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1. 发明申请

US20100234978A1 METHOD FOR FINDING THE CORRELATION BETWEEN THE TOOL PM AND THE PRODUCT YIELD 有权
标题翻译：发现工具PM与产品之间的相关性的方法
公开(公告)号：US20100234978A1
公开(公告)日：2010-09-16
申请号：US12507396
申请日：2009-07-22
申请人： YI FENG LEE , Chun Chi Chen , Yun-Zong Tian , Wei Jun Chen , Tsung-Wei Lin
发明人： YI FENG LEE , Chun Chi Chen , Yun-Zong Tian , Wei Jun Chen , Tsung-Wei Lin
IPC分类号： G06F17/00
CPC分类号： G06Q10/06
摘要： A method for finding the correlation between tool PM (prevention maintenance) and the product yield of the tool is disclosed. The method uses a moving average method to magnify a curve trend that is formed by the product yield data that is captured during a predetermined days before PM and after PM. The magnified curve trend is shown by a Cumulative sum chart. The Cumulative sum chart is analyzed for informing related workers of the effect between the tool PM and the product yield, so as to accurately estimate PM timing. Thereby, via the method, the effect between the tool PM and the product yield may be determined, which serves as an important reference for workers to execute further PM.
摘要翻译：公开了一种用于找到工具PM（防止维护）与工具的产品收益之间的相关性的方法。该方法使用移动平均法来放大由PM和PM之后的预定日期捕获的产品产量数据形成的曲线趋势。放大曲线趋势由累积和图表示。分析累积总和图，通知相关工作者工具PM与产品产量之间的影响，以准确估计PM定时。因此，通过该方法，可以确定工具PM和产品产量之间的效果，其作为工人进一步执行PM的重要参考。

2. 发明申请

US20100205127A1 METHOD FOR PLANNING A SEMICONDUCTOR MANUFACTURING PROCESS BASED ON USERS' DEMANDS 有权
标题翻译：基于用户需求制定半导体制造工艺的方法
公开(公告)号：US20100205127A1
公开(公告)日：2010-08-12
申请号：US12471711
申请日：2009-05-26
申请人： WEI JUN CHEN , CHUN CHI CHEN , YUN-ZONG TIAN , YI FENG LEE , TSUNG-WEI LIN
发明人： WEI JUN CHEN , CHUN CHI CHEN , YUN-ZONG TIAN , YI FENG LEE , TSUNG-WEI LIN
IPC分类号： G06N3/12 , G06N7/02 , G06F19/00
CPC分类号： G06N3/126 , G06N7/02
摘要： A method for planning a semiconductor manufacturing process based on users' demands includes the steps of: establishing a genetic algorithm model and inputting data; establishing a fuzzy system and setting one output parameter representing percent difference of each cost function in neighbor generations; setting to have a modulation parameter corresponding to each input parameter for adjusting fuzzy sets of the output parameter; executing genetic algorithm actions; executing fuzzy inference actions; eliminating chromosomes that produce output parameter smaller than a defined lower limit, and the remaining chromosomes that produces the largest output parameter is defined as the optimum chromosome, wherein the genetic algorithm actions stops being executed upon the optimum chromosome; then determining whether or not a defined number of generations has been reached, if yes, executing the optimum chromosome of the last generation; if no, continuing executing the genetic algorithm actions, thereby finding the optimum semiconductor manufacturing process for users.
摘要翻译：一种基于用户需求的半导体制造过程规划方法，包括以下步骤：建立遗传算法模型并输入数据; 建立一个模糊系统，并设置一个输出参数，代表相邻代的每个成本函数的百分比差; 设置为具有对应于每个输入参数的调制参数，用于调整输出参数的模糊集合; 执行遗传算法动作; 执行模糊推理动作; 消除产生小于规定下限的输出参数的染色体，将产生最大输出参数的剩余染色体定义为最佳染色体，其中遗传算法动作停止在最佳染色体上执行; 然后确定是否已经达到定义数量的世代，如果是，则执行最后一代的最佳染色体; 如果否，继续执行遗传算法动作，从而为用户找到最佳的半导体制造过程。

3. 发明申请

US20090327173A1 METHOD FOR PREDICTING CYCLE TIME 有权
标题翻译：预测周期时间的方法
公开(公告)号：US20090327173A1
公开(公告)日：2009-12-31
申请号：US12243301
申请日：2008-10-01
申请人： YI FENG LEE , CHUN CHI CHEN , YUN-ZONG TIAN , TSUNG-WEI LIN
发明人： YI FENG LEE , CHUN CHI CHEN , YUN-ZONG TIAN , TSUNG-WEI LIN
IPC分类号： G06F15/18 , G06N5/02 , G06N3/02
CPC分类号： G06F17/30598 , G06Q10/06
摘要： A method for predicting cycle time comprises the steps of: collecting a plurality of known sets of data; using a clustering method to classify the known sets of data into a plurality of clusters; using a decision tree method to build a classification rule of the clusters; building a prediction model of each cluster; preparing data predicted set of data; using the classification rule to determine that to which clusters the predicted set of data belongs; and using the prediction model of the cluster to estimate the objective cycle time of the predicted set of data. Therefore, engineers can beforehand know the cycle time that one lot of wafers spend in the forward fabrication process, which helps engineers to properly arrange the following fabrication process of the lot of wafer.
摘要翻译：一种用于预测周期时间的方法包括以下步骤：收集多个已知的数据集; 使用聚类方法将已知的数据集合分类成多个聚类; 使用决策树方法构建集群的分类规则; 构建每个群集的预测模型; 准备数据预测数据集; 使用分类规则来确定预测的数据集合属于哪个集群; 并使用群集的预测模型来估计预测数据集的目标周期时间。因此，工程师可以事先知道大量晶圆在正向制造过程中花费的周期时间，这有助于工程师正确布置晶圆批次的以下制造工艺。

