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    • 2. 发明授权
    • Semiconductor structures and manufacturing methods
    • 半导体结构及制造方法
    • US06590657B1
    • 2003-07-08
    • US09408246
    • 1999-09-29
    • Christian SummererShahid ButtGerhard KunkelUwe Paul Schroeder
    • Christian SummererShahid ButtGerhard KunkelUwe Paul Schroeder
    • G01B1100
    • G03F9/7076H01L23/544H01L2223/54426H01L2223/54453H01L2924/0002H01L2924/00
    • A semiconductor body having an alignment mark comprising a material adapted to absorb impinging light and to radiate light in response to the absorption of the impinging light, such radiated light being radiated with a wavelength different from the wavelength of the impinging light. Also a method and apparatus for detecting an alignment mark on a semiconductor body. The method and apparatus successively scan an alignment illumination comprising the impinging light over the surface of the semiconductor surface and over the alignment mark. The impinging energy is reflected by the surface of the semiconductor when such impinging light is over and is reflected by the surface of the semiconductor. The impinging energy is absorbed by the material and is then radiated by the material when such impinging energy is scanned over such material. The reflected light is selectively filtered while the radiated light is passed to a detector.
    • 一种具有对准标记的半导体本体,包括适于吸收入射光并响应于入射光的吸收而辐射光的材料,这种辐射光以不同于入射光的波长的波长辐射。 还有一种用于检测半导体本体上的对准标记的方法和装置。 该方法和装置连续地扫描包括在半导体表面的表面上和对准标记上的入射光的对准照明。 当这种入射光结束并被半导体的表面反射时,入射能量被半导体的表面反射。 冲击能量被材料吸收,然后当这种冲击能量在这种材料上扫描时被材料辐射。 当辐射光通过检测器时,反射光被选择性地过滤。
    • 5. 发明授权
    • Phase-shift mask
    • 相移掩模
    • US07074529B2
    • 2006-07-11
    • US10787118
    • 2004-02-27
    • Shahid ButtGerhard Kunkel
    • Shahid ButtGerhard Kunkel
    • G01F9/00
    • G03F1/32G03F1/26G03F7/70325
    • The relative surface area sizes of portions having distinct phase-shift and transmission of light of a pattern on a phase-shift mask substantially obey the condition that the product of surface area and transmission of the electrical field strength is the same for all of the portions. Then, frequency doubling occurs due to vanishing zero order diffraction orders and in the case of high-transition attenuated phase-shift masks a large first order diffraction amplitude reveals an even an improved as compared with conventional phase-shift masks. Two-dimensional matrix-like structures particularly on attenuated or halftone phase-shift masks can be arranged to image high-density patterns on a semiconductor wafer. The duty cycles of pattern matrices can be chosen being different from one in two orthogonal directions nevertheless leading to frequency doubling.
    • 在相移掩模上具有明显的相移和图案的光的透射的部分的相对表面积大小基本上遵循对于所有部分的表面积和电场强度透射率的乘积相同的条件 。 然后,由于零阶衍射级消失而发生倍频,并且在高转变衰减相移掩模的情况下,与常规相移掩模相比,大的一级衍射幅度显示出均匀的改善。 特别是在衰减或半色调相移掩模上的二维矩阵状结构可以被布置成对半导体晶片上的高密度图案进行成像。 可以选择模式矩阵的占空比不同于两个正交方向上的一个,但是导致倍频。
    • 10. 发明申请
    • Method for producing a phase mask
    • 相位掩模的制造方法
    • US20050196683A1
    • 2005-09-08
    • US11056402
    • 2005-02-14
    • Wolfgang HenkeGerhard Kunkel
    • Wolfgang HenkeGerhard Kunkel
    • G02B27/14G03C5/00G03F1/00G03F9/00
    • G02B27/14G03C5/00G03F1/32
    • A first and a second phase-shifting, semitransparent layer are formed on a substrate. The layers are patterned lithographically to form first elevated structure elements on the substrate with a first degree of transmission and second structure elements with a second degree of transmission, where the second degree of transmission is different from the first degree of transmission. Memory products can be produced with high resolution and high dimensional accuracy when the structure elements are transferred to a semiconductor substrate, by virtue of dense structure arrangements being represented by the structure elements with a high degree of transmission of more than 30% and, on the same mask, isolated structure arrangements having a low density being represented by the structure elements with a lower degree of transmission.
    • 在基板上形成第一和第二相移半透明层。 这些层被光刻地图案化以形成具有第一传播程度的第一高度结构元件和具有第二传输度的第二结构元件,其中第二传播距离与第一传播程度不同。 当结构元件被转移到半导体衬底时,由于结构元件以高度透过率超过30%的结构元件表示的密集结构布置,可以以高分辨率和高尺寸精度制造存储器产品,并且在 具有低密度的相同的掩模,隔离结构布置由具有较低透射度的结构元件表示。