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1. 发明授权

US07193311B2 Multi-chip circuit module and method for producing the same 有权
标题翻译：多芯片电路模块及其制造方法
公开(公告)号：US07193311B2
公开(公告)日：2007-03-20
申请号：US10834542
申请日：2004-04-29
申请人： Tsuyoshi Ogawa , Yuji Nishitani
发明人： Tsuyoshi Ogawa , Yuji Nishitani
IPC分类号： H01L23/24 , H01L23/22
CPC分类号： H01L23/5389 , H01L21/563 , H01L21/6835 , H01L23/3121 , H01L23/5385 , H01L24/48 , H01L25/0652 , H01L25/0655 , H01L25/105 , H01L25/50 , H01L2221/68345 , H01L2221/68359 , H01L2221/68363 , H01L2224/05599 , H01L2224/16225 , H01L2224/16235 , H01L2224/45099 , H01L2224/48091 , H01L2224/73204 , H01L2224/73253 , H01L2224/73257 , H01L2224/81005 , H01L2224/85399 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01004 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/18161 , H01L2924/19041 , H01L2924/19107 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3511 , H05K3/007 , H05K3/4647 , H05K3/4682 , H05K2203/016 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A multi-chip circuit module on which semiconductor chips are loaded and which is provided with circuit patterns, input/output terminals or the like for interconnecting the semiconductor chips. A multi-layered wiring section (2) is formed by respective unit wiring layers (8) to (12) in such a manner that an upper unit wiring layer is layered on a surface-planarized subjacent unit wiring layer and connected to one another by inter-layer connection by a via-on-via structure. A semiconductor chip (6) mounted on this multi-layer wiring section (2) is polished along with the sealing resin layer (7) for reducing the thickness.
摘要翻译：一种多芯片电路模块，其上装有半导体芯片，并且设置有用于互连半导体芯片的电路图案，输入/输出端子等。多层布线部分（2）由各单元布线层（8）至（12）形成，使得上单元布线层层叠在表面平面化的相邻单元布线层上，并通过通过通孔结构的层间连接。安装在该多层布线部分（2）上的半导体芯片（6）与用于减小厚度的密封树脂层（7）一起被抛光。

2. 发明授权

US06919226B2 Method for producing a multi-chip circuit module including a multi-layered wiring section utilizing a via-on-via structure 有权
标题翻译：一种多芯片电路模块的制造方法，其包括使用通孔通孔结构的多层布线部
公开(公告)号：US06919226B2
公开(公告)日：2005-07-19
申请号：US10466748
申请日：2002-11-15
申请人： Tsuyoshi Ogawa , Yuji Nishitani
发明人： Tsuyoshi Ogawa , Yuji Nishitani
IPC分类号： H01L21/56 , H01L21/68 , H01L21/98 , H01L23/31 , H01L23/538 , H01L25/04 , H01L25/065 , H01L25/10 , H01L25/18 , H01L29/00 , H05K3/00 , H05K3/46 , H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L23/5389 , H01L21/563 , H01L21/6835 , H01L23/3121 , H01L23/5385 , H01L24/48 , H01L25/0652 , H01L25/0655 , H01L25/105 , H01L25/50 , H01L2221/68345 , H01L2221/68359 , H01L2221/68363 , H01L2224/05599 , H01L2224/16225 , H01L2224/16235 , H01L2224/45099 , H01L2224/48091 , H01L2224/73204 , H01L2224/73253 , H01L2224/73257 , H01L2224/81005 , H01L2224/85399 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01004 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/18161 , H01L2924/19041 , H01L2924/19107 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3511 , H05K3/007 , H05K3/4647 , H05K3/4682 , H05K2203/016 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A multi-chip circuit module on which semiconductor chips are loaded and which is provided with circuit patterns, input/output terminals or the like for interconnecting the semiconductor chips. A multi-layered wiring section (2) is formed by respective unit wiring layers (8) to (12) in such a manner that an upper unit wiring layer is layered on a surface-planarized subjacent unit wiring layer and connected to one another by inter-layer connection by a via-on-via structure. A semiconductor chip (6) mounted on this multi-layer wiring section (2) is polished along with the sealing resin layer (7) for reducing the thickness.
摘要翻译：一种多芯片电路模块，其上装有半导体芯片，并且设置有用于互连半导体芯片的电路图案，输入/输出端子等。多层布线部分（2）由各单元布线层（8）至（12）形成，使得上单元布线层层叠在表面平面化的相邻单元布线层上，并通过通过通孔结构的层间连接。安装在该多层布线部分（2）上的半导体芯片（6）与用于减小厚度的密封树脂层（7）一起被抛光。

