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    • 4. 发明申请
    • Liquid Cooling System for Stackable Modules in Energy-Efficient Computing Systems
    • 节能计算系统中可堆叠模块的液体冷却系统
    • US20120188719A1
    • 2012-07-26
    • US13435998
    • 2012-03-30
    • Wael R. El-EssawyThomas W. Keller, JR.Jarrod A. RoyJuan C. Rubio
    • Wael R. El-EssawyThomas W. Keller, JR.Jarrod A. RoyJuan C. Rubio
    • H05K7/20
    • H05K7/02G06F1/18G06F1/181G06F1/20H05K7/20
    • A processing module is provided that comprises a set of processing module sides, each comprising a circuit board, a plurality of connectors coupled to the circuit board, and a plurality of processing nodes coupled to the circuit board. Each processing module side couples to another processing module side to form a modular processing module. The modular processing module comprises an exterior connection to a power source and a communication system and a plurality of cold plates coupled to the plurality of processing nodes. Liquid coolant is circulated through the plurality of cold plates via a closed loop by at least one pump through a plurality of tubes and through at least one heat exchanger. The at least one heat exchanger is coupled to an exterior portion of the processing module. The at least one heat exchanger cools the liquid coolant using air surrounding the processing module.
    • 提供一种处理模块,其包括一组处理模块侧面,每个处理模块侧面包括电路板,耦合到电路板的多个连接器以及耦合到电路板的多个处理节点。 每个处理模块侧耦合到另一处理模块侧以形成模块化处理模块。 模块化处理模块包括到电源和通信系统的外部连接以及耦合到多个处理节点的多个冷板。 液体冷却剂通过多个冷板通过至少一个泵通过多个管并通过至少一个热交换器经由闭环循环。 至少一个热交换器耦合到处理模块的外部部分。 所述至少一个热交换器使用围绕所述处理模块的空气冷却所述液体冷却剂。