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    • 7. 发明授权
    • Polymers prepared from 4,4'-bis(3,4-dicarboxyphenyl)
hexafluoroisopropyl) diphenyl dianhydride
    • 由4,4'-双(3,4-二羧基苯基)六氟异丙基)二苯基二酐制备的聚合物
    • US5061784A
    • 1991-10-29
    • US543232
    • 1990-08-06
    • Werner H. MuellerRohitkumar H. Vora
    • Werner H. MuellerRohitkumar H. Vora
    • C08G73/10
    • C08G73/1039
    • Polyimides and polyamide-acids having improved solubility and processing characteristics and high glass transition temperatures are provided, having incorporated into the polymeric chain the novel aromatic dianhydride compound 4,4'-bis[2-(3,4-dicarboxyphenyl) hexafluoroisopropyl] diphenyl dianhydride. The polyamide-acids and polyimides are prepared by reacting the 12F-Diphenyl DA with aromatic or aliphatic diamines. It has been found that the polyimides of this invention have improved solubility characteristics, good dielectric properties while at the same time exhibiting relatively high glass transition temperatures, and superior thermal and thermo-oxidative stability. The polymers may be processed into films, fibers or compression molded or fabricated into composites at moderate temperatures and pressures.
    • 提供了具有改进的溶解性和加工特性以及高玻璃化转变温度的聚酰亚胺和聚酰胺酸,其已经引入到聚合物链中,新的芳族二酐化合物4,4'-双[2-(3,4-二羧基苯基)六氟异丙基]二苯基二酐 。 聚酰胺酸和聚酰亚胺通过12F-二苯基DA与芳族或脂族二胺反应来制备。 已经发现,本发明的聚酰亚胺具有改善的溶解性,良好的介电性能,同时具有较高的玻璃化转变温度,以及优异的热和热氧化稳定性。 聚合物可以加工成薄膜,纤维或在中等温度和压力下压塑或制成复合材料。
    • 9. 发明授权
    • Polyamide containing the hexafluoroisopropylidene group
    • 含有六氟异亚丙基的聚酰胺
    • US5077378A
    • 1991-12-31
    • US526583
    • 1990-05-21
    • Werner H. MuellerDinesh N. KhannaBernd Hupfer
    • Werner H. MuellerDinesh N. KhannaBernd Hupfer
    • C08G69/26C08G69/32G03F7/023
    • G03F7/0233C08G69/26C08G69/32
    • This invention is that of high temperature polyamides containing the hexafluoroisopropylidene group. The high temperature polyamides of the invention and photo or radiation sensitizers provide improved high temperature positive resists which can be developed in aqueous alkaline developer and thermally anneal to form heat resistant, polyoxazole relief structures suitable for use in microelectronic and printing applications. The positive photoresists of the invention have improved solubility in coating solvents and improved photospeed. The polyamides of the invention can be prepared by conventional condensation reactions; e.g. the condensation of a diamine and diacid chloride. In addition the polyamides of this invention provide high temperature protective coatings with superior adhesion properties in applications other than the photoresist area.
    • 本发明是含有六氟异亚丙基的高温聚酰胺。 本发明的高温聚酰胺和光或辐射敏化剂提供改进的高温正性抗蚀剂,其可以在含水碱性显影剂中显影并热退火以形成适用于微电子和印刷应用的耐热的聚恶唑消除结构。 本发明的正性光致抗蚀剂具有改进的涂料溶剂溶度和改进的感光速度。 本发明的聚酰胺可以通过常规的缩合反应制备; 例如 二胺和二酰氯的缩合。 此外,本发明的聚酰胺提供了除光刻胶区域之外的应用中具有优异粘合性能的高温保护涂层。
    • 10. 发明授权
    • Heat resistant polybenzoxazole from
bis-((aminohydroxyphenyl)hexafluoroisopropyl)diphenyl ether
    • 来自双 - ((氨基羟基苯基)六氟异丙基)二苯基醚的耐热聚苯并恶唑
    • US4939215A
    • 1990-07-03
    • US327761
    • 1989-03-23
    • Werner H. MuellerDinesh N. Khanna
    • Werner H. MuellerDinesh N. Khanna
    • C08G69/26C08G69/32C08G73/22G02F1/1337G03F7/023G03F7/037H01B3/30
    • G02F1/133723C08G69/26C08G69/32C08G73/22G03F7/0233G03F7/037H01B3/303Y10T428/10
    • Heat resistant, shapable, hydroxy and/or alkoxy-substituted polyamides derived from at least one diamine selected from unsubstituted and substituted 4,4'-bis[2-(4-amino-3-hydroxyphenyl)hexafluoroisopropyl)]diphenyl ether 4,4'-bis-[2-(3-amino-4-hydroxyphenyl)hexafluoroisopropyl]diphenyl ether and a dicarboxylic acid or a derivative thereof e.g. its acid halo or ester. The polyamides of the invention may be thermally cured to form polybenzoxazoles of higher heat resistance which are stable to hydrolytic, chemical and radiation attack.The polyamides of the invention may be formed into shaped articles by molding, extrusion and solvent casting processes preferably in the presence of a solvent or diluent and then optionally converted into heat resistant, insoluble polybenzoxazoles. These shaped articles are useful in aircraft, electronic and other commercial applications where heat, chemical and radiation resistance are desired in conjunction with good mechanical and electrical properties.
    • 衍生自至少一种选自未取代的和取代的4,4'-双[2-(4-氨基-3-羟基苯基)六氟异丙基)]二苯基醚4,4'-二胺的二胺的耐热,可成形的羟基和/或烷氧基取代的聚酰胺 ' - 双 - [2-(3-氨基-4-羟基苯基)六氟异丙基]二苯醚和二羧酸或其衍生物例如 其酸卤素或酯。 本发明的聚酰胺可以被热固化以形成对于水解,化学和辐射攻击是稳定的较高耐热性的聚苯并恶唑。 本发明的聚酰胺可以通过模制,挤出和溶剂浇铸方法形成成型制品,优选在溶剂或稀释剂的存在下,然后任选地转化成耐热不溶性聚苯并恶唑。 这些成型制品在飞机,电子和其他商业应用中是有用的,其中需要耐热,耐化学性和耐辐射性以及良好的机械和电学性能。