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1. 发明授权

US09997488B2 Copper-based alloy wire and methods for manufaturing the same 有权
公开(公告)号：US09997488B2
公开(公告)日：2018-06-12
申请号：US14157413
申请日：2014-01-16
申请人： Tung-Han Chuang , Jun-Der Lee , Hsing-Hua Tsai
发明人： Tung-Han Chuang , Jun-Der Lee , Hsing-Hua Tsai
IPC分类号： H01L23/00
CPC分类号： H01L24/43 , H01L24/45 , H01L2224/4321 , H01L2224/43848 , H01L2224/43986 , H01L2224/45015 , H01L2224/45147 , H01L2224/45157 , H01L2224/45565 , H01L2224/45644 , H01L2224/45647 , H01L2224/45664 , H01L2224/45669 , H01L2924/00011 , H01L2924/12041 , H01L2924/14 , H01L2924/01079 , H01L2924/01046 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076 , H01L2924/20106 , H01L2924/20107 , H01L2924/20108 , H01L2924/013 , H01L2924/00013 , H01L2924/00014 , H01L2924/01015 , H01L2924/01033
摘要： A copper-based alloy wire made of a material selected from the group consisting of a copper-gold alloy, a copper-palladium alloy and a copper-gold-palladium alloy is provided. The alloy wire has a polycrystalline structure of a face-centered cubic lattice and consists of a plurality of equi-axial grains. The quantity of grains having annealing twins is 10 percent or more of the total quantity of the grains of the copper-based alloy wire.

2. 发明授权

US08940403B2 Alloy wire and methods for manufacturing the same 有权
标题翻译：合金线及其制造方法
公开(公告)号：US08940403B2
公开(公告)日：2015-01-27
申请号：US13495800
申请日：2012-06-13
申请人： Jun-Der Lee , Hsing-Hua Tsai , Tung-Han Chuang
发明人： Jun-Der Lee , Hsing-Hua Tsai , Tung-Han Chuang
IPC分类号： B32B15/02 , B32B15/01 , C22F1/14 , C22C5/06 , H01L23/00
CPC分类号： B32B15/018 , C22C5/06 , C22F1/14 , H01L24/43 , H01L24/45 , H01L2224/43 , H01L2224/43848 , H01L2224/43986 , H01L2224/45015 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/45644 , H01L2224/45664 , H01L2924/00011 , H01L2924/00014 , H01L2924/01015 , H01L2924/01047 , H01L2924/12041 , Y10T428/12431 , Y10T428/12438 , Y10T428/12868 , Y10T428/12875 , Y10T428/12889 , Y10T428/12896 , H01L2924/01079 , H01L2924/01046 , H01L2924/2075 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/0132 , H01L2924/00015 , H01L2924/013 , H01L2924/00 , H01L2224/45669 , H01L2224/45647 , H01L2924/01204 , H01L2224/48 , H01L2924/00013 , H01L2224/4321 , H01L2924/01049 , H01L2924/01006 , H01L2924/01045 , H01L2924/01004 , H01L2924/01005
摘要： An alloy wire made of a material selected from one of a group consisting of a silver-gold alloy, a silver-palladium alloy and a silver-gold-palladium alloy is provided. The alloy wire is with a polycrystalline structure of a face-centered cubic lattice and includes a plurality of grains. A central part of the alloy wire includes slender grains or equi-axial grains, and the other parts of the alloy wire consist of equi-axial grains. A quantity of the grains having annealing twins was 20 percent or more of the total quantity of the grains of the alloy wire.
摘要翻译：提供由选自银 - 金合金，银 - 钯合金和银 - 钯 - 钯合金之一的材料制成的合金丝。合金线具有面心立方晶格的多晶结构，并且包括多个晶粒。合金线的中心部分包括细长晶粒或等轴晶粒，合金线的其他部分由等轴晶粒组成。一定数量的具有退火双晶的晶粒是合金丝的晶粒总量的20％以上。