3. 发明授权

US06831357B2 Circuit substrate device, method for producing the same, semiconductor device and method for producing the same 有权
公开(公告)号：US06831357B2
公开(公告)日：2004-12-14
申请号：US10397608
申请日：2003-03-26
申请人： Yuji Nishitani , Tsuyoshi Ogawa , Hiroshi Asami , Akihiko Okubora
发明人： Yuji Nishitani , Tsuyoshi Ogawa , Hiroshi Asami , Akihiko Okubora
IPC分类号： H01L2348
CPC分类号： H01L21/6835 , H01L21/4857 , H01L23/49833 , H01L2221/68345 , H01L2221/68359 , H01L2224/16 , H01L2924/01078 , H01L2924/01087 , H01L2924/09701 , H01L2924/19041 , H05K3/0052 , H05K3/20 , H05K3/4602 , H05K3/4614 , H05K3/467 , H05K3/4682 , H05K3/4694 , H05K2201/0352 , H05K2201/09536 , H05K2203/061
摘要： A circuit substrate device composed of a circuit unit 2 and a multi-layer wiring substrate 3 in which a pattern conductor of the circuit unit 2 may be prevented from being warped or inundated. The circuit substrate device includes a circuit unit 2 having a pattern conductor formed by a thin film technique, and an insulating layer, and a multi-layer wiring substrate 3 having a connecting terminal portion 14 exposed from its major surface. The circuit unit is formed on a dummy substrate. The circuit unit is connected to the multi-layer wiring substrate 3 so that the pattern conductor is connected to the connecting terminal portion 14. The dummy substrate is then removed to give a structure comprised of the circuit unit 2 formed on the multi-layer wiring substrate 3. The pattern conductor of the circuit unit 2 is freed of warping or inundations along the direction of thickness of the circuit unit 2.

4. 发明授权

US06803324B2 Semiconductor device and its manufacturing method 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：US06803324B2
公开(公告)日：2004-10-12
申请号：US10240330
申请日：2003-03-06
申请人： Tsuyoshi Ogawa , Yuji Nishitani , Akihiko Okubora
发明人： Tsuyoshi Ogawa , Yuji Nishitani , Akihiko Okubora
IPC分类号： H01L21469
CPC分类号： H05K3/4682 , H01L21/4846 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/81005 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/1531 , H01L2924/18161 , H01L2924/19105 , H01L2924/19106 , H01L2924/3025 , H05K1/0237 , H05K1/0306 , H05K1/0313 , H05K1/095 , H05K1/16 , H05K1/162 , H05K1/165 , H05K1/167 , H05K1/183 , H05K3/0052 , H05K3/20 , H05K3/205 , H05K3/4605 , H05K3/4614 , H05K3/4644 , H05K3/467 , H05K3/4688 , H05K2201/09509 , H05K2201/09763 , H05K2203/016 , H05K2203/061 , H05K2203/1189 , H01L2924/00
摘要： A wiring circuit block is produced by forming a release layer on one of planarized principal surfaces of a mother substrate, forming an insulating layer on the release layer, patterning the insulating layer and forming a wiring layer on the patterned insulating layer, and separating the insulating layer and wiring layer from the release layer on the mother substrate. The circuit block has components, and deposited on the wiring layer, and is mounted on a base circuit board to provide a wiring device. Also, semiconductor chips are mounted on the circuit block, and the circuit block is mounted on a base circuit board to provide a semiconductor device.
摘要翻译：通过在母基板的平坦化主面之一上形成剥离层，在剥离层上形成绝缘层，对绝缘层进行图案化，在图案化绝缘层上形成布线层，分离绝缘层而制造布线电路块层和布线层从母基板上的释放层。电路块具有部件并且沉积在布线层上，并且安装在基板电路板上以提供布线装置。此外，半导体芯片安装在电路块上，并且电路块安装在基极电路板上以提供半导体器件。