4. 发明申请

US20100233830A1 METHOD FOR MONITORING FABRICATION PARAMETER 有权
标题翻译：监测制造参数的方法
公开(公告)号：US20100233830A1
公开(公告)日：2010-09-16
申请号：US12469051
申请日：2009-05-20
申请人： YI FENG LEE , CHUN CHI CHEN , YUN-ZONG TIAN , WEI JUN CHEN
发明人： YI FENG LEE , CHUN CHI CHEN , YUN-ZONG TIAN , WEI JUN CHEN
IPC分类号： H01L21/66
CPC分类号： G05B19/41875 , G05B2219/31483 , G05B2219/32191 , G05B2219/45031 , H01L22/20 , Y02P90/22
摘要： A method for monitoring fabrication parameters comprises steps of: obtaining a normal parameter variance curve and a comparing parameter variance curve; defining a plurality of normal parameter points on the normal parameter variance curve; defining a plurality of comparing parameter points on the comparing parameter variance curve; finding out the corresponding comparing parameter points nearest to the normal parameter points; calculating the distances between the normal parameter points and the corresponding comparing parameter points thereof; summing up the distances so as to receive a total distance; and determining whether or not the total distance exceeds a limit. Via this arrangement, when fabrication parameter of tool is abnormal, it can be efficiently and immediately determined.
摘要翻译：一种用于监测制造参数的方法包括以下步骤：获得正常参数方差曲线和比较参数方差曲线; 在正常参数方差曲线上定义多个正常参数点; 在比较参数方差曲线上定义多个比较参数点; 找出最接近正常参数点的相应比较参数点; 计算正常参数点与其对应的比较参数点之间的距离; 总结距离，以获得总距离; 并确定总距离是否超过限制。通过这种布置，当工具的制造参数异常时，可以有效且立即确定。

5. 发明申请

US20100256792A1 METHOD OF ADJUSTING WAFER PROCESSING SEQUENCE 有权
标题翻译：调整加工顺序的方法
公开(公告)号：US20100256792A1
公开(公告)日：2010-10-07
申请号：US12476559
申请日：2009-06-02
申请人： YUN-ZONG TIAN , CHUN CHI CHEN , YI FENG LEE , WEI JUN CHEN , SHIH CHANG KAO , YIJ CHIEH CHU , CHENG-HAO CHEN
发明人： YUN-ZONG TIAN , CHUN CHI CHEN , YI FENG LEE , WEI JUN CHEN , SHIH CHANG KAO , YIJ CHIEH CHU , CHENG-HAO CHEN
IPC分类号： G06F17/00
CPC分类号： G05B19/41865 , G05B2219/32015 , G05B2219/32016 , G05B2219/32019 , G05B2219/45031 , Y02P90/20
摘要： A method of adjusting wafer process sequence includes steps of collecting production parameters for a plurality of lots; selecting a plurality of key parameters from the production parameters, wherein the key parameters at least includes a processing sequence; defining a formula to obtain an epsilon value; categorizing the lots into groups according to the epsilon value and the minimum point number by using density-based spatial clustering of application with noise (DBSCAN); and adjusting the processing sequences of the lots in the groups. Thereby, the lots with the same process recipe can be continuously or simultaneously sent into a machine, thereby reducing replacement of process recipes or shortening machine idle time.
摘要翻译：调整晶片工艺顺序的方法包括收集多个批次的生产参数的步骤; 从所述生产参数中选择多个关键参数，其中所述关键参数至少包括处理序列; 定义公式以获得ε值; 通过使用基于密度的噪声空间聚类（DBSCAN），根据ε值和最小点数将批次分组成组。并调整组中批次的处理顺序。因此，具有相同处理配方的批次可以连续或同时发送到机器中，从而减少过程配方的更换或缩短机器空闲时间。