3. 发明申请

US20130152990A1 SOLID-LIQUID INTERDIFFUSION BONDING STRUCTURE OF THERMOELECTRIC MODULE AND FABRICATING METHOD THEREOF 审中-公开
标题翻译：热电模块的固液介质结合结构及其制备方法
公开(公告)号：US20130152990A1
公开(公告)日：2013-06-20
申请号：US13668306
申请日：2012-11-04
申请人： Hong-Jen Lai , Jenn-Dong Hwang , Hsu-Shen Chu , Tung-Han Chuang , Chao-Chi Jain , Che-Wei Lin
发明人： Hong-Jen Lai , Jenn-Dong Hwang , Hsu-Shen Chu , Tung-Han Chuang , Chao-Chi Jain , Che-Wei Lin
IPC分类号： H01L35/08 , H01L35/34 , H01L35/18 , B23K31/02 , H01L35/16
CPC分类号： H01L35/08 , B23K20/026 , B23K20/16 , B23K20/233 , B23K20/24 , B23K35/00 , B23K35/004 , B23K35/007 , B23K35/262 , B23K35/3006 , B23K35/302 , B23K35/3033 , B23K2101/36 , B23K2103/08 , B23K2103/12 , B23K2103/18 , B32B15/01 , H01L35/16 , H01L35/34
摘要： A solid-liquid interdiffusion bonding structure of a thermoelectric module and a fabricating method thereof are provided. The method includes coating a silver, nickel, or copper layer on surfaces of a thermoelectric component and an electrode plate, and then coating a tin layer. A thermocompression treatment is performed on the thermoelectric component and the electrode plate, such that the melted tin layer reacts with the silver, nickel, or copper layer to form a silver-tin intermetallic compound, a nickel-tin intermetallic compound, or a copper-tin intermetallic compound. After cooling, the thermoelectric component and the electrode plate are bonded together.
摘要翻译：提供了一种热电模块的固液相互扩散接合结构及其制造方法。该方法包括在热电元件和电极板的表面上涂覆银，镍或铜层，然后涂覆锡层。对热电组件和电极板进行热压处理，使得熔融的锡层与银，镍或铜层反应形成银 - 锡金属间化合物，镍 - 锡金属间化合物或铜 - 锡金属间化合物。冷却后，将热电成分和电极板接合。

4. 发明申请

US20060021734A1 Heat sink and heat spreader bonding structure 审中-公开
标题翻译：散热器和散热器结合结构
公开(公告)号：US20060021734A1
公开(公告)日：2006-02-02
申请号：US10999928
申请日：2004-12-01
申请人： Shih-Ying Chang , Tung-Han Chuang , Lan-Kai Yeh , Che-Wei Lin , Ming-Jye Tsai
发明人： Shih-Ying Chang , Tung-Han Chuang , Lan-Kai Yeh , Che-Wei Lin , Ming-Jye Tsai
IPC分类号： H05K7/20
CPC分类号： H01L23/367 , H01L21/4882 , H01L2924/0002 , H01L2924/00
摘要： A heat sink and heat spreader bonding structure includes a metal heat sink, a metal heat spreader, and an eutectic structure formed between the heat sink and the heat spreader by heating the heat sink and the heat spreader to a specific temperature of the eutectic temperature of the heat sink and the heat spreader but below the respective melting point of the heat sink and the heat spreader to cause the internal metal atoms of the heat sink and heat spreader to be rearranged. This bonding structure maintains the heat transfer efficiency of the bonding layer between the heat sink and the heat spreader, eliminates formation of crevice, heat resistance, and oxidation in the bonding layer.
摘要翻译：散热器和散热器接合结构包括金属散热器，金属散热器和通过将散热器和散热器加热到散热器和散热器之间形成的共晶结构到特定温度的共晶温度散热器和散热器，但低于散热器和散热器的相应熔点，以使散热器和散热器的内部金属原子重新排列。这种结合结构保持了散热器和散热器之间的结合层的传热效率，消除了接合层中的缝隙，耐热性和氧化的形成。

