专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20080272486A1 CHIP PACKAGE STRUCTURE 审中-公开
标题翻译：芯片包装结构
公开(公告)号：US20080272486A1
公开(公告)日：2008-11-06
申请号：US12112255
申请日：2008-04-30
申请人： Wei-Chung Wang , Meng-Jen Wang , Tong-Hong Wang
发明人： Wei-Chung Wang , Meng-Jen Wang , Tong-Hong Wang
IPC分类号： H01L23/488
CPC分类号： H01L21/563 , H01L23/147 , H01L23/49816 , H01L23/49827 , H01L23/49833 , H01L24/16 , H01L24/32 , H01L2224/16 , H01L2224/73203 , H01L2924/00011 , H01L2924/00014 , H01L2924/15311 , H05K1/141 , H05K2201/10378 , H05K2201/10674 , H05K2201/10977 , H01L2224/0401
摘要： A chip package structure includes a carrier, an interposer, a plurality of electrically conductive elements, a first sealant, a chip, and a second sealant. The interposer is disposed on the carrier. The electrically conductive elements electrically connect the interposer and the carrier. The first sealant seals the electrically conductive elements. A plurality of bumps of the chip is connected to the interposer. The second sealant seals the bumps. A first glass transition temperature of the first sealant is higher than a second glass transition temperature of the second sealant. Since glass transition temperatures of the first sealant and the second sealant are different, and the first glass transition temperature of the first sealant is higher than the second glass transition temperature of the second sealant, the inner stress will be lowered and the yield is promoted.
摘要翻译：芯片封装结构包括载体，插入件，多个导电元件，第一密封剂，芯片和第二密封剂。插入器设置在载体上。导电元件电连接插入件和载体。第一密封剂密封导电元件。芯片的多个凸起连接到插入器。第二个密封胶密封凸块。第一密封剂的第一玻璃化转变温度高于第二密封剂的第二玻璃化转变温度。由于第一密封剂和第二密封剂的玻璃化转变温度不同，第一密封剂的第一玻璃化转变温度高于第二密封剂的第二玻璃化转变温度，因此内应力降低，产率提高。

2. 发明申请

US20090039526A1 PACKAGE AND THE METHOD FOR MAKING THE SAME, AND A STACKED PACKAGE 有权
标题翻译：包装及其制造方法和堆叠包装
公开(公告)号：US20090039526A1
公开(公告)日：2009-02-12
申请号：US12185879
申请日：2008-08-05
申请人： Meng-Jen Wang , Wei-Chung Wang
发明人： Meng-Jen Wang , Wei-Chung Wang
IPC分类号： H01L23/52 , H01L21/00
CPC分类号： H01L23/5389 , H01L21/481 , H01L21/568 , H01L23/3128 , H01L24/19 , H01L24/82 , H01L24/96 , H01L24/97 , H01L25/0655 , H01L25/105 , H01L25/50 , H01L2224/04105 , H01L2224/12105 , H01L2224/2518 , H01L2224/32225 , H01L2224/73267 , H01L2224/92244 , H01L2224/97 , H01L2225/1035 , H01L2225/1058 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/15311 , H01L2924/181 , H01L2924/18301 , H01L2224/82 , H01L2924/00
摘要： The present invention relates to a package and the method for making the same, and a stacked package. The method for making the package includes the following steps: (a) providing a carrier having a plurality of platforms; (b) providing a plurality of dice, and disposing the dice on the platforms; (c) performing a reflow process so that the dice are self-aligned on the platforms; (d) forming a molding compound in the gaps between the dice, and (e) performing a cutting process so as to form a plurality of packages. Since the dice are self-aligned on the platforms during the reflow process, a die attach machine with low accuracy can achieve highly accurate placement.
摘要翻译：封装及其制造方法技术领域本发明涉及一种封装及其制造方法以及堆叠封装。制造包装的方法包括以下步骤：（a）提供具有多个平台的载体; （b）提供多个骰子，并将骰子放置在平台上; （c）进行回流处理，使得骰子在平台上自对准; （d）在骰子之间的间隙中形成模塑料，和（e）进行切割处理以便形成多个包装。由于在回流过程中骰子在平台上自对准，所以精度低的贴片机可以实现高精度的放置。

