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1. 发明授权

US5077378A Polyamide containing the hexafluoroisopropylidene group 失效
标题翻译：含有六氟异亚丙基的聚酰胺
公开(公告)号：US5077378A
公开(公告)日：1991-12-31
申请号：US526583
申请日：1990-05-21
申请人： Werner H. Mueller , Dinesh N. Khanna , Bernd Hupfer
发明人： Werner H. Mueller , Dinesh N. Khanna , Bernd Hupfer
IPC分类号： C08G69/26 , C08G69/32 , G03F7/023
CPC分类号： G03F7/0233 , C08G69/26 , C08G69/32
摘要： This invention is that of high temperature polyamides containing the hexafluoroisopropylidene group. The high temperature polyamides of the invention and photo or radiation sensitizers provide improved high temperature positive resists which can be developed in aqueous alkaline developer and thermally anneal to form heat resistant, polyoxazole relief structures suitable for use in microelectronic and printing applications. The positive photoresists of the invention have improved solubility in coating solvents and improved photospeed. The polyamides of the invention can be prepared by conventional condensation reactions; e.g. the condensation of a diamine and diacid chloride. In addition the polyamides of this invention provide high temperature protective coatings with superior adhesion properties in applications other than the photoresist area.
摘要翻译：本发明是含有六氟异亚丙基的高温聚酰胺。本发明的高温聚酰胺和光或辐射敏化剂提供改进的高温正性抗蚀剂，其可以在含水碱性显影剂中显影并热退火以形成适用于微电子和印刷应用的耐热的聚恶唑消除结构。本发明的正性光致抗蚀剂具有改进的涂料溶剂溶度和改进的感光速度。本发明的聚酰胺可以通过常规的缩合反应制备; 例如二胺和二酰氯的缩合。此外，本发明的聚酰胺提供了除光刻胶区域之外的应用中具有优异粘合性能的高温保护涂层。

2. 发明授权

US4978738A High molecular weight, thermally soluble polyimides 失效
标题翻译：高分子量的热可溶性聚酰亚胺
公开(公告)号：US4978738A
公开(公告)日：1990-12-18
申请号：US217914
申请日：1988-07-12
申请人： Werner H. Mueller , Rohitkumar H. Vora , Dinesh N. Khanna
发明人： Werner H. Mueller , Rohitkumar H. Vora , Dinesh N. Khanna
IPC分类号： C08G73/10
CPC分类号： C08G73/1042 , C08G73/1039
摘要： High molecular weight polyimides are formed by polycondensation of 2,2-bis(4-aminophenyl) hexafluoropropane or 2,2-bis(3-aminophenyl) hexafluoropropane with one or more of bis-(3,4 dicarboxyphenyl) ether dianhydride; 3,3', 4,4' benzophenone tetracarboxylic acid dianhydride; 3,3', 4,4' diphenyl tetracarboxylic acid dianhydride and 2,2-bis(3,4 dicarboxyphenyl) hexafluoropropane dianhydride. Generally, the polymers of the present invention are characterized by a molecular weight of more than about 90,000.

