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1. 发明授权

US5824155A Method and apparatus for dispensing viscous material 失效
标题翻译：用于分配粘性材料的方法和装置
公开(公告)号：US5824155A
公开(公告)日：1998-10-20
申请号：US555253
申请日：1995-11-08
申请人： Vinh Van Ha , John Trublowski , Brenda Joyce Nation , Jeff Lin , Chin-Yuan Perng
发明人： Vinh Van Ha , John Trublowski , Brenda Joyce Nation , Jeff Lin , Chin-Yuan Perng
IPC分类号： H05K3/12 , B05C3/02
CPC分类号： H05K3/1233 , H05K2203/0126
摘要： A novel apparatus for compressing viscous material through openings in a stencil is disclosed. The novel apparatus has a compression headcap which provides a contained environment to direct and to aid the flow of pressurized viscous material through the openings in the stencil. The compression headcap includes two generally parallel wiper blades that are biased into sliding communication with the stencil. Longitudinal diffuser plates guide and equalize the flow of the viscous material into the volume between two generally parallel wiper blades.
摘要翻译：公开了一种通过模板中的开口压缩粘性材料的新颖设备。新型装置具有压缩头帽，其提供容纳的环境以引导和帮助压力粘性材料流过模板中的开口。压缩头盖包括两个大体上平行的刮片，其被偏置成与模板滑动连通。纵向扩散板引导并均衡粘性材料流入两个大致平行的雨刮片之间的体积。

2. 发明授权

US06423141B1 Method and apparatus for dispensing viscous material 失效
标题翻译：用于分配粘性材料的方法和装置
公开(公告)号：US06423141B1
公开(公告)日：2002-07-23
申请号：US09358980
申请日：1999-07-22
申请人： Jeff Lin , John Trublowski , Vinh Van Ha
发明人： Jeff Lin , John Trublowski , Vinh Van Ha
IPC分类号： B05C302
CPC分类号： B41F15/42 , B41F15/40 , H05K3/1233 , H05K2203/0126
摘要： A novel apparatus for compressing viscous material through openings in a stencil is disclosed. The novel apparatus has a compression head cap which provides a contained environment to direct and to aid the flow of pressurized viscous material through the openings in the stencil. The compression head cap further includes a plurality of members which are selectively and movably disposed within the contained environment and which selectively remove an amount of the material from the environment, effective to prevent the material from being undesirably dispensed by the head cap.
摘要翻译：公开了一种通过模板中的开口压缩粘性材料的新颖设备。新型装置具有压缩头帽，其提供容纳的环境以引导和帮助压力粘性材料流过模板中的开口。压缩头帽还包括多个构件，其被选择性地和可移动地设置在所容纳的环境中并且选择性地从环境中去除一定量的材料，有效地防止材料被头帽不期望地分配。

3. 发明授权

US06274819B1 Method and article for the connection and repair of flex and other circuits 失效
公开(公告)号：US06274819B1
公开(公告)日：2001-08-14
申请号：US09387808
申请日：1999-09-01
申请人： Delin Li , Jay DeAvis Baker , Achyuta Achari , Brenda Joyce Nation , John Trublowski
发明人： Delin Li , Jay DeAvis Baker , Achyuta Achari , Brenda Joyce Nation , John Trublowski
IPC分类号： H05K111
CPC分类号： H05K3/361 , H05K1/0293 , H05K1/117 , H05K1/118 , H05K3/0052 , H05K3/225 , H05K2201/053 , H05K2201/09127 , H05K2201/09409 , H05K2201/09709 , H05K2201/0979 , H05K2203/0228 , H05K2203/175 , Y10T29/49124 , Y10T29/49169 , Y10T29/4973 , Y10T29/49732
摘要： An article and method for making and repairing connections between first and second circuits, such as flex circuits. The article 10 includes: a flexible dielectric substrate 12 having first and second edges 14/16, and a plurality of conductive circuit traces 18 arranged on or within the substrate, wherein each of the traces extends from proximate the first edge 14 to proximate the second edge 16. Each of the circuit traces 18 includes: a first connection feature 20 disposed proximate the first edge 14; a second connection feature 22 disposed proximate the second edge 16; and at least one third connection feature 24 disposed between the first and second edges 14/16. Each of the first, second, and third connection features 20/22/24 is a plated through hole, a plated blind via, or a mounting pad. This article 10 may be used to connect together the first and second circuits 50/60 using the first and second connection features 20/22, such as by soldering. If either of the two circuits needs to be subsequently detached (e.g., because of a component failure), the article 10 may be cut so as to present a set of third connection features 24 to which a new replacement circuit may be connected.