3. 发明申请

US20100327442A1 Package and the Method for Making the Same, and a Stacked Package 审中-公开
标题翻译：软件包及其制作方法以及堆叠软件包
公开(公告)号：US20100327442A1
公开(公告)日：2010-12-30
申请号：US12876907
申请日：2010-09-07
申请人： Meng-Jen Wang , Wei-Chung Wang
发明人： Meng-Jen Wang , Wei-Chung Wang
IPC分类号： H01L23/498
CPC分类号： H01L23/5389 , H01L21/481 , H01L21/568 , H01L23/3128 , H01L24/19 , H01L24/82 , H01L24/96 , H01L24/97 , H01L25/0655 , H01L25/105 , H01L25/50 , H01L2224/04105 , H01L2224/12105 , H01L2224/2518 , H01L2224/32225 , H01L2224/73267 , H01L2224/92244 , H01L2224/97 , H01L2225/1035 , H01L2225/1058 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/15311 , H01L2924/181 , H01L2924/18301 , H01L2224/82 , H01L2924/00
摘要： The present invention relates to a package and the method for making the same, and a stacked package. The method for making the package includes the following steps: (a) providing a carrier having a plurality of platforms; (b) providing a plurality of dice, and disposing the dice on the platforms; (c) performing a reflow process so that the dice are self-aligned on the platforms; (d) forming a molding compound in the gaps between the dice, and (e) performing a cutting process so as to form a plurality of packages. Since the dice are self-aligned on the platforms during the reflow process, a die attach machine with low accuracy can achieve highly accurate placement.
摘要翻译：封装及其制造方法技术领域本发明涉及一种封装及其制造方法以及堆叠封装。制造包装的方法包括以下步骤：（a）提供具有多个平台的载体; （b）提供多个骰子，并将骰子放置在平台上; （c）进行回流处理，使得骰子在平台上自对准; （d）在骰子之间的间隙中形成模塑料，和（e）进行切割处理以便形成多个包装。由于在回流过程中骰子在平台上自对准，所以精度低的贴片机可以实现高精度的放置。

4. 发明授权

US07811858B2 Package and the method for making the same, and a stacked package 有权
标题翻译：包装和制作方法，以及堆叠包装
公开(公告)号：US07811858B2
公开(公告)日：2010-10-12
申请号：US12185879
申请日：2008-08-05
申请人： Meng-Jen Wang , Wei-Chung Wang
发明人： Meng-Jen Wang , Wei-Chung Wang
IPC分类号： H01L21/48 , H01L21/50
CPC分类号： H01L23/5389 , H01L21/481 , H01L21/568 , H01L23/3128 , H01L24/19 , H01L24/82 , H01L24/96 , H01L24/97 , H01L25/0655 , H01L25/105 , H01L25/50 , H01L2224/04105 , H01L2224/12105 , H01L2224/2518 , H01L2224/32225 , H01L2224/73267 , H01L2224/92244 , H01L2224/97 , H01L2225/1035 , H01L2225/1058 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/15311 , H01L2924/181 , H01L2924/18301 , H01L2224/82 , H01L2924/00
摘要： A package and the method for making the same, and a stacked package, the method for making the package includes the following steps: (a) providing a carrier having a plurality of platforms; (b) providing a plurality of dice, and disposing the dice on the platforms; (c) performing a reflow process so that the dice are self-aligned on the platforms; (d) forming a molding compound in the gaps between the dice, and (e) performing a cutting process so as to form a plurality of packages. Since the dice are self-aligned on the platforms during the reflow process, a die attach machine with low accuracy can achieve highly accurate placement.
摘要翻译：一种包装及其制造方法以及堆叠包装，制造包装的方法包括以下步骤：（a）提供具有多个平台的载体; （b）提供多个骰子，并将骰子放置在平台上; （c）进行回流处理，使得骰子在平台上自对准; （d）在骰子之间的间隙中形成模塑料，和（e）进行切割处理以便形成多个包装。由于在回流过程中骰子在平台上自对准，所以精度低的贴片机可以实现高精度的放置。