5. 发明授权

US07138294B2 Circuit substrate device, method for producing the same, semiconductor device and method for producing the same 有权
标题翻译：电路基板装置及其制造方法，半导体装置及其制造方法
公开(公告)号：US07138294B2
公开(公告)日：2006-11-21
申请号：US10792447
申请日：2004-03-03
申请人： Yuji Nishitani , Tsuyoshi Ogawa , Hiroshi Asami , Akihiko Okubora
发明人： Yuji Nishitani , Tsuyoshi Ogawa , Hiroshi Asami , Akihiko Okubora
IPC分类号： H01L21/44
CPC分类号： H01L21/6835 , H01L21/4857 , H01L23/49833 , H01L2221/68345 , H01L2221/68359 , H01L2224/16 , H01L2924/01078 , H01L2924/01087 , H01L2924/09701 , H01L2924/19041 , H05K3/0052 , H05K3/20 , H05K3/4602 , H05K3/4614 , H05K3/467 , H05K3/4682 , H05K3/4694 , H05K2201/0352 , H05K2201/09536 , H05K2203/061
摘要： A circuit substrate device composed of a circuit unit 2 and a multi-layer wiring substrate 3 in which a pattern conductor of the circuit unit 2 may be prevented from being warped or inundated. The circuit substrate device includes a circuit unit 2 having a pattern conductor formed by a thin film technique, and an insulating layer, and a multi-layer wiring substrate 3 having a connecting terminal portion 14 exposed from its major surface. The circuit unit is formed on a dummy substrate. The circuit unit is connected to the multi-layer wiring substrate 3 so that the pattern conductor is connected to the connecting terminal portion 14. The dummy substrate is then removed to give a structure comprised of the circuit unit 2 formed on the multi-layer wiring substrate 3. The pattern conductor of the circuit unit 2 is freed of warping or inundations along the direction of thickness of the circuit unit 2.
摘要翻译：由电路单元2和多层布线基板3构成的电路基板装置，其中可以防止电路单元2的图形导体翘曲或被淹没。电路基板装置包括具有通过薄膜技术形成的图案导体的电路单元2和绝缘层，以及具有从其主表面露出的连接端子部分14的多层布线基板3。电路单元形成在虚设基板上。电路单元连接到多层布线基板3，使得图案导体连接到连接端子部分14。然后去除虚设基板，得到由多层布线基板3上形成的电路单元2构成的结构。电路单元2的图形导体沿着电路单元2的厚度方向不会发生翘曲或淹没。

6. 发明申请

US20070102191A1 Method of manufacturing multilayer wiring substrate, and multilayer wiring substrate 失效
标题翻译：多层布线基板的制造方法以及多层布线基板
公开(公告)号：US20070102191A1
公开(公告)日：2007-05-10
申请号：US11644143
申请日：2006-12-22
申请人： Hiroshi Asami , Hidetoshi Kusano , Yuji Nishitani , Ken Orui
发明人： Hiroshi Asami , Hidetoshi Kusano , Yuji Nishitani , Ken Orui
IPC分类号： H05K1/11
CPC分类号： H05K3/4694 , H01L21/4846 , H01L21/4857 , H01L23/49833 , H01L2924/0002 , H01L2924/09701 , H05K3/0023 , H05K3/205 , H05K3/4617 , H05K3/4623 , H05K2201/0195 , H05K2201/09536 , H05K2201/09881 , H05K2201/09972 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165 , H01L2924/00
摘要： The present invention provides a method of manufacturing a multilayer wiring substrate, which can preserve the dimensional stability of a conductor pattern at a fine pitch, solve the restriction on a process from the viewpoint of material selection, and further reduce a manufacturing cost, and a multilayer wiring substrate. A second wiring substrate formed on a supporting sheet made of metal and an adhesive layer are partially stacked on a predetermined region of a first wiring substrate by using the supporting sheet. After the lamination of the second wiring substrate, the supporting sheet is finally etched and removed. The second wiring substrate is stacked only on the portion required to be multilayered on the first wiring substrate to thereby reduce the amount of the construction material of the second wiring substrate.
摘要翻译：本发明提供一种制造多层布线基板的方法，其可以以细间距保持导体图案的尺寸稳定性，从材料选择的角度解决对工艺的限制，并且进一步降低制造成本，并且多层布线基板。形成在由金属制成的支撑片和粘合剂层上的第二布线基板通过使用支撑片部分堆叠在第一布线基板的预定区域上。在第二布线基板的层叠之后，最后蚀刻并去除支撑片。第二布线基板仅堆叠在第一布线基板上需要多层的部分上，从而减少第二布线基板的结构材料的量。

