专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US07808030B2 Electronic component manufacturing method and electronic component 失效
标题翻译：电子元件制造方法和电子元器件
公开(公告)号：US07808030B2
公开(公告)日：2010-10-05
申请号：US11595913
申请日：2006-11-13
申请人： Yoshihiro Mizuno , Xiaoyu Mi , Tsuyoshi Matsumoto , Hisao Okuda , Satoshi Ueda
发明人： Yoshihiro Mizuno , Xiaoyu Mi , Tsuyoshi Matsumoto , Hisao Okuda , Satoshi Ueda
IPC分类号： H01L21/76
CPC分类号： H05K1/162 , H01F17/0006 , H01L23/5223 , H01L23/5227 , H01L27/016 , H01L2924/0002 , H05K1/165 , H05K3/108 , H05K3/4644 , H05K3/4647 , H05K3/465 , H05K2201/09563 , H05K2201/09763 , H05K2201/09845 , H05K2203/0733 , H05K2203/1476 , H01L2924/00
摘要： The electronic component includes a base material, a capacitor unit, and a wiring portion. The capacitor unit has a stacked structure including a first electrode portion provided on the base material, a second electrode portion including a first surface opposing the first electrode portion and a second surface opposite to the first surface, and a dielectric portion interposed between the electrode portions. The wiring portion includes a via portion having a surface on the base material side, and joined to the second surface of the second electrode portion via the surface on the base material side. The surface of the via portion on the base material side includes an extending portion extending outward of the periphery of the second surface of the second electrode portion.
摘要翻译：电子部件包括基材，电容器单元和布线部。电容器单元具有包括设置在基材上的第一电极部分的层叠结构，包括与第一电极部分相对的第一表面和与第一表面相对的第二表面的第二电极部分和插入在电极部分之间的电介质部分。布线部包括在基材侧具有表面的通路部，经由基材侧的表面与第二电极部的第二面接合。基材侧的通孔部分的表面包括从第二电极部分的第二表面的周边向外延伸的延伸部分。

2. 发明申请

US20070045773A1 Integrated electronic device and method of making the same 有权
标题翻译：集成电子设备及其制作方法
公开(公告)号：US20070045773A1
公开(公告)日：2007-03-01
申请号：US11509577
申请日：2006-08-25
申请人： Xiaoyu Mi , Yoshihiro Mizuno , Tsuyoshi Matsumoto , Hisao Okuda , Satoshi Ueda
发明人： Xiaoyu Mi , Yoshihiro Mizuno , Tsuyoshi Matsumoto , Hisao Okuda , Satoshi Ueda
IPC分类号： H01L29/00 , H01L23/52 , H01F27/28 , H01F5/00
CPC分类号： H01L27/0688 , H01F17/0006 , H01L23/5227 , H01L2924/0002 , H01L2924/09701 , H01L2924/3011 , H01L2924/00
摘要： An integrated electronic device includes a substrate, passive components, pads for external connection, and three-dimensional wiring. The passive components includes a multi-stage coil inductor provided on the substrate. The multi-stage coil inductor has a plurality of coils disposed in several layers. Mutually adjacent coil wires are spaced-apart from each other. The three-dimensional wiring includes a first wiring portion which extends on the substrate, a second wiring portion which extends off the substrate but along the substrate, and a third wiring portion connecting with the first wiring portion and the second wiring portion.
摘要翻译：集成电子设备包括基板，无源部件，用于外部连接的焊盘和三维布线。无源部件包括设置在基板上的多级线圈电感器。多级线圈电感器具有多个以多层布置的线圈。相互相邻的线圈线彼此间隔开。三维布线包括在基板上延伸的第一布线部分，从基板延伸而沿着基板延伸的第二布线部分和与第一布线部分和第二布线部分连接的第三布线部分。