5. 发明授权

US06202276B1 Process for manufacturing an electromagnetic interference shielding superplastic alloy foil cladded outer shell product 有权
标题翻译：制造电磁干扰屏蔽超塑性合金箔包层外壳产品的工艺
公开(公告)号：US06202276B1
公开(公告)日：2001-03-20
申请号：US09304027
申请日：1999-05-03
申请人： Tung-Han Chuang
发明人： Tung-Han Chuang
IPC分类号： B23P1700
CPC分类号： B32B15/08 , B21D26/055 , B29C45/1418 , B29C45/14221 , B29C45/14311 , B29C2045/14188 , B29C2045/14983 , B29K2705/00 , B29K2715/006 , B29K2995/0011 , B32B7/12 , B32B2037/1215 , B32B2331/04 , B32B2355/02 , H05K9/0084 , Y10T29/302 , Y10T29/49805 , Y10T29/49906
摘要： The present invention provides a process for manufacturing an electromagnetic interference shielding metallic foil cladded plastic outer shell product. A first side of a superplastic alloy foil is coated with an adhesive and then the foil is placed foil in a first half mold to allow the foil to be initially superplastically formed. A second half mold attached to a nozzle of an injection machine is covered onto the first half mold, and the two half molds are closed to further deform superplastic alloy foil. Softened plastic is introduced from the injection machine to a mold cavity between the foil and the second half mold, such that the superplastic alloy foil covered on the first half mold is completely formed and the softened plastic adheres on the adhesive-coated side of the superplastic alloy foil to form an electromagnetic interference shielding metallic foil cladded plastic outer shell product. Two types of products can be obtained, that is, the superplastic alloy foil can be either the outer wall or inner wall. Moreover, the final metallic plastic product can not only have as intricate a shape as an ordinary plastic product, but also a shielding effectiveness as high as an ordinary metallic shield.
摘要翻译：本发明提供一种制造电磁干扰屏蔽金属箔包覆塑料外壳产品的方法。用粘合剂涂覆超塑性合金箔的第一面，然后将箔置于第一半模中，以允许箔最初超塑性地形成。附着在注射机的喷嘴上的第二半模被覆盖在第一半模上，两个半模封闭以进一步使超塑性合金箔变形。将软化的塑料从注射机引入到箔和第二半模之间的模腔中，使得覆盖在第一半模上的超塑性合金箔完全形成，并且软化的塑料粘附在超塑性的粘合剂涂层侧合金箔形成电磁干扰屏蔽金属箔包层塑料外壳产品。可以获得两种类型的产品，即超塑性合金箔可以是外壁或内壁。此外，最终的金属塑料制品不仅具有与普通塑料制品相同的复杂形状，而且还具有与普通金属屏蔽一样高的屏蔽效果。

6. 发明申请

US20090023289A1 CONDUCTOR REMOVAL PROCESS 有权
标题翻译：导线器拆卸过程
公开(公告)号：US20090023289A1
公开(公告)日：2009-01-22
申请号：US11780024
申请日：2007-07-19
申请人： Yung-Tai Hung , Chin-Tsan Yeh , Chin-Ta Su , Ling-Wu Yang , Tung-Han Chuang
发明人： Yung-Tai Hung , Chin-Tsan Yeh , Chin-Ta Su , Ling-Wu Yang , Tung-Han Chuang
IPC分类号： H01L21/461
CPC分类号： H01L21/3212 , H01L21/32105
摘要： A conductor removal process is described, which is applied to a substrate that has thereon a plurality of patterns and a blanket conductor layer covering the patterns. An upper portion of the blanket conductor layer entirely over the patterns is oxidized to form a dielectric layer. A CMP step is performed to remove the dielectric layer and a portion of the remaining conductor layer in turn and thereby expose the patterns.
摘要翻译：描述了导体去除工艺，其应用于其上具有多个图案的基板和覆盖图案的覆盖层导体层。橡皮布导体层的整个图案上方的上部被氧化以形成电介质层。执行CMP步骤以依次去除电介质层和剩余导体层的一部分，从而暴露图案。

