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1. 发明申请

US20100025453A1 METHOD AND DEVICE FOR CONTROLLING THE GENERATION OF ULTRASONIC WIRE BONDS 有权
标题翻译：用于控制超声波束发生的方法和装置
公开(公告)号：US20100025453A1
公开(公告)日：2010-02-04
申请号：US12439883
申请日：2007-09-04
申请人： Ute Geissler , Herbert Reichl , Holger Gaul , Klaus-Dieter Lang , Martin Schneider-Ramelow
发明人： Ute Geissler , Herbert Reichl , Holger Gaul , Klaus-Dieter Lang , Martin Schneider-Ramelow
IPC分类号： B23K20/10 , B23K37/00
CPC分类号： B23K20/005 , H01L24/45 , H01L24/48 , H01L24/78 , H01L24/85 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/4847 , H01L2224/78313 , H01L2224/78318 , H01L2224/8518 , H01L2224/85206 , H01L2224/859 , H01L2924/01013 , H01L2924/01019 , H01L2924/01033 , H01L2924/01041 , H01L2924/01057 , H01L2924/01074 , H01L2924/01079 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/20303 , H01L2924/20304 , H01L2924/20305 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076 , H01L2924/01014 , H01L2924/00014 , H01L2924/00
摘要： A method for generating a wire bond between a wire and an electrical contact member is provided. The method comprising the steps of: pressing a first surface of a portion of the wire against a second surface of the electrical contact member with a first force while vibrating the portion of the wire along the second surface in order to generate a bond; measuring the time dependent vibration amplitude of the portion of the wire at a number of discrete time steps during the generation of the bond; measuring the time dependent deformation of said portion of the wire due to said applied first force and said vibration at a number of discrete time steps during the generation of the bond; and generating a time dependent first signal from at least said vibration amplitude and said deformation at a number of discrete time steps during the generation of the bond that is a direct measure of the stability of the bond at the respective time step.
摘要翻译：提供了一种用于在线和电接触构件之间产生引线接合的方法。该方法包括以下步骤：使电极的一部分的第一表面以第一力按压电接触构件的第二表面，同时沿着第二表面振动电极的该部分以产生接合; 在产生粘结期间在多个离散时间步长下测量导线部分的时间相关振动幅度; 在产生所述键期间，由于所述施加的第一力和所述振动在多个离散的时间步长处测量所述导线的所述部分的随时间变化; 以及在产生所述键期间的至少所述振动振幅和所述变形的多个离散时间步长产生时间依赖的第一信号，所述键是在各个时间步长期间所述键的稳定性的直接测量。

2. 发明授权

US08020746B2 Method and device for controlling the generation of ultrasonic wire bonds 有权
标题翻译：用于控制超声波引线键合生成的方法和装置
公开(公告)号：US08020746B2
公开(公告)日：2011-09-20
申请号：US12439883
申请日：2007-09-04
申请人： Ute Geissler , Herbert Reichl , Holger Gaul , Klaus-Dieter Lang , Martin Schneider-Ramelow
发明人： Ute Geissler , Herbert Reichl , Holger Gaul , Klaus-Dieter Lang , Martin Schneider-Ramelow
IPC分类号： B23K20/10 , B23K1/06
CPC分类号： B23K20/005 , H01L24/45 , H01L24/48 , H01L24/78 , H01L24/85 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/4847 , H01L2224/78313 , H01L2224/78318 , H01L2224/8518 , H01L2224/85206 , H01L2224/859 , H01L2924/01013 , H01L2924/01019 , H01L2924/01033 , H01L2924/01041 , H01L2924/01057 , H01L2924/01074 , H01L2924/01079 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/20303 , H01L2924/20304 , H01L2924/20305 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076 , H01L2924/01014 , H01L2924/00014 , H01L2924/00
摘要： A method for generating a wire bond between a wire and an electrical contact member is provided. The method comprising the steps of: pressing a first surface of a portion of the wire against a second surface of the electrical contact member with a first force while vibrating the portion of the wire along the second surface in order to generate a bond; measuring the time dependent vibration amplitude of the portion of the wire at a number of discrete time steps during the generation of the bond; measuring the time dependent deformation of said portion of the wire due to said applied first force and said vibration at a number of discrete time steps during the generation of the bond; and generating a time dependent first signal from at least said vibration amplitude and said deformation at a number of discrete time steps during the generation of the bond that is a direct measure of the stability of the bond at the respective time step.
摘要翻译：提供了一种用于在线和电接触构件之间产生引线接合的方法。该方法包括以下步骤：使电极的一部分的第一表面以第一力按压电接触构件的第二表面，同时沿着第二表面振动电极的该部分以产生接合; 在产生粘结期间在多个离散时间步长下测量导线部分的时间相关振动幅度; 在产生所述键期间，由于所述施加的第一力和所述振动在多个离散的时间步长处测量所述导线的所述部分的随时间变化; 以及在产生所述键期间的至少所述振动振幅和所述变形的多个离散时间步长产生时间依赖的第一信号，所述键是在各个时间步长期间所述键的稳定性的直接测量。