3. 发明申请

US20110171806A1 Integrated electronic device and method of making the same 有权
标题翻译：集成电子设备及其制作方法
公开(公告)号：US20110171806A1
公开(公告)日：2011-07-14
申请号：US13064347
申请日：2011-03-21
申请人： Xiaoyu Mi , Yoshihiro Mizuno , Tsuyoshi Matsumoto , Hisao Okuda , Satoshi Ueda , Takeo Takahashi
发明人： Xiaoyu Mi , Yoshihiro Mizuno , Tsuyoshi Matsumoto , Hisao Okuda , Satoshi Ueda , Takeo Takahashi
IPC分类号： H01L21/02
CPC分类号： H01L27/0688 , H01F17/0006 , H01L23/5227 , H01L2924/0002 , H01L2924/09701 , H01L2924/3011 , H01L2924/00
摘要： An integrated electronic device includes a substrate, passive components, pads for external connection, and three-dimensional wiring. The passive components includes a multi-stage coil inductor provided on the substrate. The multi-stage coil inductor has a plurality of coils disposed in several layers. Mutually adjacent coil wires are spaced-apart from each other. The three-dimensional wiring includes a first wiring portion which extends on the substrate, a second wiring portion which extends off the substrate but along the substrate, and a third wiring portion connecting with the first wiring portion and the second wiring portion.
摘要翻译：集成电子设备包括基板，无源部件，用于外部连接的焊盘和三维布线。无源部件包括设置在基板上的多级线圈电感器。多级线圈电感器具有多个以多层布置的线圈。相互相邻的线圈线彼此间隔开。三维布线包括在基板上延伸的第一布线部分，从基板延伸而沿着基板延伸的第二布线部分和与第一布线部分和第二布线部分连接的第三布线部分。

4. 发明申请

US20080048816A1 Inductor element and integrated electronic component 有权
标题翻译：电感元件和集成电子元件
公开(公告)号：US20080048816A1
公开(公告)日：2008-02-28
申请号：US11892451
申请日：2007-08-23
申请人： Tsuyoshi Matsumoto , Xiaoyu Mi , Yoshihiro Mizuno
发明人： Tsuyoshi Matsumoto , Xiaoyu Mi , Yoshihiro Mizuno
IPC分类号： H01F5/00
CPC分类号： H01F19/04 , H03H2001/0092
摘要： An inductor element and an integrated electronic component that facilitate achieving a higher Q value are provided. The inductor element includes a substrate, a coil unit spaced from the substrate, and a plurality of conductive columns. The coil unit includes a plurality of spiral coils each constituted of a spiral-shaped coil lead. The spiral coils are disposed such that their winding directions are the same, and that the coil lead of each spiral coil includes a portion extending between the coil lead of at least one of the other spiral coils. End portions of the spiral coils are fixed to the substrate via the conductive columns. The integrated electronic component of the invention includes such inductor element.
摘要翻译：提供了有助于实现更高Q值的电感元件和集成电子元件。电感器元件包括衬底，与衬底间隔开的线圈单元和多个导电柱。线圈单元包括由螺旋形线圈引线构成的多个螺旋线圈。螺旋线圈被布置成使得它们的缠绕方向相同，并且每个螺旋线圈的线圈引线包括在至少一个其它螺旋线圈的线圈引线之间延伸的部分。螺旋线圈的端部通过导电柱固定到基板。本发明的集成电子部件包括这种电感元件。

5. 发明申请

US20070102784A1 Electronic component 有权
标题翻译：电子元器件
公开(公告)号：US20070102784A1
公开(公告)日：2007-05-10
申请号：US11582506
申请日：2006-10-18
申请人： Tsuyoshi Matsumoto , Yoshihiro Mizuno , Xiaoyu Mi , Hisao Okuda , Satoshi Ueda
发明人： Tsuyoshi Matsumoto , Yoshihiro Mizuno , Xiaoyu Mi , Hisao Okuda , Satoshi Ueda
IPC分类号： H01L29/00
CPC分类号： H01G4/252 , H01G4/33 , H01L28/60 , H03H1/0007
摘要： An electronic component includes a substrate, a capacitor, and a wiring. The capacitor has a multilayer structure including a first electrode film provided on the substrate, a second electrode film of 2 to 4 μm in thickness disposed to face the first electrode film, and a dielectric film interposed between the first and the second electrode film. The wiring includes a joint portion connected to the second electrode film, on the opposite side of the dielectric film.
摘要翻译：电子部件包括基板，电容器和布线。电容器具有多层结构，其包括设置在基板上的第一电极膜，设置为面对第一电极膜的厚度为2至4μm的第二电极膜，以及介于第一和第二电极膜之间的电介质膜。所述布线包括在所述电介质膜的相对侧上与所述第二电极膜连接的接合部。