5. 发明授权

US08913034B2 Connector of connecting light sensor and substrate and method of fabricating light sensor 有权
标题翻译：连接光传感器和基板的连接器以及制造光传感器的方法
公开(公告)号：US08913034B2
公开(公告)日：2014-12-16
申请号：US12717927
申请日：2010-03-04
申请人： Wei-Chung Wang
发明人： Wei-Chung Wang
IPC分类号： G06F3/042 , H01L31/0203
CPC分类号： H01L31/0203 , G01J1/0295 , G01J1/0411 , G01J1/42 , G06F3/0428 , H01L31/02325 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/73204 , H01L2224/92125 , H01L2224/92247 , H01L2924/00011 , H01L2924/00014 , H01L2924/00 , H01L2224/0401
摘要： A connector of connecting a light sensor and a substrate is utilized for rotating the light sensor so that the light-receiving direction of the light sensor is parallel with the substrate. When the connector is utilized in an optical touch system, the light sensor can be disposed on the substrate of the optical touch system by means of general manufacturing facilities of flat display panels. Meanwhile, the light-receiving direction of the light sensor is parallel with the substrate of the optical touch system.
摘要翻译：连接光传感器和基板的连接器用于旋转光传感器，使得光传感器的光接收方向与基板平行。当在光学触摸系统中使用连接器时，光传感器可以通过平板显示面板的一般制造设备设置在光学触摸系统的基板上。同时，光传感器的光接收方向与光学触摸系统的基板平行。

6. 发明申请

US20110243541A1 Defocus calibration module for light-sensing system and method thereof 有权
标题翻译：用于光感测系统的散焦校准模块及其方法
公开(公告)号：US20110243541A1
公开(公告)日：2011-10-06
申请号：US12818112
申请日：2010-06-17
申请人： Wei-Chung Wang , Hui-Hsuan Chen
发明人： Wei-Chung Wang , Hui-Hsuan Chen
IPC分类号： G03B13/00
CPC分类号： G03B3/00 , G03B13/00 , H04N17/002
摘要： A defocus calibration module is applied in a light-sensing system utilized for sensing a measured object for generating a sensed image. The light-sensing system comprises a light-emitting component, a focusing component, and an image sensor. The light-emitting component emits a detecting light to the measured object so that the measured object generates a reflecting light. The focusing component focuses the reflecting light to the image sensor. The image sensor generates the sensed image according to the reflecting light. The defocus calibration module has a calibrating object for blocking a part of the detecting light and the reflecting light for forming images at a first and a second calibration imaging locations in the sensed image. In this way, the defocus calibration module calculates a defocus parameter representing the defocus level of the light-sensing system according to the first and the second calibration imaging locations, and accordingly calibrates the sensed image.
摘要翻译：散焦校准模块应用于用于感测测量对象以产生感测图像的光感测系统中。光感测系统包括发光部件，聚焦部件和图像传感器。发光部件向测量对象发射检测光，使得被测物体产生反射光。聚焦组件将反射光聚焦到图像传感器。图像传感器根据反射光生成感测图像。散焦校准模块具有用于阻挡检测光的一部分的校准对象和用于在感测图像中的第一和第二校准成像位置处形成图像的反射光。以这种方式，散焦校准模块根据第一和第二校准成像位置计算表示光感测系统的散焦水平的散焦参数，并因此校准感测图像。

7. 发明申请

US20100295822A1 Connector of connecting light sensor and substrate and method of fabricating light sensor 有权
标题翻译：连接光传感器和基板的连接器以及制造光传感器的方法
公开(公告)号：US20100295822A1
公开(公告)日：2010-11-25
申请号：US12717927
申请日：2010-03-04
申请人： Wei-Chung Wang
发明人： Wei-Chung Wang
IPC分类号： G06F3/042 , H01L31/0203 , H01R12/00 , H01L31/18
CPC分类号： H01L31/0203 , G01J1/0295 , G01J1/0411 , G01J1/42 , G06F3/0428 , H01L31/02325 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/73204 , H01L2224/92125 , H01L2224/92247 , H01L2924/00011 , H01L2924/00014 , H01L2924/00 , H01L2224/0401
摘要： A connector of connecting a light sensor and a substrate is utilized for rotating the light sensor so that the light-receiving direction of the light sensor is parallel with the substrate. When the connector is utilized in an optical touch system, the light sensor can be disposed on the substrate of the optical touch system by means of general manufacturing facilities of flat display panels. Meanwhile, the light-receiving direction of the light sensor is parallel with the substrate of the optical touch system.
摘要翻译：连接光传感器和基板的连接器用于旋转光传感器，使得光传感器的光接收方向与基板平行。当在光学触摸系统中使用连接器时，光传感器可以通过平板显示面板的一般制造设备设置在光学触摸系统的基板上。同时，光传感器的光接收方向与光学触摸系统的基板平行。