3. 发明授权

US5959352A Chip arrangement and method of producing the same 失效
标题翻译：芯片布置及其制造方法
公开(公告)号：US5959352A
公开(公告)日：1999-09-28
申请号：US986204
申请日：1997-12-05
申请人： Manfred Topfer , Eberhard Kaulfersch , Stefan Weib , Herbert Reichl
发明人： Manfred Topfer , Eberhard Kaulfersch , Stefan Weib , Herbert Reichl
IPC分类号： H01L23/373 , H01L23/48
CPC分类号： H01L23/3732 , H01L2924/0002
摘要： A chip arrangement has a first chip, a connecting device and at least a second chip or a substrate. The connecting device has a plurality of individual, spaced diamond parts which are arranged between the chips or between the first chip and the substrate and are connected to these such that the chips or the chip and the substrate are connected together via the diamond parts only. Methods for producing a chip arrangement of this kind comprise either the application of a diamond layer over the whole surface of the substrate and the subsequent structuring of the diamond layer to define individual, spaced diamond parts or the application of individual diamond parts to either the first chip or the second chip or the substrate such that they are arranged in spaced relationship with one another. The individual, spaced diamond parts are subsequently connected to the other component which is to be connected such that they are connected via the diamond parts only. A method of this kind is particularly suitable for connecting a high-power chip to a heat sink.
摘要翻译：芯片装置具有第一芯片，连接装置和至少第二芯片或基板。连接装置具有多个单独的间隔开的金刚石部件，它们布置在芯片之间或者在第一芯片和基板之间，并且连接到这些金属部件，使得芯片或芯片和基板仅通过金刚石部件连接在一起。用于生产这种芯片布置的方法包括在基板的整个表面上施加金刚石层以及金刚石层的随后结构以限定单独的，间隔开的金刚石部件或将单独的金刚石零件应用于第一芯片或第二芯片或基板，使得它们彼此间隔开地布置。单独的间隔开的金刚石部件随后连接到待连接的另一部件，使得它们仅通过金刚石部件连接。这种方法特别适用于将大功率芯片连接到散热器。

4. 发明申请

US20090315736A1 STAND-ALONE MINIATURISED COMMUNICATION MODULE 有权
标题翻译：独立的微型通信模块
公开(公告)号：US20090315736A1
公开(公告)日：2009-12-24
申请号：US12065446
申请日：2006-09-01
申请人： Herbert Reichl , Jürgen Wolf , Klaus Lang
发明人： Herbert Reichl , Jürgen Wolf , Klaus Lang
IPC分类号： G08B21/00
CPC分类号： G08C17/00 , H04Q9/00
摘要： A device for continuous measurement of the forces acting upon a movable compressible playable object is provided with at least one transmitter communicating with at least one receiver outside the movable object. The at least one receiver transforms signals received and evaluates them online. The movable compressible playable object, for instance a ball, includes at least one pressure sensor and/or at least one three-dimensional acceleration sensor as well as a converter for transforming signals therefrom to transmit them to the transmitter. A method for the use of this device causes activation of the transmitter in the movable object so that a system is created for the measurement of the forces acting upon such an object wherein the received measuring signals are present in evaluated form, online or offline, to be analyzed. By means of the activation method, the active sensor system is initiated to receive and transmit measuring signals.
摘要翻译：用于连续地测量作用在可移动可压缩可播放物体上的力的装置设置有与可移动物体外的至少一个接收器通信的至少一个发射器。至少一个接收器转换接收到的信号并在线评估它们。可移动可压缩可播放物体，例如球，包括至少一个压力传感器和/或至少一个三维加速度传感器以及用于将信号转换成发送器的变换器。使用该装置的方法导致可移动物体中的发射器的激活，使得创建用于测量作用在这样的物体上的力的系统，其中接收的测量信号以在线或离线的评估形式存在于分析。通过激活方法，启动主动传感器系统以接收和发送测量信号。