6. 发明授权

US08518789B2 Integrated electronic device and method of making the same 有权
标题翻译：集成电子设备及其制作方法
公开(公告)号：US08518789B2
公开(公告)日：2013-08-27
申请号：US13064347
申请日：2011-03-21
申请人： Xiaoyu Mi , Yoshihiro Mizuno , Tsuyoshi Matsumoto , Hisao Okuda , Satoshi Ueda , Takeo Takahashi
发明人： Xiaoyu Mi , Yoshihiro Mizuno , Tsuyoshi Matsumoto , Hisao Okuda , Satoshi Ueda , Takeo Takahashi
IPC分类号： H01L21/20
CPC分类号： H01L27/0688 , H01F17/0006 , H01L23/5227 , H01L2924/0002 , H01L2924/09701 , H01L2924/3011 , H01L2924/00
摘要： An integrated electronic device includes a substrate, passive components, pads for external connection, and three-dimensional wiring. The passive components includes a multi-stage coil inductor provided on the substrate. The multi-stage coil inductor has a plurality of coils disposed in several layers. Mutually adjacent coil wires are spaced-apart from each other. The three-dimensional wiring includes a first wiring portion which extends on the substrate, a second wiring portion which extends off the substrate but along the substrate, and a third wiring portion connecting with the first wiring portion and the second wiring portion.
摘要翻译：集成电子设备包括基板，无源部件，用于外部连接的焊盘和三维布线。无源部件包括设置在基板上的多级线圈电感器。多级线圈电感器具有多个以多层布置的线圈。相互相邻的线圈线彼此间隔开。三维布线包括在基板上延伸的第一布线部分，从基板延伸而沿着基板延伸的第二布线部分和与第一布线部分和第二布线部分连接的第三布线部分。

7. 发明授权

US07948056B2 Integrated electronic device and method of making the same 有权
公开(公告)号：US07948056B2
公开(公告)日：2011-05-24
申请号：US11509577
申请日：2006-08-25
申请人： Xiaoyu Mi , Yoshihiro Mizuno , Tsuyoshi Matsumoto , Hisao Okuda , Satoshi Ueda , Takeo Takahashi
发明人： Xiaoyu Mi , Yoshihiro Mizuno , Tsuyoshi Matsumoto , Hisao Okuda , Satoshi Ueda , Takeo Takahashi
IPC分类号： H01L29/00
CPC分类号： H01L27/0688 , H01F17/0006 , H01L23/5227 , H01L2924/0002 , H01L2924/09701 , H01L2924/3011 , H01L2924/00
摘要： An integrated electronic device includes a substrate, passive components, pads for external connection, and three-dimensional wiring. The passive components includes a multi-stage coil inductor provided on the substrate. The multi-stage coil inductor has a plurality of coils disposed in several layers. Mutually adjacent coil wires are spaced-apart from each other. The three-dimensional wiring includes a first wiring portion which extends on the substrate, a second wiring portion which extends off the substrate but along the substrate, and a third wiring portion connecting with the first wiring portion and the second wiring portion.

8. 发明授权

US07508291B2 Inductor element and integrated electronic component 有权
标题翻译：电感元件和集成电子元件
公开(公告)号：US07508291B2
公开(公告)日：2009-03-24
申请号：US11892451
申请日：2007-08-23
申请人： Tsuyoshi Matsumoto , Xiaoyu Mi , Yoshihiro Mizuno
发明人： Tsuyoshi Matsumoto , Xiaoyu Mi , Yoshihiro Mizuno
IPC分类号： H01F5/00
CPC分类号： H01F19/04 , H03H2001/0092
摘要： An inductor element and an integrated electronic component that facilitate achieving a higher Q value are provided. The inductor element includes a substrate, a coil unit spaced from the substrate, and a plurality of conductive columns. The coil unit includes a plurality of spiral coils each constituted of a spiral-shaped coil lead. The spiral coils are disposed such that their winding directions are the same, and that the coil lead of each spiral coil includes a portion extending between the coil lead of at least one of the other spiral coils. End portions of the spiral coils are fixed to the substrate via the conductive columns. The integrated electronic component of the invention includes such inductor element.
摘要翻译：提供了有助于实现更高Q值的电感元件和集成电子元件。电感器元件包括衬底，与衬底间隔开的线圈单元和多个导电柱。线圈单元包括由螺旋形线圈引线构成的多个螺旋线圈。螺旋线圈被布置成使得它们的缠绕方向相同，并且每个螺旋线圈的线圈引线包括在至少一个其它螺旋线圈的线圈引线之间延伸的部分。螺旋线圈的端部通过导电柱固定到基板。本发明的集成电子部件包括这种电感元件。