3. 发明授权

US5055550A Polymers prepared from 4,4'-bis(2-[3,4(dicarboxyphenyl)hexafluoroisopropyl] diphenyl ether dianhydride 失效
标题翻译：由4,4'-双（2- [3,4（二羧基苯基）六氟异丙基]二苯醚二酐制备的聚合物
公开(公告)号：US5055550A
公开(公告)日：1991-10-08
申请号：US497081
申请日：1990-03-21
申请人： Werner H. Mueller , Dinesh N. Khanna , Rohitkumar H. Vora , Ruediger J. Erckel
发明人： Werner H. Mueller , Dinesh N. Khanna , Rohitkumar H. Vora , Ruediger J. Erckel
IPC分类号： C07C65/24 , C08G69/40 , C08G73/10 , C08G73/12 , G03F7/038
CPC分类号： C07C65/24 , C08G69/40 , C08G73/105 , C08G73/1057 , C08G73/1064 , C08G73/12 , G03F7/0387 , Y10T428/31721
摘要： This invention relates to new fluorine-containing polyimides, polyamide-acids/esters, polyamides, addition polyimides and imide oligomers which exhibit low melting points, better solubilities, low dielectric constants, superior thermal and thermal oxidative stability, and improved processing characteristics.The products of this invention are characterized by the fact that they are derived from 4,4'-bis[2-(3,4-(dicarboxyphenyl)hexafluoroisopropyl]diphenyl ether dianhydride.
摘要翻译：本发明涉及显示低熔点，更好的溶解度，低介电常数，优异的热和热氧化稳定性以及改进的加工特性的新的含氟聚酰亚胺，聚酰胺酸/酯，聚酰胺，加成聚酰亚胺和酰亚胺低聚物。本发明的产物的特征在于它们衍生自4,4'-双[2-（3,4-（二羧基苯基）六氟异丙基]二苯醚二酐。

4. 发明授权

US4939215A Heat resistant polybenzoxazole from bis-((aminohydroxyphenyl)hexafluoroisopropyl)diphenyl ether 失效
标题翻译：来自双 - （（氨基羟基苯基）六氟异丙基）二苯基醚的耐热聚苯并恶唑
公开(公告)号：US4939215A
公开(公告)日：1990-07-03
申请号：US327761
申请日：1989-03-23
申请人： Werner H. Mueller , Dinesh N. Khanna
发明人： Werner H. Mueller , Dinesh N. Khanna
IPC分类号： C08G69/26 , C08G69/32 , C08G73/22 , G02F1/1337 , G03F7/023 , G03F7/037 , H01B3/30
CPC分类号： G02F1/133723 , C08G69/26 , C08G69/32 , C08G73/22 , G03F7/0233 , G03F7/037 , H01B3/303 , Y10T428/10
摘要： Heat resistant, shapable, hydroxy and/or alkoxy-substituted polyamides derived from at least one diamine selected from unsubstituted and substituted 4,4'-bis[2-(4-amino-3-hydroxyphenyl)hexafluoroisopropyl)]diphenyl ether 4,4'-bis-[2-(3-amino-4-hydroxyphenyl)hexafluoroisopropyl]diphenyl ether and a dicarboxylic acid or a derivative thereof e.g. its acid halo or ester. The polyamides of the invention may be thermally cured to form polybenzoxazoles of higher heat resistance which are stable to hydrolytic, chemical and radiation attack.The polyamides of the invention may be formed into shaped articles by molding, extrusion and solvent casting processes preferably in the presence of a solvent or diluent and then optionally converted into heat resistant, insoluble polybenzoxazoles. These shaped articles are useful in aircraft, electronic and other commercial applications where heat, chemical and radiation resistance are desired in conjunction with good mechanical and electrical properties.
摘要翻译：衍生自至少一种选自未取代的和取代的4,4'-双[2-（4-氨基-3-羟基苯基）六氟异丙基）]二苯基醚4,4'-二胺的二胺的耐热，可成形的羟基和/或烷氧基取代的聚酰胺 ' - 双 - [2-（3-氨基-4-羟基苯基）六氟异丙基]二苯醚和二羧酸或其衍生物例如其酸卤素或酯。本发明的聚酰胺可以被热固化以形成对于水解，化学和辐射攻击是稳定的较高耐热性的聚苯并恶唑。本发明的聚酰胺可以通过模制，挤出和溶剂浇铸方法形成成型制品，优选在溶剂或稀释剂的存在下，然后任选地转化成耐热不溶性聚苯并恶唑。这些成型制品在飞机，电子和其他商业应用中是有用的，其中需要耐热，耐化学性和耐辐射性以及良好的机械和电学性能。