5. 发明申请

US20090273910A1 Functional Unit And Method For The Production Thereof 审中-公开
标题翻译：功能单位及其生产方法
公开(公告)号：US20090273910A1
公开(公告)日：2009-11-05
申请号：US12434950
申请日：2009-05-04
申请人： Jurgen Wolf , Kai Zoschke , Thorsten Fischer , Michael Topper , Herbert Reichl
发明人： Jurgen Wolf , Kai Zoschke , Thorsten Fischer , Michael Topper , Herbert Reichl
IPC分类号： H05K1/18 , H05K3/30
CPC分类号： H05K1/187 , H01L21/6835 , H01L23/49816 , H01L23/5387 , H01L23/5389 , H01L24/24 , H01L24/82 , H01L2221/68345 , H01L2224/24226 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01057 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/1461 , H01L2924/15331 , H01L2924/351 , H05K3/20 , H05K3/4644 , H05K2201/10674 , H05K2203/016 , Y10T29/4913 , H01L2924/00
摘要： The present invention relates to a functional unit, containing at least one active or passive electronic component, the functional unit being surrounded by at least one flexible dielectric layer and, on the outer side of the functional unit, contacts are provided for contacting the electrical components for further mounting.
摘要翻译：本发明涉及一种功能单元，其包含至少一个有源或无源电子部件，所述功能单元被至少一个柔性电介质层包围，并且在所述功能单元的外侧设置有用于接触所述电气部件进一步安装。

6. 发明申请

US20080308297A1 Ubm Pad, Solder Contact and Methods for Creating a Solder Joint 审中-公开
标题翻译： Ubm Pad，焊接触点和创建焊接接头的方法
公开(公告)号：US20080308297A1
公开(公告)日：2008-12-18
申请号：US11915128
申请日：2006-05-19
申请人： Claudia Jurenka , Juergen Wolf , Gunter Engelmann , Herbert Reichl
发明人： Claudia Jurenka , Juergen Wolf , Gunter Engelmann , Herbert Reichl
IPC分类号： H01B5/00 , B23K31/02
CPC分类号： H01L24/13 , H01L24/02 , H01L24/11 , H01L2224/0401 , H01L2224/131 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/0102 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01068 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/09701 , H01L2924/10329 , H01L2924/14 , H01L2224/13099 , H01L2924/00
摘要： A UBM pad has a first material layer which has a first material, and a second material layer which has a second material and represents an end layer or is arranged between an end layer and the first material layer. The first material and the second material exhibit properties with regard to a solder material that the presence of the second material prevents any metallurgical reactions of the first material with the solder material in the entire temperature range of connecting and of the operation of the structured electronic device which are detrimental to the reliability of the overall joint.
摘要翻译： UBM垫具有第一材料层和第二材料层，第一材料层具有第一材料，第二材料层具有第二材料并且表示端层或布置在端层和第一材料层之间。第一材料和第二材料表现出关于焊料材料的性质，第二材料的存在防止了第一材料与焊料材料在整个连接温度范围内的结合和结构化电子器件的操作的任何冶金反应这不利于整体关节的可靠性。

7. 发明授权

US06478906B1 Method for bonding a flexible substrate to a chip 有权
标题翻译：将柔性基板接合到芯片的方法
公开(公告)号：US06478906B1
公开(公告)日：2002-11-12
申请号：US09693255
申请日：2000-10-20
申请人： Ghassem Azdasht , Elke Zakel , Herbert Reichl
发明人： Ghassem Azdasht , Elke Zakel , Herbert Reichl
IPC分类号： B32B3116
CPC分类号： H05K3/328 , B23K20/10 , B23K2101/18 , B23K2101/40 , H01L24/81 , H01L2224/81205 , H01L2224/81224 , H01L2224/81801 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/0106 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H05K1/189 , H05K2201/0108 , H05K2201/10719 , H05K2203/0285 , H05K2203/107
摘要： Method for thermally bonding contact elements (14, 15) of a flexible film substrate (10) to contact metallizations (17) of an electronic component (12), the flexible film substrate having a support layer (13) of transparent plastics material and energy being applied to the contact elements from their rear by means of laser radiation (11), the transparency of the support layer (13), the absorption of the contact elements (14, 15) and the wavelength of the laser radiation (11) being matched to one another in such a way that the laser radiation is essentially transmitted through the support layer (13) and absorbed in the contact elements (14, 15), and the pressure being applied to the substrate (10) in such a way that the contact elements (14, 15) of the substrate (10) and the contact metallizations (17) of the component (12) are up against one another during the application of the laser radiation (11) in the region of an application point of the optical fibre.
摘要翻译：用于热粘合柔性膜基底（10）的接触元件（14,15）以接触电子部件（12）的金属化（17）的方法，所述柔性膜基底具有透明塑料材料的支撑层（13）和能量通过激光辐射（11）从其后方施加到接触元件，支撑层（13）的透明度，接触元件（14,15）的吸收和激光辐射（11）的波长是以使得激光辐射基本上透过支撑层（13）并被吸收在接触元件（14,15）中的方式彼此匹配，并且将压力施加到基板（10），使得在将激光辐射（11）施加到应用点的区域中时，衬底（10）的接触元件（14）和部件（12）的接触金属化部分（17）光纤。

