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    • 1. 发明授权
    • Integrated circuit fabrication using sidewall nitridation processes
    • 使用侧壁氮化工艺的集成电路制造
    • US08288293B2
    • 2012-10-16
    • US12763963
    • 2010-04-20
    • Tuan PhamSanghyun LeeMasato HoriikeKlaus SchuegrafMasaaki HigashitaniKeiichi Isono
    • Tuan PhamSanghyun LeeMasato HoriikeKlaus SchuegrafMasaaki HigashitaniKeiichi Isono
    • H01L21/469
    • H01L27/11548H01L21/2815H01L27/11529H01L29/66825
    • Semiconductor devices are provided with encapsulating films for protection of sidewall features during fabrication processes, such as etching to form isolation regions. In a non-volatile flash memory, for example, a trench isolation process is divided into segments to incorporate an encapsulating film along the sidewalls of charge storage material. A pattern is formed over the layer stack followed by etching the charge storage material to form strips elongated in the column direction across the substrate, with a layer of tunnel dielectric material therebetween. Before etching the substrate, an encapsulating film is formed along the sidewalls of the strips of charge storage material. The encapsulating film can protect the sidewalls of the charge storage material during subsequent cleaning, oxidation and etch processes. In another example, the encapsulating film is simultaneously formed while etching to form strips of charge storage material and the isolation trenches.
    • 半导体器件设置有用于在制造工艺期间保护侧壁特征的封装膜,例如蚀刻以形成隔离区域。 在非易失性闪速存储器中,例如,沟槽隔离工艺被分成段以沿着电荷存储材料的侧壁并入封装膜。 在层堆叠上形成图案,随后蚀刻电荷存储材料,以形成沿着衬底的列方向延伸的条带,其间具有隧道介电材料层。 在蚀刻基板之前,沿着电荷存储材料条的侧壁形成封装膜。 封装膜可以在随后的清洁,氧化和蚀刻工艺期间保护电荷存储材料的侧壁。 在另一个实例中,同时形成封装膜,同时蚀刻以形成电荷存储材料条和隔离槽。
    • 3. 发明授权
    • Integrated circuits with sidewall nitridation
    • 具有侧壁氮化的集成电路
    • US08853763B2
    • 2014-10-07
    • US13607375
    • 2012-09-07
    • Tuan PhamSanghyun LeeMasato HoriikeKlaus SchuegrafMasaaki HigashitaniKeiichi Isono
    • Tuan PhamSanghyun LeeMasato HoriikeKlaus SchuegrafMasaaki HigashitaniKeiichi Isono
    • H01L29/76H01L27/115H01L29/66H01L21/28
    • H01L27/11548H01L21/2815H01L27/11529H01L29/66825
    • Semiconductor devices are provided with encapsulating films for protection of sidewall features during fabrication processes, such as etching to form isolation regions. In a non-volatile flash memory, for example, a trench isolation process is divided into segments to incorporate an encapsulating film along the sidewalls of charge storage material. A pattern is formed over the layer stack followed by etching the charge storage material to form strips elongated in the column direction across the substrate, with a layer of tunnel dielectric material therebetween. Before etching the substrate, an encapsulating film is formed along the sidewalls of the strips of charge storage material. The encapsulating film can protect the sidewalls of the charge storage material during subsequent cleaning, oxidation and etch processes. In another example, the encapsulating film is simultaneously formed while etching to form strips of charge storage material and the isolation trenches.
    • 半导体器件设置有用于在制造工艺期间保护侧壁特征的封装膜,例如蚀刻以形成隔离区域。 在非易失性闪速存储器中,例如,沟槽隔离工艺被分成段以沿着电荷存储材料的侧壁并入封装膜。 在层堆叠上形成图案,随后蚀刻电荷存储材料,以形成沿着衬底的列方向延伸的条带,其间具有隧道介电材料层。 在蚀刻基板之前,沿着电荷存储材料条的侧壁形成封装膜。 封装膜可以在随后的清洁,氧化和蚀刻工艺期间保护电荷存储材料的侧壁。 在另一个实例中,同时形成封装膜,同时蚀刻以形成电荷存储材料条和隔离槽。
    • 4. 发明申请
    • Integrated Circuits With Sidewall Nitridation
    • 集成电路与侧壁氮化
    • US20120326220A1
    • 2012-12-27
    • US13607375
    • 2012-09-07
    • Tuan PhamSanghyun LeeMasato HoriikeKlaus SchuegrafMasaaki HigashitaniKeiichi Isono
    • Tuan PhamSanghyun LeeMasato HoriikeKlaus SchuegrafMasaaki HigashitaniKeiichi Isono
    • H01L29/78
    • H01L27/11548H01L21/2815H01L27/11529H01L29/66825
    • Semiconductor devices are provided with encapsulating films for protection of sidewall features during fabrication processes, such as etching to form isolation regions. In a non-volatile flash memory, for example, a trench isolation process is divided into segments to incorporate an encapsulating film along the sidewalls of charge storage material. A pattern is formed over the layer stack followed by etching the charge storage material to form strips elongated in the column direction across the substrate, with a layer of tunnel dielectric material therebetween. Before etching the substrate, an encapsulating film is formed along the sidewalls of the strips of charge storage material. The encapsulating film can protect the sidewalls of the charge storage material during subsequent cleaning, oxidation and etch processes. In another example, the encapsulating film is simultaneously formed while etching to form strips of charge storage material and the isolation trenches.
    • 半导体器件设置有用于在制造工艺期间保护侧壁特征的封装膜,例如蚀刻以形成隔离区域。 在非易失性闪速存储器中,例如,沟槽隔离工艺被分成段以沿着电荷存储材料的侧壁并入封装膜。 在层堆叠上形成图案,随后蚀刻电荷存储材料,以形成沿着衬底的列方向延伸的条带,其间具有隧道介电材料层。 在蚀刻基板之前,沿着电荷存储材料条的侧壁形成封装膜。 封装膜可以在随后的清洁,氧化和蚀刻工艺期间保护电荷存储材料的侧壁。 在另一个实例中,同时形成封装膜,同时蚀刻以形成电荷存储材料条和隔离槽。