5. 发明授权

US4931540A Polymers prepared from 4,4'-bis[2-(3,4-(dicarboxyphenyl)hexafluoroisopropyl] diphenyl ether dianhydride 失效
标题翻译：由4,4'-双[2-（3,4-（二羧基苯基）六氟异丙基]二苯醚二酐制备的聚合物
公开(公告)号：US4931540A
公开(公告)日：1990-06-05
申请号：US124720
申请日：1987-11-24
申请人： Werner H. Mueller , Dinesh N. Khanna , Rohitkumar H. Vora , Ruediger J. Erckel
发明人： Werner H. Mueller , Dinesh N. Khanna , Rohitkumar H. Vora , Ruediger J. Erckel
IPC分类号： G03F7/037 , C07C65/24 , C08F290/00 , C08F299/00 , C08G69/40 , C08G73/10 , C08G73/12 , C08L79/08 , G03F7/038
CPC分类号： C07C65/24 , C08G69/40 , C08G73/105 , C08G73/1057 , C08G73/1064 , C08G73/12 , G03F7/0387
摘要： This invention relates to new fluorine-containing polyimides, polyamide-acids/esters, polyamides, addition polyimides and imide oligomers which exhibit low melting points, better solubilities, low dielectric constants, superior thermal and thermal oxidative stability, and improved processing characteristics.The products of this invention are characterized by the fact that they are derived from 4,4'-bis[2-(3,4-(dicarboxyphenyl)hexafluoroisopropyl]diphenyl ether dianhydride.

6. 发明授权

US5106720A Base developable negative acting photoresists 失效
标题翻译：基础可显影负性光致抗蚀剂
公开(公告)号：US5106720A
公开(公告)日：1992-04-21
申请号：US405493
申请日：1989-09-11
申请人： Werner H. Mueller , Dinesh N. Khanna
发明人： Werner H. Mueller , Dinesh N. Khanna
IPC分类号： C08G73/10 , G03F7/023 , G03F7/038
CPC分类号： C08G73/1067 , C08G73/10 , C08G73/1039 , C08G73/1064 , C08G73/1071 , C08G73/1078 , G03F7/0233 , G03F7/0387 , Y10S430/107
摘要： A base developable negative acting photoresist composition which is thermally stable, provides high resolution at short exposure times and is capable of development by means of conventional aqueous alkaline developers. The present compositions comprise an alkali soluble hydroxylated polyamide and/or polyimide binder material, a photopolymerizable compound containing at least two ethylenically-unsaturated double bonds, and a light-sensitive photoinitiator.
摘要翻译：具有热稳定性的基底显影负性光致抗蚀剂组合物在短曝光时间下提供高分辨率，并且能够通过常规水性碱性显影剂显影。本发明的组合物包含碱溶性羟基化聚酰胺和/或聚酰亚胺粘合剂材料，含有至少两个烯键式不饱和双键的光聚合化合物和光敏光引发剂。