7. 发明授权

US06210521B1 Process and apparatus for making radially arranged aluminum foil-filled plastic pellets to shield against electromagnetic interference 失效
标题翻译：用于制造径向布置的铝箔填充塑料颗粒以防止电磁干扰的方法和设备
公开(公告)号：US06210521B1
公开(公告)日：2001-04-03
申请号：US09018905
申请日：1998-02-05
申请人： Tung-Han Chuang , Chin-Ming Chiang
发明人： Tung-Han Chuang , Chin-Ming Chiang
IPC分类号： B32B3100
CPC分类号： H05K9/0083 , B29B9/12 , Y10T156/1084
摘要： The present invention provides a novel process for making a radially arranged aluminum foil-filled plastic pellet for shielding against electromagnetic interference, comprising sandwiching a plastic matrix in between two layers of aluminum foil to form an aluminum/plastic/aluminum laminated sheet; slicing the laminated sheet into a plurality of aluminum/plastic/aluminum laminated strips; dividing the plurality of laminated strips into at least one group, each group containing 3 to 20 radially arranged strips; moisturizing and binding at least one group of laminated strips with a molten plastic matrix to form at least one radially arranged aluminum foil-filled plastic bar; and cutting at least one plastic bar into radially arranged aluminum foil-filled plastic pellets. By the present invention, the cost of making the conductive plastic pellets can be decreased, the amount of aluminum foil in the pellet can be greatly increased, and the breakage of the aluminum foil in the die can be prevented.
摘要翻译：本发明提供一种用于制造径向布置的铝箔填充塑料颗粒以防止电磁干扰的新方法，包括将塑料基质夹在两层铝箔之间以形成铝/塑料/铝层压片; 将层压片切割成多个铝/塑料/铝层压条; 将多个层叠带分成至少一组，每组包含3至20个径向排列的条带; 用熔融塑料基质保湿并粘合至少一组层压条，以形成至少一个径向布置的铝箔填充塑料棒; 并将至少一个塑料棒切割成径向布置的铝箔填充塑料颗粒。通过本发明，能够降低导电性塑料颗粒的制造成本，能够大幅度提高粒料中的铝箔量，能够防止铝箔在模具中的破损。

8. 发明授权

US06207089B1 Process for manufacturing an electromagnetic interference shielding metallic foil cladded plastic product 有权
标题翻译：电磁干扰屏蔽金属箔包覆塑料制品的制造工艺
公开(公告)号：US06207089B1
公开(公告)日：2001-03-27
申请号：US09139610
申请日：1998-08-25
申请人： Tung-Han Chuang
发明人： Tung-Han Chuang
IPC分类号： B29C4516
CPC分类号： B21D26/055 , B29C45/1418 , B29C45/14311 , B29C45/14778 , B29C2045/14213 , B29K2705/00 , B29K2715/006 , B29K2995/0011 , Y10T29/49805 , Y10T29/49986
摘要： The present invention provides a process and apparatus for manufacturing an electromagnetic interference shielding metallic foil cladded plastic product. The process comprises (a) coating one side of a superplastic alloy plate with a coupling agent or a hot melt adhesive; (b) placing the coupling agent- or hot melt adhesive-coated superplastic alloy plate in a mold, and superplastically forming the superplastic alloy plate to a superplastic alloy foil with a predetermined shape, such that another side of the superplastic alloy foil is attached to the mold and the coupling agent- or hot melt adhesive-coated side of the superplastic alloy foil is spaced apart from the mold to form a mold cavity, wherein an injection machine is attached to the mold cavity, and wherein the injection machine is capable of injecting softened plastic into the mold cavity; (c) introducing softened plastic from the injection machine to the mold cavity, such that plastic adheres on the coupling agent- or hot melt adhesive-coated side of the superplastic alloy foil, and an electromagnetic interference shielding metallic foil cladded plastic product is formed; and (d) removing the plastic product from the mold. The final metallic plastic product can not only have as intricate a shape as an ordinary plastic product, but also has a shielding effectiveness as high as an ordinary metallic shield.
摘要翻译：本发明提供一种用于制造电磁干扰屏蔽金属箔包覆塑料制品的方法和装置。该方法包括（a）用偶联剂或热熔粘合剂涂覆超塑性合金板的一侧; （b）将耦合剂或热熔粘合剂涂覆的超塑性合金板放置在模具中，并将超塑性合金板超塑性地形成为具有预定形状的超塑性合金箔，使得超塑性合金箔的另一侧附着到超塑性合金箔的模具和耦合剂或热熔粘合剂涂覆的一侧与模具间隔开以形成模具腔，其中注射机附接到模具腔，并且其中注射机器能够将软化塑料注入模腔; （c）将来自注塑机的软化塑料引入模腔，使得塑料粘附在超塑性合金箔的偶联剂或热熔粘合剂涂层侧上，形成电磁干扰屏蔽金属箔包覆的塑料产品; 和（d）从模具中取出塑料制品。最终的金属塑料制品不仅具有与普通塑料制品一样复杂的形状，而且具有与普通金属屏蔽一样高的屏蔽效果。