9. 发明申请

US20070158848A1 Electronic component 有权
标题翻译：电子元器件
公开(公告)号：US20070158848A1
公开(公告)日：2007-07-12
申请号：US11585877
申请日：2006-10-25
申请人： Tsuyoshi Matsumoto , Yoshihiro Mizuno , Xiaoyu Mi , Hisao Okuda , Satoshi Ueda
发明人： Tsuyoshi Matsumoto , Yoshihiro Mizuno , Xiaoyu Mi , Hisao Okuda , Satoshi Ueda
IPC分类号： H01L23/52 , H01L23/48 , H01L29/40
CPC分类号： H01G4/008 , H01G4/232 , H01G4/33 , H01L24/18 , H01L28/10 , H01L28/75
摘要： An electronic component includes a substrate, and a capacitor unit on the substrate. The capacitor unit has a laminate structure including a first electrode layer provided on the substrate, a second electrode layer opposed to the first electrode layer, and a dielectric layer disposed between the first and the second electrode layers. The first electrode layer has a multilayer structure including an adhesion metal layer joined to the dielectric layer. The adhesion metal layer is provided with an oxide coating on a side of the dielectric layer.
摘要翻译：电子部件包括基板和基板上的电容器单元。电容器单元具有包括设置在基板上的第一电极层，与第一电极层相对的第二电极层和设置在第一和第二电极层之间的电介质层的层压结构。第一电极层具有包含与电介质层接合的粘附金属层的多层结构。附着金属层在电介质层一侧设置有氧化物涂层。

10. 发明申请

US20070122992A1 Electronic component manufacturing method and electronic component 失效
标题翻译：电子元件制造方法和电子元器件
公开(公告)号：US20070122992A1
公开(公告)日：2007-05-31
申请号：US11595913
申请日：2006-11-13
申请人： Yoshihiro Mizuno , Xiaoyu Mi , Tsuyoshi Matsumoto , Hisao Okuda , Satoshi Ueda
发明人： Yoshihiro Mizuno , Xiaoyu Mi , Tsuyoshi Matsumoto , Hisao Okuda , Satoshi Ueda
IPC分类号： H01L27/108 , H01L21/20
CPC分类号： H05K1/162 , H01F17/0006 , H01L23/5223 , H01L23/5227 , H01L27/016 , H01L2924/0002 , H05K1/165 , H05K3/108 , H05K3/4644 , H05K3/4647 , H05K3/465 , H05K2201/09563 , H05K2201/09763 , H05K2201/09845 , H05K2203/0733 , H05K2203/1476 , H01L2924/00
摘要： The electronic component includes a base material, a capacitor unit, and a wiring portion. The capacitor unit has a stacked structure including a first electrode portion provided on the base material, a second electrode portion including a first surface opposing the first electrode portion and a second surface opposite to the first surface, and a dielectric portion interposed between the electrode portions. The wiring portion includes a via portion having a surface on the base material side, and joined to the second surface of the second electrode portion via the surface on the base material side. The surface of the via portion on the base material side includes an extending portion extending outward of the periphery of the second surface of the second electrode portion.
摘要翻译：电子部件包括基材，电容器单元和布线部。电容器单元具有包括设置在基材上的第一电极部分的层叠结构，包括与第一电极部分相对的第一表面和与第一表面相对的第二表面的第二电极部分和插入在电极部分之间的电介质部分。布线部包括在基材侧具有表面的通路部，经由基材侧的表面与第二电极部的第二面接合。基材侧的通孔部分的表面包括从第二电极部分的第二表面的周边向外延伸的延伸部分。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式