7. 发明授权

US07880317B2 Semiconductor device and method of manufacturing semiconductor device 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US07880317B2
公开(公告)日：2011-02-01
申请号：US12094314
申请日：2006-10-30
申请人： Tomoshi Ohde , Fujio Kanayama , Mitsuru Adachi , Tetsunori Niimi , Hidetoshi Kusano , Yuji Nishitani
发明人： Tomoshi Ohde , Fujio Kanayama , Mitsuru Adachi , Tetsunori Niimi , Hidetoshi Kusano , Yuji Nishitani
IPC分类号： H01L23/28 , H01L21/00
CPC分类号： H01L23/3128 , H01L21/565 , H01L23/3737 , H01L23/49816 , H01L23/49822 , H01L23/50 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2224/81193 , H01L2924/00014 , H01L2924/01004 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H01L2924/1815 , H01L2924/19041 , H01L2924/00 , H01L2224/0401
摘要： A semiconductor device is provided in which the heat dissipation characteristic of a flip-chip mounted semiconductor chip is improved. A semiconductor device is provided with a substrate, a semiconductor flip-chip mounted on the substrate, a sealing resin layer for sealing around the semiconductor flip-chip. A sealing resin layer for sealing the semiconductor chip is formed around the semiconductor chip. In this semiconductor device, the back surface of the semiconductor chip is exposed and is convex with respect to the upper surface of the sealing resin layer.
摘要翻译：提供一种半导体器件，其中提供了安装倒装芯片的半导体芯片的散热特性。半导体器件设置有衬底，安装在衬底上的半导体倒装芯片，用于密封半导体倒装芯片周围的密封树脂层。在半导体芯片周围形成用于密封半导体芯片的密封树脂层。在该半导体装置中，半导体芯片的背面露出，相对于密封树脂层的上表面凸出。

8. 发明授权

US07288724B2 Method of manufacturing multilayer wiring substrate, and multilayer wiring substrate 失效
标题翻译：多层布线基板的制造方法以及多层布线基板
公开(公告)号：US07288724B2
公开(公告)日：2007-10-30
申请号：US10403550
申请日：2003-03-31
申请人： Hiroshi Asami , Hidetoshi Kusano , Yuji Nishitani , Ken Orui
发明人： Hiroshi Asami , Hidetoshi Kusano , Yuji Nishitani , Ken Orui
IPC分类号： H05K1/02 , H05K1/11 , H05K1/14
CPC分类号： H05K3/4694 , H01L21/4846 , H01L21/4857 , H01L23/49833 , H01L2924/0002 , H01L2924/09701 , H05K3/0023 , H05K3/205 , H05K3/4617 , H05K3/4623 , H05K2201/0195 , H05K2201/09536 , H05K2201/09881 , H05K2201/09972 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165 , H01L2924/00
摘要： A method of manufacturing a multilayer wiring substrate, which can preserve the dimensional stability of a conductor pattern at a fine pitch, solve the restriction on a process from the viewpoint of material selection, and further reduce a manufacturing cost, and a multilayer wiring substrate. A second wiring substrate formed on a supporting sheet made of metal and an adhesive layer are partially stacked on a predetermined region of a first wiring substrate by using the supporting sheet. After the lamination of the second wiring substrate, the supporting sheet is finally etched and removed. The second wiling substrate is stacked only on the portion required to be multilayered on the first wiring substrate to thereby reduce the amount of the construction material of the second wiring substrate.
摘要翻译：制造可以以细间距保持导体图案的尺寸稳定性的多层布线基板的方法从材料选择的角度解决了对工艺的限制，并且进一步降低了制造成本，以及多层布线基板。形成在由金属制成的支撑片和粘合剂层上的第二布线基板通过使用支撑片部分堆叠在第一布线基板的预定区域上。在第二布线基板的层叠之后，最后蚀刻并去除支撑片。第二卷绕基板仅叠层在第一布线基板上的多层的部分上，从而减少第二布线基板的结构材料的量。