9. 发明授权

US06182486B2 Superplastic alloy-containing conductive plastic article for shielding electromagnetic interference and process for manufacturing the same 失效
标题翻译：用于屏蔽电磁干扰的超塑性合金导电塑料制品及其制造方法
公开(公告)号：US06182486B2
公开(公告)日：2001-02-06
申请号：US09095785
申请日：1998-06-11
申请人： Tung-Han Chuang
发明人： Tung-Han Chuang
IPC分类号： B21B146
CPC分类号： H05K9/0084 , B29C51/10 , B29C51/14 , B29K2705/00 , B29K2995/0007 , B65D90/22 , H01B1/22 , Y10S72/709 , Y10T29/49805 , Y10T29/4998 , Y10T29/49986
摘要： The present invention provides a superplastic alloy-containing conductive plastic article for shielding electromagnetic interference. The conductive plastic article is a three-layer structure, in which the outer layers are plastic material, and the inner layer is a superplastic alloy. The requirements for the raw materials are that the melting point of the superplastic alloy is higher than the softening point of the plastic, and the superplastic alloy has superplasticity at a temperature higher than the softening point of the plastic. The conductive plastic article can be manufactured in one processing stage, has the same shielding effectiveness as that of a conventional metal plate article, and can take a delicate and complicated form as that of a conventional plastic article. Moreover, the superplastic alloy contained therein has a uniform thickness and good adherence to plastic.
摘要翻译：本发明提供一种用于屏蔽电磁干扰的超塑性合金的导电塑料制品。导电塑料制品是三层结构，其中外层是塑料材料，内层是超塑性合金。对原材料的要求是超塑性合金的熔点高于塑料的软化点，超塑性合金在比塑料软化点高的温度下具有超塑性。导电性塑料制品可以在一个加工阶段制造，具有与常规金属板制品相同的屏蔽效能，并且可以采取与常规塑料制品相同的精细和复杂的形式。此外，其中包含的超塑性合金具有均匀的厚度和对塑料的良好粘附性。

10. 发明申请

US20130029178A1 ACTIVE SOLDER 审中-公开
公开(公告)号：US20130029178A1
公开(公告)日：2013-01-31
申请号：US13191965
申请日：2011-07-27
申请人： Shih-Ying CHANG , Lung-Chuan Tsao , Tung-Han Chuang , Yen-Huan Lei , Cheng-Kai Li , Wei-Chia Huang
发明人： Shih-Ying CHANG , Lung-Chuan Tsao , Tung-Han Chuang , Yen-Huan Lei , Cheng-Kai Li , Wei-Chia Huang
IPC分类号： B23K35/24 , B32B15/01
CPC分类号： B23K35/26 , B23K35/02 , B23K35/0244 , B23K35/24 , B23K35/262 , B23K35/264 , B23K35/284 , B32B15/01 , C22C13/00 , Y10T428/12493 , Y10T428/12708 , Y10T428/12729 , Y10T428/12771 , Y10T428/12806
摘要： An active solder is revealed. The active solder includes an active material and a metal substrate. There are two kinds of active materials, titanium together with rare earth elements and magnesium. The metal substrate is composed of a main component and an additive. The main component is tin-zinc alloy and the additive is selected from bismuth, indium, silver, copper or their combinations. The active solder enables targets and backing plates to be joined with each other directly in the atmosphere. The target is ceramic or aluminum with low wetting properties. The bonding temperature of the active solder ranges from 150° C. to 200° C. so that the problem of thermal stress can be avoided.

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