4. 发明授权

US06270354B1 Multi-connectable printed circuit board 有权
公开(公告)号：US06270354B1
公开(公告)日：2001-08-07
申请号：US09387202
申请日：1999-08-31
申请人： Delin Li , Jay DeAvis Baker , Achyuta Achari , Brenda Joyce Nation , John Trublowski
发明人： Delin Li , Jay DeAvis Baker , Achyuta Achari , Brenda Joyce Nation , John Trublowski
IPC分类号： H01R1200
摘要： A multi-connectable printed circuit assembly, comprising: (a) a printed circuit substrate 11 having a first edge 22 and first and second edge regions 44/55, wherein at least the first edge region 44 is defined along the first edge 22; (b) a first array 77 of electrical connection features 66 disposed on or within the substrate proximate the first edge region 44; (c) a second array 88 of electrical connection features 66 disposed on or within the substrate proximate the second edge region 55, wherein the second array 88 is substantially a duplication or a mirror image of the first array 77; and (d) a plurality of circuit traces 99 disposed on or within the substrate such that each electrical connection feature 66 of the first array 77 is connected by one of the circuit traces 99 to a corresponding electrical connection feature 66 of the second array 88.

5. 发明授权

US06601292B2 Method for the connection and repair of flex and other circuits 失效
标题翻译：柔性和其他电路的连接和修复方法
公开(公告)号：US06601292B2
公开(公告)日：2003-08-05
申请号：US09891697
申请日：2001-06-26
申请人： Delin Li , Jay DeAvis Baker , Achyuta Achari , Brenda Joyce Nation , John Trublowski
发明人： Delin Li , Jay DeAvis Baker , Achyuta Achari , Brenda Joyce Nation , John Trublowski
IPC分类号： H05K300
CPC分类号： H05K3/361 , H05K1/0293 , H05K1/117 , H05K1/118 , H05K3/0052 , H05K3/225 , H05K2201/053 , H05K2201/09127 , H05K2201/09409 , H05K2201/09709 , H05K2201/0979 , H05K2203/0228 , H05K2203/175 , Y10T29/49124 , Y10T29/49169 , Y10T29/4973 , Y10T29/49732
摘要： A method for making and repairing connections between first and second circuits, such as flex circuits. An article 10 includes: a flexible dielectric substrate 12 having first and second edges 14/16, and a plurality of conductive circuit traces 18 arranged on or within the substrate, wherein each of the traces extends from proximate the first edge 14 to proximate the second edge 16. Each of the circuit traces 18 includes: a first connection feature 20 disposed proximate the first edge 14; a second connection feature 22 disposed proximate the second edge 16; and at least one third connection feature 24 disposed between the first and second edges 14/16. Each of the first, second, and third connection features 20/22/24 is a plated through hole, a plated blind via, or a mounting pad. This article 10 may be used to connect together the first and second circuits 50/60 using the first and second connection features 20/22, such as by soldering. If either of the two circuits needs to be subsequently detached (e.g., because of a component failure), the article 10 may be cut so as to present a set of third connection features 24 to which a new replacement circuit may be connected.
摘要翻译：用于制造和修复第一和第二电路之间的连接的方法，例如柔性电路。物品10包括：具有第一和第二边缘14/16的柔性电介质基底12和布置在基底上或内部的多个导电电路迹线18，其中每个迹线从靠近第一边缘14延伸到接近第二边缘14 每个电路迹线18包括：靠近第一边缘14设置的第一连接特征20; 设置在第二边缘16附近的第二连接特征22; 以及设置在第一和第二边缘14/16之间的至少一个第三连接特征24。第一，第二和第三连接特征20/22/24中的每一个是电镀通孔，电镀盲孔或安装垫。本文10可以用于使用第一和第二连接特征20/22（例如通过焊接）将第一和第二电路50/60连接在一起。如果两个电路中的任一个需要随后分离（例如，由于部件故障），则可以切割物品10以便呈现一组第三连接特征24，新的替换电路可以连接到该组。