9. 发明授权

US07053315B2 Junction structure and junction method for conductive projection 有权
标题翻译：导电投影的结结构和接合方法
公开(公告)号：US07053315B2
公开(公告)日：2006-05-30
申请号：US10802188
申请日：2004-03-17
申请人： Ken Orui , Hiroko Jinno , Yuji Nishitani , Hiroshi Asami
发明人： Ken Orui , Hiroko Jinno , Yuji Nishitani , Hiroshi Asami
IPC分类号： H05K1/11 , H01R12/04
CPC分类号： H05K3/3452 , H01L2224/10126 , H05K3/3478 , H05K2201/10734 , H05K2201/10977 , H05K2203/041 , H05K2203/043 , H05K2203/0594 , Y10T29/49147
摘要： To provide a junction structure and a junction method for conductive projection advantageous in that a required reinforcement strength can be obtained while suppressing the amount of a reinforcing resin material supplied to prevent warpage due to curing shrinkage. A conductive projection is joined to the surface of a conductor portion formed at the same level as that of the surface of the insulating layer so that a root portion of the projection is surrounded by a fillet-form resin material. The resin material contains an activator which assists in the junction between the conductive projection and the conductor portion when the resin material is in an uncured state, and is fused by heating to wet and rise the root portion of the conductive projection so as to be in a fillet form. The resin material is cured by an ultraviolet light while excluding the resin material on the conductor portion.
摘要翻译：提供一种用于导电突起的接合结构和接合方法，其优点在于可以获得所需的增强强度，同时抑制供应的增强树脂材料的量以防止由于固化收缩引起的翘曲。导电突起与形成在与绝缘层的表面相同水平面的导体部分的表面接合，使得突起的根部被圆角状的树脂材料包围。树脂材料含有活化剂，当树脂材料处于未固化状态时，其有助于导电突起与导体部分之间的接合，并通过加热熔化并使导电突起的根部上升，使其处于一个圆角形状。树脂材料通过紫外线固化，同时排除导体部分上的树脂材料。

10. 发明授权

US08599516B2 Disk drive device in which reduction in unbalanced amount can be adjusted 失效
标题翻译：可以调整不平衡量减少的盘驱动装置
公开(公告)号：US08599516B2
公开(公告)日：2013-12-03
申请号：US12889253
申请日：2010-09-23
申请人： Yuji Nishitani
发明人： Yuji Nishitani
IPC分类号： G11B17/02
CPC分类号： G11B33/08 , G11B25/043 , Y10T29/49002
摘要： A disk drive device includes: a hub on which a recording disk is to be mounted; a base member; a bearing unit configured to support the hub in a manner in which the hub can be relatively rotated with respect to the base member; an extended annular groove portion provided in part of the hub around the rotational axis of the hub; and a weight member that is installed in the extended annular groove portion to adjust a rotational balance when the recording disk is being rotated with the hub. The weight member has a fixing mechanism that is slidable, when installed, in the direction of the extended annular groove portion and that can substantially maintain a stopped state at a fixing position.
摘要翻译：磁盘驱动器装置包括：记录盘安装在其上的集线器; 基地会员轴承单元，其构造成以轮毂相对于基座相对旋转的方式支撑轮毂; 围绕轮毂的旋转轴线设置在毂的一部分的延伸的环形槽部分; 以及配重构件，其安装在延伸的环形槽部分中，以当记录盘与轮毂一起旋转时调节旋转平衡。配重构件具有固定机构，当安装时，该固定机构能够沿着延伸的环形槽部的方向滑动，并且能够在固定位置上基本保持停止状态。

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