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1. 发明授权

US5959352A Chip arrangement and method of producing the same 失效
标题翻译：芯片布置及其制造方法
公开(公告)号：US5959352A
公开(公告)日：1999-09-28
申请号：US986204
申请日：1997-12-05
申请人： Manfred Topfer , Eberhard Kaulfersch , Stefan Weib , Herbert Reichl
发明人： Manfred Topfer , Eberhard Kaulfersch , Stefan Weib , Herbert Reichl
IPC分类号： H01L23/373 , H01L23/48
CPC分类号： H01L23/3732 , H01L2924/0002
摘要： A chip arrangement has a first chip, a connecting device and at least a second chip or a substrate. The connecting device has a plurality of individual, spaced diamond parts which are arranged between the chips or between the first chip and the substrate and are connected to these such that the chips or the chip and the substrate are connected together via the diamond parts only. Methods for producing a chip arrangement of this kind comprise either the application of a diamond layer over the whole surface of the substrate and the subsequent structuring of the diamond layer to define individual, spaced diamond parts or the application of individual diamond parts to either the first chip or the second chip or the substrate such that they are arranged in spaced relationship with one another. The individual, spaced diamond parts are subsequently connected to the other component which is to be connected such that they are connected via the diamond parts only. A method of this kind is particularly suitable for connecting a high-power chip to a heat sink.
摘要翻译：芯片装置具有第一芯片，连接装置和至少第二芯片或基板。连接装置具有多个单独的间隔开的金刚石部件，它们布置在芯片之间或者在第一芯片和基板之间，并且连接到这些金属部件，使得芯片或芯片和基板仅通过金刚石部件连接在一起。用于生产这种芯片布置的方法包括在基板的整个表面上施加金刚石层以及金刚石层的随后结构以限定单独的，间隔开的金刚石部件或将单独的金刚石零件应用于第一芯片或第二芯片或基板，使得它们彼此间隔开地布置。单独的间隔开的金刚石部件随后连接到待连接的另一部件，使得它们仅通过金刚石部件连接。这种方法特别适用于将大功率芯片连接到散热器。

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