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    • 5. 发明授权
    • Electrical configuration as heat dissipation design
    • 电气配置为散热设计
    • US07773380B2
    • 2010-08-10
    • US12417447
    • 2009-04-02
    • Ulrich TrescherEckhard Schaefer
    • Ulrich TrescherEckhard Schaefer
    • H05K7/20
    • H05K7/20472H05K7/2049
    • An electrical configuration having at least one component which has at least one current bar, particularly a lead frame, and having an electronic circuit which has at least one heat dissipation surface and at least one electric terminal that is connected mechanically and electrically to the current bar. It is provided that the unit made up of the component and the electronic circuit is mounted on a support layer that effects the heat dissipation in such a way that, because of the fastening of the component onto the support layer, the heat dissipation surface is pushed against the support layer, based on the spring property of the current bar.
    • 具有至少一个组件的电气配置,所述组件具有至少一个电流条,特别是引线框架,并且具有至少一个散热表面的电子电路和至少一个电气端子,该电气端子机械地和电气地连接到电流条 。 设置由部件和电子电路构成的单元安装在支撑层上,该支撑层以散热方式使得由于将部件紧固到支撑层上,散热表面被推动 基于当前条的弹簧特性而抵靠支撑层。