8. 发明授权

US6160218A Chip housing 失效
标题翻译：芯片外壳
公开(公告)号：US6160218A
公开(公告)日：2000-12-12
申请号：US894604
申请日：1997-10-06
申请人： Ghassem Azdasht , Elke Zakel , Herbert Reichl
发明人： Ghassem Azdasht , Elke Zakel , Herbert Reichl
IPC分类号： H01L23/02 , B23K26/18 , H01L23/057 , H01L23/08 , H01L25/10 , H05K5/06
CPC分类号： H01L23/057 , B23K26/009 , B23K26/18 , H01L25/105 , H01L2224/50 , H01L2225/1005 , H01L2225/1023 , H01L2225/1076 , H01L2924/01079
摘要： A housing to accept at least one electronic component, e.g., a chip with a cover and an opposing cover. The cover and opposing cover are formed to surround the component. On the inner surface of the cover and the opposing cover, there are conductive paths arranged such that the paths on the cover connect terminal areas of the component to the paths on the opposing cover and the paths on the opposing cover open into external terminals of the housing. The cover and/or the opposing cover is/are flexible and are suitable to be interconnected with surrounding sub-housings.
摘要翻译： PCT No.PCT / DE96 / 00058 Sec。 371日期：1997年10月6日 102（e）日期1997年10月6日PCT 1996年1月12日PCT PCT。公开号WO96 / 24162 日期1996年8月8日一种用于接受至少一个电子部件的壳体，例如具有盖和相对盖的芯片。盖和相对的盖形成为围绕部件。在盖的内表面和相对的盖上，导电路径被布置成使得盖上的路径将部件的端部区域连接到相对的盖上的路径上，并且相对的盖上的路径打开到外部端子住房。盖和/或相对的盖是柔性的并且适于与周围的子壳互连。

9. 发明授权

US08120511B2 Stand-alone miniaturized communication module 有权
标题翻译：独立小型化通信模块
公开(公告)号：US08120511B2
公开(公告)日：2012-02-21
申请号：US12065446
申请日：2006-09-01
申请人： Herbert Reichl , Jurgen Wolf , Klaus Lang
发明人： Herbert Reichl , Jurgen Wolf , Klaus Lang
IPC分类号： G05F15/00
CPC分类号： G08C17/00 , H04Q9/00
摘要： A device for continuous measurement of the forces acting upon a movable compressible playable object is provided with at least one transmitter communicating with at least one receiver outside the movable object. The at least one receiver transforms signals received and evaluates them online. The movable compressible playable object, for instance a ball, includes at least one pressure sensor and/or at least one three-dimensional acceleration sensor as well as a converter for transforming signals therefrom to transmit them to the transmitter. A method for the use of this device causes activation of the transmitter in the movable object so that a system is created for the measurement of the forces acting upon such an object wherein the received measuring signals are present in evaluated form, online or offline, to be analyzed. By means of the activation method, the active sensor system is initiated to receive and transmit measuring signals.
摘要翻译：用于连续地测量作用在可移动可压缩可播放物体上的力的装置设置有与可移动物体外的至少一个接收器通信的至少一个发射器。至少一个接收器转换接收到的信号并在线评估它们。可移动可压缩可播放物体，例如球，包括至少一个压力传感器和/或至少一个三维加速度传感器以及用于将信号转换成发送器的转换器。使用该装置的方法导致可移动物体中的发射器的激活，使得创建用于测量作用在这样的物体上的力的系统，其中接收的测量信号以在线或离线的评估形式存在于分析。通过激活方法，启动主动传感器系统以接收和发送测量信号。

10. 发明授权

US06197387B1 Method to prepare the production of structured metal coatings using proteins 失效
标题翻译：使用蛋白质制备结构化金属涂层的方法
公开(公告)号：US06197387B1
公开(公告)日：2001-03-06
申请号：US09284489
申请日：1999-07-01
申请人： Stefan Fiedler , Dieter Oesterhelt , Heinrich Meyer , Wolfgang Scheel , Herbert Reichl
发明人： Stefan Fiedler , Dieter Oesterhelt , Heinrich Meyer , Wolfgang Scheel , Herbert Reichl
IPC分类号： B05D306
CPC分类号： G03C5/58 , G03C1/731
摘要： The invention relates to the production of thin metal layers and structures thereof on substrates of various structures. The lateral extent of a metal layer on the respective substrate can be prescribed with a precision in the micron and submicron range. The method described makes it possible to manufacture flat and three-dimensional metal structures on smooth planar or curved surfaces, as are required, for example, for depicting writing or drawings. The method uses no printing techniques.
摘要翻译：本发明涉及在各种结构的基底上生产薄金属层及其结构。可以以微米和亚微米范围内的精度规定各个基板上的金属层的横向范围。所描述的方法使得可以在光滑的平面或曲面上制造平坦且三维的金属结构，例如用于描绘书写或绘图。该方法不使用印刷技术。

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