7. 发明授权

US4927736A Hydroxy polyimides and high temperature positive photoresists therefrom 失效
标题翻译：羟基聚酰亚胺和高温阳性光致抗蚀剂
公开(公告)号：US4927736A
公开(公告)日：1990-05-22
申请号：US76098
申请日：1987-07-21
申请人： Werner H. Mueller , Dinesh N. Khanna
发明人： Werner H. Mueller , Dinesh N. Khanna
IPC分类号： G03C1/72 , C08G73/10 , C08L79/08 , C09D179/08 , G03F7/023 , G03F7/038
CPC分类号： C08G73/1064 , C08G73/10 , C08G73/1039 , C08G73/1067 , C08G73/1071 , C08G73/1078 , G03F7/0233 , G03F7/0387
摘要： This invention relates to novel hydroxy polyimides and radiation sensitive compositions prepared therefrom. More particularly the invention relates to positive photoresists useful in the preparation of a thermally stable relief pattern on a substrate e.g. a silicon wafer or aluminum plate. The novel hydroxy polyimides of the invention may also be used to provide thermally stable organic protective films and layers e.g. an insulating and/or a passivating layer in a semi-conductor component.The novel hydroxy polyimides of in this invention can be synthesized by the condensation of a hydroxy-substituted aminophenol and a dianhydride. Radiation sensitive compositions prepared from the novel hydroxy polyimides of the invention can be developed in aqueous base developer or organic solvent developer; preferably aqueous base developer. Also, the base developer dissolution properties of the polyimides can be controlled by incorporating a non-hydroxyl diamine into the polyimide.The polyimides utilized in this invention have good solubility properties in various organic solvents and also have good mechanical, electrical, adhesion and thermal properties. Radiation sensitive compositions made from hydroxy polyimides of this invention provide high-resolution relief images which are thermally stable up to a temperature of approximately 300.degree. C.
摘要翻译：本发明涉及由其制备的新的羟基聚酰亚胺和辐射敏感组合物。更具体地说，本发明涉及可用于在基材上制备热稳定浮雕图案的正性光致抗蚀剂，例如硅晶片或铝板。本发明的新型羟基聚酰亚胺也可用于提供热稳定的有机保护膜和层。半导体部件中的绝缘和/或钝化层。本发明的新型羟基聚酰亚胺可以通过羟基取代的氨基苯酚和二酐的缩合来合成。由本发明的新型羟基聚酰亚胺制备的辐射敏感性组合物可以在碱性显影剂或有机溶剂显影剂中显影; 优选碱性显影液。此外，聚酰亚胺的碱显影剂溶解性能可以通过将非羟基二胺掺入到聚酰亚胺中来控制。本发明中使用的聚酰亚胺在各种有机溶剂中具有良好的溶解性，并具有良好的机械，电气，粘合性和热性能。由本发明的羟基聚酰亚胺制成的辐射敏感组合物提供在约300℃的温度下是热稳定的高分辨率浮雕图像。

8. 发明授权

US5037949A Polymers prepared from 4,4'-bis[2-(amino (halo) phenoxyphenyl) hexafluoroisopropyl]diphenyl ether 失效
标题翻译：由4,4'-双[2-（氨基（卤代）苯氧基苯基）六氟异丙基]二苯基醚制备的聚合物
公开(公告)号：US5037949A
公开(公告)日：1991-08-06
申请号：US489448
申请日：1990-03-06
申请人： Werner H. Mueller , Dinesh N. Khanna , Rohitkumar H. Vora , Ruediger J. Erckel
发明人： Werner H. Mueller , Dinesh N. Khanna , Rohitkumar H. Vora , Ruediger J. Erckel
IPC分类号： C07C65/24 , C07C217/90 , C08G69/40 , C08G73/10 , C08G73/12 , G03F7/038
CPC分类号： C07C65/24 , C07C217/90 , C08G69/40 , C08G73/105 , C08G73/1057 , C08G73/1064 , C08G73/123 , C08G73/124 , G03F7/0387
摘要： This invention relates to new fluorine-containing polyimides, polyamide-acids/esters, polyamides, addition polyimides and imide oligomers which exhibit low melting points, better solubilities, low dielectric constants, superior thermal and thermal oxidative stability, and improved processing characteristics.The products of this invention are characterized by the fact that they are derived from 4,4'-bis[2-(amino(halo)phenoxyphenyl)hexafluoroisopropyl]diphenyl ether.
摘要翻译：本发明涉及显示低熔点，更好的溶解度，低介电常数，优异的热和热氧化稳定性以及改善的加工特性的新的含氟聚酰亚胺，聚酰胺酸/酯，聚酰胺，加成聚酰亚胺和酰亚胺低聚物。本发明的产物的特征在于它们衍生自4,4'-双[2-（氨基（卤代）苯氧基苯基）六氟异丙基]二苯醚。

