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2. 发明授权

US3909933A Method for transferring and bonding articles 失效
标题翻译：传送和粘贴物品的方法
公开(公告)号：US3909933A
公开(公告)日：1975-10-07
申请号：US46442374
申请日：1974-04-26
申请人： WESTERN ELECTRIC CO
发明人： DOUBEK JR EDWARD R , KENNEDY JOHN J , SANDMORE DONALD K
IPC分类号： H01L21/00 , G01J1/20
CPC分类号： H01L21/67144 , Y10T29/49137
摘要： A substrate to which electrical circuit elements, such as integrated circuit (IC) chips, are to be bonded to bond sites on a surface thereof, is positioned on a substrate support table which is actuable to move in directions parallel to orthogonal xy axes to successively position the substrate bond sites at a bonding location. First and second arrays of circuit elements are carried on first and second tables, respectively, which are positioned on opposite sides of the substrate support table. The first and the second tables are actuable to move in directions parallel to the x-y axes, upon the positioning of substrate bond sites at the bonding location, to position successive circuit elements of the first and the second arrays of elements at first and second pickup locations, respectively. A pair of bonding devices, the first for transferring circuit elements of the first array from the first pickup location to the bonding location and the second for transferring circuit elements of the second array from the second pickup location to the bonding location, alternately pick up circuit elements of the first and the second arrays at the first and the second pickup locations, respectively, transfer the circuit elements to the bonding location, and bond the elements to a bond site thereat.
摘要翻译：诸如集成电路（IC）芯片之类的电路元件将被连接到其表面上的接合位置的基板被定位在基板支撑台上，该基板支撑台可致动地沿平行于正交xy轴的方向移动以依次将键合位置定位在键合位置。电路元件的第一和第二阵列分别承载在位于基板支撑台的相对侧上的第一和第二台上。第一和第二表能够在平行于xy轴的方向上移动，以便在接合位置处定位衬底接合位置时，将第一和第二阵列元件的连续电路元件定位在第一和第二拾取位置，分别。一对接合装置，第一用于将第一阵列的电路元件从第一拾取位置转移到接合位置，第二接收装置用于将第二阵列的电路元件从第二拾取位置传送到接合位置，交替地拾取电路第一和第二拾取位置处的第一和第二阵列的元件分别将电路元件传送到接合位置，并将元件结合到其上的接合位置。

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