6. 发明授权

US06395087B1 Method and apparatus for dispensing viscous material 失效
标题翻译：用于分配粘性材料的方法和装置
公开(公告)号：US06395087B1
公开(公告)日：2002-05-28
申请号：US09359625
申请日：1999-07-22
申请人： Vivek Amir Jairazbhoy , Jeff (Jin Her) Lin , John Trublowski , Vinh Van Ha , Zhaoji Yang
发明人： Vivek Amir Jairazbhoy , Jeff (Jin Her) Lin , John Trublowski , Vinh Van Ha , Zhaoji Yang
IPC分类号： B05C502
CPC分类号： B23K3/0607 , B23K2101/42 , B41F15/42 , H05K3/1233 , H05K2203/0126
摘要： A novel apparatus for compressing viscous material through openings in a stencil is disclosed. The novel apparatus has a compress on head cap which provides a contained environment to direct and to aid the flow of pressurized viscous material through the openings in the stencil. In another embodiment of the invention, the compression head includes a viscous material reception chamber which has a certain shape which is effective to cause said received viscous material to be selectively dispensed while having a substantially uniform velocity profile and which further provides for the creation of a substantially uniform pressure profile.
摘要翻译：公开了一种通过模板中的开口压缩粘性材料的新颖设备。新颖的装置具有头盖上的压缩，其提供容纳的环境以引导和帮助加压的粘性材料通过模板中的开口的流动。在本发明的另一个实施例中，压缩头包括粘性材料接收室，其具有一定形状，其有效地使所述接收的粘性材料选择性地分配，同时具有基本上均匀的速度分布，并且进一步提供了一种基本均匀的压力分布。

7. 发明授权

US06302306B1 Method and apparatus for dispensing viscous material 失效
标题翻译：用于分配粘性材料的方法和装置
公开(公告)号：US06302306B1
公开(公告)日：2001-10-16
申请号：US09358981
申请日：1999-07-22
申请人： Jeff Jin Her Lin , John Trublowski , Vinh Van Ha
发明人： Jeff Jin Her Lin , John Trublowski , Vinh Van Ha
IPC分类号： B67D542
CPC分类号： B41F15/42 , H05K3/1233 , H05K2203/0126
摘要： A novel apparatus for compressing viscous material through openings in a stencil is disclosed. The novel apparatus has a compression head cap which provides a contained environment to direct and to aid the flow of pressurized viscous material through the openings in the stencil. The apparatus further includes a selectively expandable diaphragm which selectively and expandably allows the viscous material to be dispensed into the compression head cap.
摘要翻译：公开了一种通过模板中的开口压缩粘性材料的新颖设备。新型装置具有压缩头帽，其提供容纳的环境以引导和帮助压力粘性材料流过模板中的开口。该装置还包括选择性地可膨胀的膜片，其选择性地且可膨胀地允许将粘性材料分配到压缩头盖中。

8. 发明授权

US06286422B1 Method and apparatus for dispensing viscous material 失效
标题翻译：用于分配粘性材料的方法和装置
公开(公告)号：US06286422B1
公开(公告)日：2001-09-11
申请号：US09359617
申请日：1999-07-22
申请人： Jeff (Jin Her) Lin , John Trublowski , Vinh Van Ha
发明人： Jeff (Jin Her) Lin , John Trublowski , Vinh Van Ha
IPC分类号： B41F1544
CPC分类号： B41F15/42 , B41F15/44 , H05K3/1233 , H05K2203/0126
摘要： A novel apparatus for compressing viscous material through openings in a stencil is disclosed. The novel apparatus has a compression head cap which provides a contained environment to direct and to aid the flow of pressurized viscous material through the openings in the stencil.
摘要翻译：公开了一种通过模板中的开口压缩粘性材料的新颖设备。新型装置具有压缩头帽，其提供容纳的环境以引导和帮助压力粘性材料流过模板中的开口。

