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1. 发明申请

US20060121150A1 Mold core of an injection molding tool 审中-公开
标题翻译：注射成型工具的模芯
公开(公告)号：US20060121150A1
公开(公告)日：2006-06-08
申请号：US10524312
申请日：2003-05-20
申请人： Werner Plass , Manfred Lausenhammer
发明人： Werner Plass , Manfred Lausenhammer
IPC分类号： B29C49/00
CPC分类号： A62B99/00 , A47G9/064 , A62B3/00 , B29B2911/14593 , B29C45/7312 , B29C2045/7362 , B29K2105/253
摘要： A mold core of an injection molding tool for the injection molding of preforms of plastic material. The mold core is in the form of a hollow casing which is closed at one end, with a central axis, an outer surface, an inner surface and a hollow cooling tube. The hollow tube is arranged in the mold core at a spacing from the inner surface and is in communication with coolant feed conduits and coolant discharge conduits. The cooling tube extends coaxially with respect to the mold core over almost the entire length thereof and is provided at the downstream end with an outlet opening and cooling grooves are provided on the inner surface of the mold core.
摘要翻译：用于塑料材料预成型件注射成型的注模工具的模芯。模芯是中空壳体的形式，其在一端封闭，具有中心轴线，外表面，内表面和中空冷却管。中空管以与内表面间隔的方式设置在模芯中，并与冷却剂供给导管和冷却剂排出管道连通。冷却管在其整个长度上相对于模具芯同轴地延伸，并且在下游端设置有出口，并且在模芯的内表面上设置有冷却槽。

2. 发明授权

US07521723B2 Surface emitting semiconductor laser chip and method for producing the chip 有权
标题翻译：表面发射半导体激光芯片及其制造方法
公开(公告)号：US07521723B2
公开(公告)日：2009-04-21
申请号：US10631384
申请日：2003-07-31
申请人： Werner Plass , Christian Jung , Tony Albrecht , Udo Streller
发明人： Werner Plass , Christian Jung , Tony Albrecht , Udo Streller
IPC分类号： H01L21/00
CPC分类号： H01S5/18311 , H01S5/0201 , H01S5/3202
摘要： A surface emitting semiconductor laser chip contains a semiconductor body, which has, at least partly, a crystal structure with principal crystal directions, a radiation exit face, and side faces laterally delimiting the semiconductor body. At least one of the side faces is disposed obliquely with respect to the principal crystal directions.
摘要翻译：表面发射半导体激光器芯片包含半导体本体，至少部分地具有主晶体的晶体结构，辐射出射面和横向限定半导体本体的侧面。至少一个侧面相对于主晶体方向倾斜地设置。

3. 发明授权

US06891199B2 Radiation-emitting semiconductor chip and light-emitting diode 有权
标题翻译：辐射发射半导体芯片和发光二极管
公开(公告)号：US06891199B2
公开(公告)日：2005-05-10
申请号：US10343851
申请日：2001-07-24
申请人： Johannes Baur , Dominik Eisert , Michael Fehrer , Berthold Hahn , Volker Harle , Ulrich Jacob , Werner Plass , Uwe Strauss , Johannes Völkl , Ulrich Zehnder
发明人： Johannes Baur , Dominik Eisert , Michael Fehrer , Berthold Hahn , Volker Harle , Ulrich Jacob , Werner Plass , Uwe Strauss , Johannes Völkl , Ulrich Zehnder
IPC分类号： H01L33/20 , H01L33/24 , H01L29/16
CPC分类号： H01L33/20 , H01L33/24 , H01L2224/48091 , H01L2924/00014
摘要： Proposed for high-performance light-emitting diodes are semiconductor chips (1) whose longitudinal sides are substantially longer than their transverse sides. Light extraction can be substantially improved in this manner.
摘要翻译：用于高性能发光二极管的半导体芯片（1）的纵向边比其横向侧面大得多。以这种方式可以显着改善光提取。

4. 发明申请

US20050098788A1 Surface emitting semiconductor laser chip and method for producing the chip 有权
标题翻译：表面发射半导体激光芯片及其制造方法
公开(公告)号：US20050098788A1
公开(公告)日：2005-05-12
申请号：US10631384
申请日：2003-07-31
申请人： Werner Plass , Christian Jung , Tony Albrecht , Udo Streller
发明人： Werner Plass , Christian Jung , Tony Albrecht , Udo Streller
IPC分类号： H01L21/00 , H01L33/00 , H01S5/02 , H01S5/183
CPC分类号： H01S5/18311 , H01S5/0201 , H01S5/3202
摘要： A surface emitting semiconductor laser chip contains a semiconductor body, which has, at least partly, a crystal structure with principal crystal directions, a radiation exit face, and side faces laterally delimiting the semiconductor body. At least one of the side faces is disposed obliquely with respect to the principal crystal directions.
摘要翻译：表面发射半导体激光器芯片包含半导体本体，至少部分地具有主晶体的晶体结构，辐射出射面和横向限定半导体本体的侧面。至少一个侧面相对于主晶体方向倾斜地设置。