6. 发明申请

US20090259332A1 FUZZY CONTROL METHOD FOR ADJUSTING A SEMICONDUCTOR MACHINE 有权
标题翻译：用于调整半导体机器的FUZZY控制方法
公开(公告)号：US20090259332A1
公开(公告)日：2009-10-15
申请号：US12241568
申请日：2008-09-30
申请人： YI FENG LEE , TZU-CHENG LIN , CHUN CHI CHEN , YUN-ZONG TIAN
发明人： YI FENG LEE , TZU-CHENG LIN , CHUN CHI CHEN , YUN-ZONG TIAN
IPC分类号： G05B13/00 , H01L21/02 , G06N7/02
CPC分类号： G05B13/0275 , G06N99/005 , Y10S706/904
摘要： A method of fuzzy control for adjusting a semiconductor machine comprising: providing measurement values from first the “parameter of a pre-semiconductor manufacturing process”, second the “parameter of the semiconductor manufacturing process”, and third the “operation parameter of the semiconductor manufacturing process”; performing a fuzzy control to define two inputs and one output corresponding to the measurement values, wherein the difference between the first and third values, and the difference between the second and third values, forms the two inputs, then from the two inputs one target output is calculated by fuzzy inference; finally, determining if the target output is in or out of an acceptable range. Whereby the target output is the “machine control parameter of the semiconductor manufacturing process” and when within an acceptable range is used for adjusting the semiconductor machine.
摘要翻译：一种用于调整半导体机器的模糊控制方法，包括：首先从“半导体制造工艺的参数”提供测量值，第二个“半导体制造工艺的参数”，第三个“半导体制造的操作参数处理”; 执行模糊控制以定义对应于测量值的两个输入和一个输出，其中第一和第三值之间的差异以及第二和第三值之间的差异形成两个输入，然后从两个输入中选择一个目标输出通过模糊推理计算; 最后，确定目标输出是否在可接受的范围之内。由此，目标输出是“半导体制造工序的机器控制参数”，并且在可接受范围内用于调整半导体机器时。

7. 发明申请

US20090276182A1 MACHINE FAULT DETECTION METHOD 审中-公开
标题翻译：机器故障检测方法
公开(公告)号：US20090276182A1
公开(公告)日：2009-11-05
申请号：US12140584
申请日：2008-06-17
申请人： YI FENG LEE , CHUN CHI CHEN , YUN-ZONG TIAN
发明人： YI FENG LEE , CHUN CHI CHEN , YUN-ZONG TIAN
IPC分类号： G06F17/18 , G06F15/00
CPC分类号： G05B19/41875 , G05B2219/32196 , G05B2219/32197 , G05B2219/45031 , Y02P90/22
摘要： A machine fault detection method is applied to a plurality of machines. The machines are used for processing at least one wafer-in-process (WIP). The method includes the flowing steps. A statistical database of the wafer-in-process is provided. An association rules is used to search and survey the statistical database in order to calculate a support degree and a reliability degree. A threshold is selected to determine whether the support degree and the reliability degree have surpassed the threshold or not. When the support degree and the reliability degree have surpassed the threshold, a root cause error in the statistical database corresponded by the support degree and the reliability degree is determined. When the support degree and the reliability degree have not surpassed the threshold, the above steps are repeated.
摘要翻译：机器故障检测方法应用于多台机器。这些机器用于处理至少一个晶片在制品（WIP）。该方法包括流动步骤。提供了晶片在制程的统计数据库。使用关联规则来搜索和调查统计数据库，以计算支持度和可靠度。选择阈值来确定支持度和可靠度是否超过阈值。当支持度和可靠度超过阈值时，统计数据库中的根本原因误差由支持度和可靠度决定。当支撑度和可靠度没有超过阈值时，重复上述步骤。

8. 发明申请

US20100010763A1 METHOD FOR DETECTING VARIANCE IN SEMICONDUCTOR PROCESSES 审中-公开
标题翻译：用于检测半导体工艺中的变化的方法
公开(公告)号：US20100010763A1
公开(公告)日：2010-01-14
申请号：US12202631
申请日：2008-09-02
申请人： YIJ CHIEH CHU , CHUN CHI CHEN , YUN-ZONG TIAN , YI FENG LEE
发明人： YIJ CHIEH CHU , CHUN CHI CHEN , YUN-ZONG TIAN , YI FENG LEE
IPC分类号： G06F19/00
CPC分类号： G05B23/024 , G05B23/0294 , G05B2219/37224
摘要： A method of detecting variance by regression model is disclosed. Said method comprising: preparing the FDC and WAT data for analysis, figuring out what latent variable effect WAT by Factor Analysis, utilizing Principal Component Analysis to reduce the number of FDC variables to a few independent principal components, demonstrating how the tool and FDC affect WAT by Analysis of covariance model, and constructing interrelationship among FDC, WAT and tools. The interrelationship can point out which parameter effect WAT significantly. By the method, when WAT abnormal situation happened, it is easier for engineers to trace where the problem is.
摘要翻译：公开了一种通过回归模型检测方差的方法。所述方法包括：准备用于分析的FDC和WAT数据，通过因子分析确定潜在变量效应WAT，利用主成分分析将FDC变量数量减少到少数独立主成分，证明工具和FDC如何影响WAT 通过协方差模型分析，构建FDC，WAT和工具之间的相互关系。相互关系可以显着地指出哪个参数效应WAT。通过这种方法，当WAT异常情况发生时，工程师更容易追踪问题的位置。

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