9. 发明授权

US5878661A Self-shearing stencil 失效
标题翻译：自剪模板
公开(公告)号：US5878661A
公开(公告)日：1999-03-09
申请号：US114118
申请日：1998-07-13
申请人： Andrew Zachary Glovatsky , Vivek Amir Jairazbhoy , Jeff Lin , John Trublowski
发明人： Andrew Zachary Glovatsky , Vivek Amir Jairazbhoy , Jeff Lin , John Trublowski
IPC分类号： B41N1/24 , H05K3/12 , B05C17/06
CPC分类号： H05K3/1225 , B41N1/24 , Y10T29/49169
摘要： There is disclosed herein a self-shearing stencil for use in applying solder paste or other bonding material atop a printed circuit board (PCB) in a predefined pattern. The stencil 50 has a top surface 12, a bottom surface 14, a first surface cavity 16 in the top surface, and a second surface cavity 18 in the bottom surface proximate the first surface. The cavities 16/18 overlap in a predefined manner so as to be in open communication with each other. When the stencil is placed on the PCB, the cavities are filled with solder paste and the PCB is then lowered away from the stencil, whereupon a bottom ledge 26 (defined by the stencil material underneath the first cavity) shears off the solder paste in the first cavity from the paste in the second cavity.
摘要翻译：这里公开了一种自剪切模板，用于以预定图案在印刷电路板（PCB）的顶部上施加焊膏或其它粘合材料。模板50具有顶表面12，底表面14，顶表面中的第一表面空腔16和靠近第一表面的底表面中的第二表面腔18。空腔16/18以预定的方式重叠，以便彼此开放连通。当模板放置在PCB上时，空穴填充有焊膏，然后将PCB从模板上降下，然后将底部凸缘26（由第一腔下方的模板材料限定）在该模具中剪切出焊膏第一腔从第二腔中的糊状物。

10. 发明授权

US5909839A Method for dispensing solder paste on a non-planar substrate using an array of ultrasonically agitated pins 失效
标题翻译：使用超声波搅拌销的阵列在非平面基板上分配焊膏的方法
公开(公告)号：US5909839A
公开(公告)日：1999-06-08
申请号：US857159
申请日：1997-05-15
申请人： Robert Edward Belke, Jr. , John Trublowski , Michael George Todd
发明人： Robert Edward Belke, Jr. , John Trublowski , Michael George Todd
IPC分类号： B23K1/20 , B23K31/02 , B23K35/14 , B60R16/02 , H05K1/00 , H05K3/34 , B23K35/12
CPC分类号： H05K3/3484 , H02G3/266 , H05K1/0284 , H05K2201/09018 , H05K2203/0195 , H05K2203/0338
摘要： A method is provided for applying a fluid to a plurality of locations on a non-planar substrate. The apparatus used includes a movable base and an array of pins connected to the base. Each pin has a distal end which is vertically movable with respect to the base independently of the rest of the array of pins. Each distal end is adapted to transfer fluid to a location on the substrate by having a greater affinity for the fluid than the fluid has for itself and a lesser affinity for the fluid than the fluid has for the substrate. Accordingly, the distal ends may be dipped in the fluid and moved into contact with the substrate such that the distal ends may collapse toward the base as the distal ends engage the substrate to facilitate further movement of the base toward the substrate for application of fluid to each of the plurality of locations.
摘要翻译：提供了一种将流体施加到非平面基底上的多个位置的方法。所使用的装置包括可移动基座和连接到基座的销的阵列。每个销具有远端，该远端相对于底座可垂直移动，而与销的其余部分无关。每个远端适合于通过对流体具有比流体本身更大的亲和力并且对流体具有比流体对底物更小的亲和力，将流体转移到基底上的位置。因此，远端可以浸入流体中并且移动到与基底接触，使得当远端接合基底时，远端可能朝向基部折叠，以便于基部朝向基底的进一步移动以将流体施加到多个位置中的每一个。

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