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    • 2. 发明授权
    • Lawn chemical application system
    • US07011254B2
    • 2006-03-14
    • US10916226
    • 2004-08-10
    • Brian Thornton
    • Brian Thornton
    • A62C5/02
    • A01C23/042Y10T137/4891
    • A lawn chemical application system is disclosed. The system comprises a dispenser having a lower chamber, an upper chamber, an upstream opening, and a downstream opening. The dispenser may be formed by a tee connector and a cylinder secured to an upper opening of the tee connector. Powered valves are operably connected to the upstream and downstream openings of the dispenser. The powered valves may be wired to open and close simultaneously. A lower portion of the upper chamber may be disposed below an upper portion of the lower chamber and above a lower portion of the lower chamber, leaving the lower portion of the lower chamber unobstructed over substantially its entire length. The lower portion of the upper chamber may have a plurality of openings to provide for adequate mixing of water with the chemicals stored in the upper chamber. In operation, soluble matter or other chemicals are placed in the upper chamber of the dispenser, and the two valves are opened simultaneously. Water flows through the first powered valve and into the dispenser, where the water is mixed with soluble matter or other chemicals stored in the upper chamber of the tee. The solution or mixture then passes from the dispenser, through the second powered valve, to one or more sprinkler heads of the irrigation system. When the application is finished, the valves are closed simultaneously.
    • 3. 发明申请
    • Lawn chemical application system
    • 草坪化学品应用系统
    • US20050098649A1
    • 2005-05-12
    • US10916226
    • 2004-08-10
    • Brian Thornton
    • Brian Thornton
    • A01C23/04A62C5/02B05B15/06
    • A01C23/042Y10T137/4891
    • A lawn chemical application system is disclosed. The system comprises a dispenser having a lower chamber, an upper chamber, an upstream opening, and a downstream opening. The dispenser may be formed by a tee connector and a cylinder secured to an upper opening of the tee connector. Powered valves are operably connected to the upstream and downstream openings of the dispenser. The powered valves may be wired to open and close simultaneously. A lower portion of the upper chamber may be disposed below an upper portion of the lower chamber and above a lower portion of the lower chamber, leaving the lower portion of the lower chamber unobstructed over substantially its entire length. The lower portion of the upper chamber may have a plurality of openings to provide for adequate mixing of water with the chemicals stored in the upper chamber. In operation, soluble matter or other chemicals are placed in the upper chamber of the dispenser, and the two valves are opened simultaneously. Water flows through the first powered valve and into the dispenser, where the water is mixed with soluble matter or other chemicals stored in the upper chamber of the tee. The solution or mixture then passes from the dispenser, through the second powered valve, to one or more sprinkler heads of the irrigation system. When the application is finished, the valves are closed simultaneously.
    • 公开了草坪化学应用系统。 该系统包括具有下室,上室,上游开口和下游开口的分配器。 分配器可以由三通连接器和固定到三通连接器的上开口的圆筒形成。 动力阀可操作地连接到分配器的上游和下游开口。 动力阀可以被连接以同时打开和关闭。 上部腔室的下部可以设置在下部腔室的上部下方并且位于下部腔室的下部的下方,从而使下部腔室的下部部分基本上不受其整个长度的阻碍。 上室的下部可以具有多个开口,以提供水与存储在上室中的化学品的充分混合。 在操作中,可溶性物质或其他化学品被放置在分配器的上腔室中,并且两个阀门同时打开。 水流过第一动力阀并进入分配器,水与可溶性物质或存储在发球台上部腔室中的其他化学物质混合。 溶液或混合物然后从分配器通过第二动力阀传递到冲洗系统的一个或多个喷洒头。 当应用完成时,阀门同时关闭。
    • 8. 发明申请
    • APPARATUS AND METHOD FOR STABILIZING SLIDER FLYING HEIGHT OVER A DISCRETE TRACK MEDIA DISK SURFACE IN A HARD DISK DRIVE
    • 用于稳定硬盘驱动器中的分离轨道介质盘表面上的滑动飞行高度的装置和方法
    • US20100302674A1
    • 2010-12-02
    • US12473198
    • 2009-05-27
    • Walton FongBrian Thornton
    • Walton FongBrian Thornton
    • G11B15/18
    • G11B5/59655B82Y10/00G11B5/6011G11B5/6064G11B5/743
    • This application discloses a hard disk drive and a disk employing Discrete Tracks each including a land with a groove at a first depth with sectors of each track separated by servo pattern wedges with a variable second land and a variable second groove possessing widths and a second depth for the grooves differing from the first widths and depth of the groove of the sectors. The second depth optimizes the stability of the flying height of a slider over both sectors and servo pattern wedges, removing the possibility of added vibrational modes adversely affecting the slider's normal operations of reading, writing and flying above the disk surface. This also discloses the disks and their manufacture of disk surfaces with these sector zones and servo pattern wedges.
    • 本申请公开了一种硬盘驱动器和采用离散轨道的盘,每个盘包括具有在第一深度上的凹槽的平台,每个轨道的扇区由具有可变的第二脊的伺服模式楔形物分开的每个轨道的扇区以及具有宽度和第二深度的可变第二凹槽 对于与扇区的凹槽的第一宽度和深度不同的凹槽。 第二个深度优化了滑块在两个扇区和伺服模式楔上的飞行高度的稳定性,消除了增加的振动模式不利地影响滑块在磁盘表面上方读取,写入和飞行的正常操作的可能性。 这也公开了磁盘及其具有这些扇区和伺服模式楔的磁盘表面的制造。
    • 9. 发明授权
    • Planarization system for chemical-mechanical polishing
    • 化学机械抛光平面化系统
    • US06402591B1
    • 2002-06-11
    • US09539397
    • 2000-03-31
    • Brian Thornton
    • Brian Thornton
    • B24B100
    • B24B37/11
    • A method for performing and an apparatus to perform chemical mechanical polishing on a semiconductor wafer are disclosed. The apparatus includes a wafer holder, a polishing member, and a movable table. The movable table is in contact with and is supporting the polishing member. The polishing member includes a polishing pad, a backing layer, and a stiffening layer positioned between the backing layer and the polishing pad. The polishing pad has a polishing surface that is oriented to receive a semiconductor wafer held by the wafer holder. The polishing surface is configured to chemically mechanically polish the semiconductor wafer. The method includes holding a semiconductor wafer, moving a polishing member, and bringing a surface of the semiconductor wafer into contact with the polishing member. The polishing member includes a polishing pad, a backing layer, and a stiffening layer positioned between the polishing pad and the backing layer.
    • 公开了一种在半导体晶片上执行化学机械抛光的方法和一种设备。 该装置包括晶片保持器,抛光构件和可动台。 可移动台与抛光件接触并正在支撑。 抛光构件包括抛光垫,背衬层和位于背衬层和抛光垫之间的加强层。 抛光垫具有被定向成接收由晶片保持器保持的半导体晶片的抛光表面。 抛光表面被配置为对半导体晶片进行化学机械抛光。 该方法包括保持半导体晶片,移动抛光构件,并使半导体晶片的表面与抛光构件接触。 抛光构件包括抛光垫,背衬层和位于抛光垫和背衬层之间的加强层。