5. 发明授权

US06851946B1 Hot runner distributor system 有权
标题翻译：热流道分配器系统
公开(公告)号：US06851946B1
公开(公告)日：2005-02-08
申请号：US10130968
申请日：2000-11-04
申请人： Werner Plass , Stefan Ruf
发明人： Werner Plass , Stefan Ruf
IPC分类号： B29C45/27
CPC分类号： B29C45/2727
摘要： A hot runner manifold system for an injection mould for simultaneous injection moulding of several parts or of large parts, having a multiplicity of injection orifices (24). The orifices are designed for delivering injection moulding compound substantially simultaneously under high pressure and at high temperatures into specified mould zones. The mould zones are provided at least partially on main manifolds (11, 12, 13, 14) that are separated from one another, which main manifolds have hot runners (17, 19, 21, 23) and are connected via at least one pre-manifold (2). The pre-manifold has hot runners (4, 7), and is connected to a sprue (1) for receipt of the injection moulding compound. At least one part of pre-manifold (2) is arranged between adjacent main manifolds (11, 12, 13, 14), with the hot runners (7, 17) of the pre-manifold (2) and of the main manifolds (11, 12, 13, 14) opening through lateral surfaces of pre-manifold (15) and a main manifold (25) that face one another and are in contact with one another, with the main manifolds (11, 12, 13, 14) and pre-manifolds (2) pressed together firmly and tightly at the lateral surfaces by lateral spring elements (6). The spring elements (6) permit a limited movement of the main manifolds (11, 12, 13, 14) by overcoming the force of a spring element (6). Desirably at least two separate main manifolds are provided which are arranged on opposite long sides of an oblong pre-manifold (2).
摘要翻译：一种用于注射模具的热流道歧管系统，用于同时注射几个部件或大部件，具有多个注射孔（24）。这些孔被设计用于在高压和高温下基本同时地将注射模塑料递送到指定的模具区域中。模具区域至少部分地设置在彼此分离的主歧管（11,12,13,14）上，主歧管具有热流道（17,19,21,23），并且通过至少一个预先连接 -manifold（2）。预歧管具有热流道（4,7），并且连接到用于接收注射模塑料的浇口（1）。预歧管（2）的至少一部分布置在相邻主歧管（11,12,13,14）之间，其中预歧管（2）和主歧管（2）的热流道（7,17）和主歧管 11，12,13,14），其通过前歧管（15）的侧表面和主歧管（25）彼此面对并且彼此接触，主歧管（11,12,13,14））和预歧管（2）通过侧向弹簧元件（6）牢固且紧密地压在侧面上。弹簧元件（6）通过克服弹簧元件（6）的力允许主歧管（11,12,13,14）的有限运动。期望地设置至少两个单独的主歧管，其布置在长圆形预歧管（2）的相对的长边上。

6. 发明授权

US07015514B2 Light-emitting diode and method for the production thereof 有权
标题翻译：发光二极管及其制造方法
公开(公告)号：US07015514B2
公开(公告)日：2006-03-21
申请号：US10451836
申请日：2002-01-15
申请人： Johannes Baur , Dominik Eisert , Michael Fehrer , Berthold Hahn , Volker Härle , Ulrich Jacob , Werner Plass , Uwe Strauss , Johannes Völkl , Ulrich Zehnder
发明人： Johannes Baur , Dominik Eisert , Michael Fehrer , Berthold Hahn , Volker Härle , Ulrich Jacob , Werner Plass , Uwe Strauss , Johannes Völkl , Ulrich Zehnder
IPC分类号： H01L33/00
CPC分类号： H01L33/644 , F21K9/23 , F21V29/70 , F21Y2115/10 , H01L25/0753 , H01L33/483 , H01L33/507 , H01L33/58 , H01L33/62 , H01L2924/0002 , H01L2924/00
摘要： A light-emitting diode (1) has a lens body (3) that is fabricated from an inorganic solid. Fastened on the lens body (3) are semiconductor chips (2) that emit light beams (18). Furthermore, the light-emitting diode (1) is provided with a housing (20) that can be screwed into a conventional lamp holder via a thread (21).
摘要翻译：发光二极管（1）具有由无机固体制成的透镜体（3）。在透镜体（3）上固定有发射光束（18）的半导体芯片（2）。此外，发光二极管（1）设置有可经由螺纹（21）拧入常规灯座的壳体（20）。

7. 发明授权

US06897488B2 Radiation-emitting chip 有权
标题翻译：辐射发射芯片
公开(公告)号：US06897488B2
公开(公告)日：2005-05-24
申请号：US10415810
申请日：2001-11-06
申请人： Johannes Baur , Dominik Eisert , Michael Fehrer , Berthold Hahn , Volker Härle , Ulrich Jacob , Raimund Oberschmid , Werner Plass , Uwe Strauss , Johannes Völkl , Ulrich Zehnder
发明人： Johannes Baur , Dominik Eisert , Michael Fehrer , Berthold Hahn , Volker Härle , Ulrich Jacob , Raimund Oberschmid , Werner Plass , Uwe Strauss , Johannes Völkl , Ulrich Zehnder
IPC分类号： H01L33/02 , H01L33/08 , H01L33/20 , H01L33/40 , H01L33/00
CPC分类号： H01L33/20 , H01L33/02 , H01L33/08 , H01L33/405
摘要： A light-emitting chip (3) has a lens-type coupling-out window (4), whose base area (5) is provided with a mirror area (6). Arranged on a coupling-out area (7) of the coupling-out window (4) is a layer sequence (9), with a photon-emitting pn junction (10). The photons emitted by the pn junction are reflected at the mirror area (6) and can leave the coupling-out window (4) through the coupling-out area (7).
摘要翻译：发光芯片（3）具有透镜型耦合输出窗（4），其基部区域（5）设置有反射镜区域（6）。布置在耦合出窗口（4）的耦合输出区域（7）上的是具有光子发射pn结（10）的层序列（9）。由pn结发射的光子在反射镜区域（6）处被反射，并且可以通过耦合输出区域（7）离开耦合出的窗口（4）。

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