会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 2. 发明授权
    • Method of alternating grounded/floating poly lines to monitor shorts
    • 交替接地/浮动多线的方法来监控短路
    • US06858450B1
    • 2005-02-22
    • US10288871
    • 2002-11-05
    • Samantha L. DoanAmy C. TuW. Eugene Hill
    • Samantha L. DoanAmy C. TuW. Eugene Hill
    • G11C29/02H01L31/26H01L21/66
    • G11C29/025G11C16/04G11C29/02G11C2029/0403G11C2029/5002
    • A method for in-line testing of a chip to include multiple independent bit Flash memory devices, includes the steps of: grounding every other polysilicon line on the chip to emulate the multiple independent bit Flash memory devices, where an oxide line reside between every two polysilicon lines; scanning the polysilicon lines with an electron beam; examining voltage contrasts between the polysilicon lines; and determining if there are consecutively grounded polysilicon lines based on the voltage contrasts. If consecutive polysilicon lines appear to be grounded, then this indicates that a bridge defect exists between two of the consecutively grounded polysilicon lines. With this method, bridge defects in multiple independent bit Flash memory devices are better detected, leading to improved yield and reliability of the devices.
    • 一种用于在线测试芯片以包括多个独立位闪存器件的方法包括以下步骤:将芯片上的每隔一个多晶硅线接地,以模拟多个独立的位闪存器件,其中氧化物线驻留在每两个 多晶硅线 用电子束扫描多晶硅线; 检查多晶硅线之间的电压对比度; 以及基于电压对比确定是否存在连续接地的多晶硅线。 如果连续的多晶硅线看起来接地,则这表明在两个连续接地的多晶硅线之间存在桥缺陷。 通过这种方法,可以更好地检测多个独立位闪存器件中的桥接缺陷,从而提高器件的产量和可靠性。
    • 4. 发明授权
    • Differentially mis-aligned contacts in flash arrays to calibrate failure modes
    • 闪存阵列中的差分错误对齐触点,以校准故障模式
    • US07032193B1
    • 2006-04-18
    • US10320910
    • 2002-12-17
    • W. Eugene Hill
    • W. Eugene Hill
    • G06F17/50
    • H01L27/115G11C29/02G11C2029/0403G11C2029/5002H01L21/76816H01L27/105H01L27/1052H01L27/11521
    • A method and apparatus for calibrating failures in semiconductor memory devices due to contact mask misalignment includes: providing a plurality of semiconductor memory devices on a die; providing a contact mask with a plurality of known offsets; creating a plurality of contacts on the die using the contact mask; determining which devices on the die fail; and creating a pass/fail map for the devices. The pass/fail map can be used to determine the range of allowed misalignment and the amount of misalignment, providing a better understanding of how contact mask misalignment affects the yield and reliability of the memory devices. The pass/fail map may also be used for comparison with a pass/fail map created after the arrays have been subjected to a known stress.
    • 用于校准由于接触掩模未对准导致的半导体存储器件故障的方法和装置包括:在管芯上提供多个半导体存储器件; 提供具有多个已知偏移量的接触掩模; 使用所述接触掩模在所述管芯上产生多个接触; 确定模具上的哪些设备失效; 并为设备创建通过/失败映射。 通过/失败映射可用于确定允许的未对准的范围和未对准的量,从而更好地了解接触掩模未对准如何影响存储器件的产量和可靠性。 通过/失败映射也可用于与数组已经受到已知应力之后创建的通过/失败映射进行比较。