9. 发明授权

US5011753A Photoresist compositions containing polyamides polybenzoxa from bis((aminohydroxyphenyl)hexafluoroisopropyl)diphenyl ethers 失效
标题翻译：含有二（（氨基羟基苯基）六氟异丙基）二苯基醚的聚酰胺聚苯并恶唑的光致抗蚀剂组合物
公开(公告)号：US5011753A
公开(公告)日：1991-04-30
申请号：US476332
申请日：1990-02-07
申请人： Werner H. Mueller , Dinesh N. Khanna
发明人： Werner H. Mueller , Dinesh N. Khanna
IPC分类号： C08G69/26 , C08G69/32 , C08G73/22 , G02F1/1337 , G03F7/023 , G03F7/037 , H01B3/30
CPC分类号： H01B3/303 , C08G69/26 , C08G69/32 , C08G73/22 , G02F1/133723 , G03F7/0233 , G03F7/037
摘要： Heat resistant, shapable, hydroxy and/or alkoxy-substituted polyamides derived from at least one diamine selected from unsubstituted and substituted 4,4'-bis[2-(4-amino-3-hydroxyphenyl)hexafluoroisopropyl)]diphenyl ether 4,4'-bis-[2-(3-amino-4-hydroxyphenyl)hexafluoroisopropyl]diphenyl ether and a dicarboxylic acid or a derivative thereof e.g. its acid halo or ester. The polyamides of the invention may be thermally cured to form polybenzoxazoles of higher heat resistance which are stable to hydrolytic, chemical and radiation attack.The polyamides of the invention may be formed into shaped articles by molding, extrusion and solvent casting processes preferably in the presence of a solvent or diluent and then optionally converted into heat resistant, insoluble polybenzoxazoles. These shaped articles are useful in aircraft, electronic and other commercial applications where heat, chemical and radiation resistance are desired in conjunction with good mechanical and electrical properties.
摘要翻译：衍生自至少一种选自未取代的和取代的4,4'-双[2-（4-氨基-3-羟基苯基）六氟异丙基）]二苯基醚4,4'-二胺的二胺的耐热，可成形的羟基和/或烷氧基取代的聚酰胺 ' - 双 - [2-（3-氨基-4-羟基苯基）六氟异丙基]二苯醚和二羧酸或其衍生物例如其酸卤素或酯。本发明的聚酰胺可以被热固化以形成对于水解，化学和辐射攻击是稳定的较高耐热性的聚苯并恶唑。本发明的聚酰胺可以通过模制，挤出和溶剂浇铸方法形成成型制品，优选在溶剂或稀释剂的存在下，然后任选地转化成耐热不溶性聚苯并恶唑。这些成型制品在飞机，电子和其他商业应用中是有用的，其中需要耐热，耐化学性和耐辐射性以及良好的机械和电学性能。

10. 发明授权

US4925915A Polymers prepared from 4,4'-bis(2-(amino(halo) phenoxyphenyl) hexafluoroisopropyl) diphenyl ether 失效
标题翻译：由4,4'-双（2-（氨基（卤代）苯氧基苯基）六氟异丙基）二苯基醚制备的聚合物
公开(公告)号：US4925915A
公开(公告)日：1990-05-15
申请号：US124704
申请日：1987-11-24
申请人： Werner H. Mueller , Dinesh N. Khanna , Rohitkumar H. Vora , Ruediger J. Erckel
发明人： Werner H. Mueller , Dinesh N. Khanna , Rohitkumar H. Vora , Ruediger J. Erckel
IPC分类号： C07C65/24 , C07C217/90 , C08G69/40 , C08G73/10 , C08G73/12 , G03F7/038
CPC分类号： C08G69/40 , C07C217/90 , C07C65/24 , C08G73/105 , C08G73/1057 , C08G73/1064 , C08G73/123 , C08G73/124 , G03F7/0387
摘要： This invention relates to new fluorine-containing polyimides, polyamide-acids/esters, polyamides, addition polyimides and imide oligomers which exhibit low melting points, better solubilities, low dielectric constants, superior thermal and thermal oxidative stability, and improved processing characteristics.The product of this invention are characterized by the fact that they are derived from 4,4'-bis[2-(amino(halo)phenoxyphenyl)-hexafluoroisopropyl]diphenyl ether.

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