8. 发明授权

US07446404B2 Three-dimensional package and method of making the same 有权
标题翻译：三维包装及其制作方法
公开(公告)号：US07446404B2
公开(公告)日：2008-11-04
申请号：US11645177
申请日：2006-12-26
申请人： Min-Lung Huang , Wei-Chung Wang , Po-Jen Cheng , Kuo-Chung Yee , Ching-Huei Su , Jian-Wen Lo , Chian-Chi Lin
发明人： Min-Lung Huang , Wei-Chung Wang , Po-Jen Cheng , Kuo-Chung Yee , Ching-Huei Su , Jian-Wen Lo , Chian-Chi Lin
IPC分类号： H01L23/02 , H01L23/053 , H01L23/12 , H01L23/34 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L25/0657 , H01L21/76898 , H01L25/50 , H01L2224/48145 , H01L2225/06506 , H01L2225/06524 , H01L2225/06541 , H01L2924/01019 , H01L2924/01078 , H01L2924/00012
摘要： A three-dimensional package including a first wafer having at least one first pad and a first protection layer exposing the first pad. A first hole penetrates the first wafer. A first isolation layer is disposed on the side wall of the first hole. The lower end of a first conductive layer extends below the surface of the first wafer. A first metal is disposed in the first hole, and is electrically connected to the first pad via the first conductive layer. A first solder is disposed on the first metal in the first hole, wherein the melting point of the first solder is lower than that of the first metal. A second wafer is configured similarly as the first wafer. A lower end of a second conductive layer of the second wafer extends below the surface of the second wafer and contacts the upper end of the first solder.
摘要翻译：一种三维封装，其包括具有至少一个第一焊盘的第一晶片和暴露第一焊盘的第一保护层。第一孔穿透第一晶片。第一隔离层设置在第一孔的侧壁上。第一导电层的下端在第一晶片的表面下方延伸。第一金属设置在第一孔中，并经由第一导电层与第一焊盘电连接。第一焊料设置在第一孔中的第一金属上，其中第一焊料的熔点低于第一焊料的熔点。第二晶片被配置为类似于第一晶片。第二晶片的第二导电层的下端在第二晶片的表面下方延伸并接触第一焊料的上端。

9. 发明申请

US20070172986A1 Three-dimensional package and method of making the same 有权
标题翻译：三维包装及其制作方法
公开(公告)号：US20070172986A1
公开(公告)日：2007-07-26
申请号：US11645177
申请日：2006-12-26
申请人： Min-Lung Huang , Wei-Chung Wang , Po-Jen Cheng , Kuo-Chung Yee , Ching-Huei Su , Jian-Wen Lo , Chian-Chi Lin
发明人： Min-Lung Huang , Wei-Chung Wang , Po-Jen Cheng , Kuo-Chung Yee , Ching-Huei Su , Jian-Wen Lo , Chian-Chi Lin
IPC分类号： H01L21/00
CPC分类号： H01L25/0657 , H01L21/76898 , H01L25/50 , H01L2224/48145 , H01L2225/06506 , H01L2225/06524 , H01L2225/06541 , H01L2924/01019 , H01L2924/01078 , H01L2924/00012
摘要： The present invention relates to a three-dimensional package and a method of making the same. The three-dimensional package structure comprises a first wafer, at least one first hole, a first isolation layer, a first conductive layer, a first metal, a first solder, a second wafer, at least one second hole, a second isolation layer, a second conductive layer, a second metal and a second space. The first wafer has at least one first pad and a first protection layer exposing the first pad. The first hole penetrates the first wafer. The first isolation layer is disposed on the side wall of the first hole. The lower end of the first conductive layer extends below the surface of the first wafer. The first metal is disposed in the first hole, and is electrically connected to the first pad via the first conductive layer. The first solder is disposed on the first metal in the first hole, wherein the melting point of the first solder is lower than that of the first metal. The second wafer has at least one second pad and a second protection layer exposing the second pad. The second hole penetrates the second wafer. The second isolation layer is disposed on the side wall of the second hole. The lower end of the second conductive layer extends below the surface of the second wafer and contacts the upper end of the first solder. The second metal is disposed in the second hole and is electrically connected to the second pad via the second conductive layer. The second space is disposed on the second metal in the second hole.
摘要翻译：本发明涉及三维包装及其制造方法。三维封装结构包括第一晶片，至少一个第一孔，第一隔离层，第一导电层，第一金属，第一焊料，第二晶片，至少一个第二孔，第二隔离层，第二导电层，第二金属和第二空间。第一晶片具有至少一个第一焊盘和暴露第一焊盘的第一保护层。第一个孔穿透第一个晶片。第一隔离层设置在第一孔的侧壁上。第一导电层的下端延伸到第一晶片的表面下方。第一金属设置在第一孔中，并且经由第一导电层电连接到第一焊盘。第一焊料设置在第一孔中的第一金属上，其中第一焊料的熔点低于第一焊料的熔点。第二晶片具有至少一个第二焊盘和暴露第二焊盘的第二保护层。第二孔穿透第二晶片。第二隔离层设置在第二孔的侧壁上。第二导电层的下端延伸到第二晶片的表面下方并接触第一焊料的上端。第二金属设置在第二孔中，并通过第二导电层与第二焊盘电连接。第二空间设置在第二孔中的第二金属上。

