can be assigned a temperature sensor (4) for monitoring the operating temperature of the semiconductor component.
摘要翻译：一种具有至少一个辐射发射半导体部件（1）的器件，所述半导体部件被分配至少一个设计用于加热所述半导体部件的电加热元件（2）。此外，规定了用于装置的发射辐射半导体部件（1）的工作温度的温度稳定的方法，该半导体部件被分配有电加热元件（2），半导体部件被加热当半导体组件的工作温度低于工作温度的预定期望值时。可以为半导体部件分配用于监测半导体部件的工作温度的温度传感器（4）。

10. 发明申请

US20110280025A1 Compact Housing 有权
标题翻译：紧凑型住宅
公开(公告)号：US20110280025A1
公开(公告)日：2011-11-17
申请号：US12809694
申请日：2008-11-24
申请人： Thomas Schwarz , Ulrich Steegmuller , Michael Kuhnelt , Roland Schulz
发明人： Thomas Schwarz , Ulrich Steegmuller , Michael Kuhnelt , Roland Schulz
IPC分类号： F21V29/00 , F21V15/01
CPC分类号： H04N9/315 , H01S5/005 , H01S5/0071 , H01S5/02208 , H01S5/02248 , H01S5/02415 , H01S5/02438 , H01S5/4093
摘要： A compact housing comprises a one-piece mounting plate made from a metallic material, which is designed to be joined thermally conductively by a main side to an external support not belonging to the compact housing. Furthermore, the compact housing comprises a one-piece housing cover, which is joined permanently to the mounting plate and therewith encloses a volume. In addition, the compact housing contains at least one electrical feedthrough, such that at least one electrically conductive connection may be produced therewith from inside the volume to outside the volume, this connection being insulated electrically from the mounting plate. Within the volume a module is located which is designed to emit electromagnetic radiation. This module is applied directly to the mounting plate, such that the joint face between mounting plate and module is substantially parallel to the main side of the mounting plate joined to the external support.
摘要翻译：紧凑的壳体包括由金属材料制成的一体式安装板，其被设计成通过主侧导热地连接到不属于紧凑壳体的外部支撑件。此外，紧凑的壳体包括一体式外壳盖，其永久地连接到安装板并且包围一个体积。此外，紧凑的壳体包含至少一个电馈通，使得至少一个导电连接可以从体积内部到外部产生，该连接与安装板电绝缘。在该体积内，设计用于发射电磁辐射的模块。该模块直接应用于安装板，使得安装板和模块之间的接合面基本上平行于连接到外部支撑件的安装板的主侧。

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