10. 发明申请

US20070172985A1 Three-dimensional package and method of making the same 有权
标题翻译：三维包装及其制作方法
公开(公告)号：US20070172985A1
公开(公告)日：2007-07-26
申请号：US11645042
申请日：2006-12-26
申请人： Min-Lung Huang , Wei-Chung Wang , Po-Jen Cheng , Kuo-Chung Yee , Ching-Huei Su , Jian-Wen Lo , Chain-Chi Lin
发明人： Min-Lung Huang , Wei-Chung Wang , Po-Jen Cheng , Kuo-Chung Yee , Ching-Huei Su , Jian-Wen Lo , Chain-Chi Lin
IPC分类号： H01L21/00
CPC分类号： H01L25/0657 , H01L21/76898 , H01L25/50 , H01L2224/48145 , H01L2225/06506 , H01L2225/06524 , H01L2225/06541 , H01L2924/01019 , H01L2924/01078 , H01L2924/00012
摘要： The present invention relates to a three-dimensional package and a method of making the same. The method comprises: (a) providing a wafer; (b) forming at least one blind hole in the wafer; (c) forming an isolation layer on the side wall of the blind hole; (d) forming a conductive layer on the isolation layer; (e) forming a dry film on the conductive layer; (f) filling the blind hole with a metal; (g) removing the dry film, and patterning the conductive layer; (h) removing a part of the metal in the blind hole to form a space; (i) removing a part of the second surface of the wafer and a part of the isolation layer, so as to expose a part of the conductive layer; (j) forming a solder on the lower end of the conductive layer, wherein the melting point of the solder is lower than that of the metal; (k) stacking a plurality of the wafers, and performing a reflow process; and (l) cutting the stacked wafers, so as to form a plurality of three-dimensional packages. As such, the lower end of the conductive layer and the solder thereon are “inserted” into the space of the lower wafer, so as to enhance the joint between the conductive layer and the solder, and effectively reduce the overall height of the three-dimensional packages after joining.
摘要翻译：本发明涉及三维包装及其制造方法。该方法包括：（a）提供晶片; （b）在所述晶片中形成至少一个盲孔; （c）在盲孔的侧壁上形成隔离层; （d）在隔离层上形成导电层; （e）在导电层上形成干膜; （f）用金属填充盲孔; （g）去除干膜，图案化导电层; （h）去除盲孔中的金属的一部分以形成空间; （i）去除所述晶片的所述第二表面的一部分和所述隔离层的一部分，以暴露所述导电层的一部分; （j）在导电层的下端形成焊料，其中焊料的熔点低于金属的熔点; （k）堆叠多个晶片，并进行回流处理; 和（l）切割堆叠的晶片，以便形成多个三维封装。因此，导电层的下端和其上的焊料被“插入”到下晶片的空间中，以增强导电层和焊料之间的接合，并且有效地降低了三层结构的整体高度，加入后立体包装。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式