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1. 发明授权

US08766103B2 Electronic component 有权
标题翻译：电子元器件
公开(公告)号：US08766103B2
公开(公告)日：2014-07-01
申请号：US12343784
申请日：2008-12-24
申请人： Takeo Takahashi , Xiaoyu Mi , Tsuyoshi Yokoyama , Tokihiro Nishihara , Satoshi Ueda
发明人： Takeo Takahashi , Xiaoyu Mi , Tsuyoshi Yokoyama , Tokihiro Nishihara , Satoshi Ueda
IPC分类号： H05K1/02
CPC分类号： H05K1/16 , H01L2224/16 , H05K1/0306 , H05K1/113 , H05K3/246 , H05K3/4061 , H05K3/4611 , H05K3/4629 , H05K2201/0195 , H05K2201/0347 , H05K2201/09436
摘要： An electronic component includes: a multilayer ceramic substrate that has a penetration electrode formed therein, and has a passive element provided on the upper face thereof; an insulating film that is provided on the multilayer ceramic substrate, and has an opening above the penetration electrode; a first connecting terminal that is provided on the insulating film so as to cover the opening, and is electrically connected to the penetration electrode; and a second connecting terminal that is provided on a region of the insulating film other than the opening region.
摘要翻译：电子部件包括：多层陶瓷基板，其具有形成在其中的穿透电极，并且在其上表面上设置无源元件; 绝缘膜，设置在所述多层陶瓷基板上，并且在所述贯通电极的上方具有开口部; 第一连接端子，设置在绝缘膜上以覆盖开口，并且电连接到穿透电极; 以及第二连接端子，其设置在除了开口区域之外的绝缘膜的区域上。

2. 发明授权

US08209829B2 Method of fabricating the electronic device 有权
标题翻译：制造电子装置的方法
公开(公告)号：US08209829B2
公开(公告)日：2012-07-03
申请号：US12394995
申请日：2009-02-27
申请人： Takeo Takahashi , Xiaoyu Mi , Satoshi Ueda
发明人： Takeo Takahashi , Xiaoyu Mi , Satoshi Ueda
IPC分类号： H01G7/00
CPC分类号： H01G4/06 , H01G13/00 , H01L27/016 , H01L28/10 , H01L28/40 , H05K1/0306 , H05K1/162 , H05K3/4007 , H05K3/4611 , H05K3/4629 , H05K3/4644 , H05K2201/09763 , Y10T29/417 , Y10T29/43 , Y10T29/435 , Y10T29/49126
摘要： A method of fabricating an electronic device includes selectively forming a glass layer on a ceramic substrate by printing, baking the glass layer, and forming a capacitor on the glass layer, the capacitor including metal electrodes and a dielectric layer interposed between the metal electrodes.
摘要翻译：一种制造电子器件的方法包括通过印刷，烘烤玻璃层和在玻璃层上形成电容器，在陶瓷基片上选择性地形成玻璃层，电容器包括金属电极和置于金属电极之间的电介质层。

3. 发明申请

US20110241430A1 METHOD FOR CONTROLLING SYSTEM GAIN OF UPS 审中-公开
标题翻译：控制UPS系统增益的方法
公开(公告)号：US20110241430A1
公开(公告)日：2011-10-06
申请号：US13080341
申请日：2011-04-05
申请人： Fang Liu , Zhongjun Wei , Xiaoyu MI , Xunbin Wu
发明人： Fang Liu , Zhongjun Wei , Xiaoyu MI , Xunbin Wu
IPC分类号： H02J9/00
CPC分类号： H02M3/3376 , H02J9/062 , H02M2001/0058 , Y02B70/1433 , Y02B70/1491 , Y02P80/112 , Y10T307/625
摘要： The present invention discloses a control method for the system gain of a UPS, which includes the steps of: S1: detecting a PFC unit so as to determine whether to start an LLC, and if so, then going to step S2; otherwise, going to step S8; S2: starting the LLC; S3: detecting the mains supply so as to determine whether to switch from the mains supply to a battery, and if so, then going to step S4; otherwise, going to step S5; S4: performing a frequency-fixed adjustment on the LLC with an operating frequency larger than a resonating frequency by a preset magnitude while clearing an integral quantity within a first preset time T1; and performing a frequency-fixed adjustment on the LLC with an operating frequency equal to the resonating frequency while clearing the integral quantity between the first preset time T1 and a second preset time T2, and going to step S8; S5: determining whether the LLC-in-series resonant converter has an overload, and if so, then going to step S6; otherwise, going to step S7; S6: performing a frequency-fixed adjustment on the LLC-in-series resonant converter with the operating frequency equal to the resonating frequency while clearing the integral quantity; and going to the step S8; S7: performing a normal PI adjustment on the LLC-in-series resonant converter; and S8: Ending. The operation condition of the PFC is detected in real time, the LLC is started when the PFC becomes abnormal, and the LLC is adjusted in response to a load during operating so that the system gain is maintained in a monotonously step-down region of a ZVS region.
摘要翻译：本发明公开了一种用于UPS的系统增益的控制方法，包括以下步骤：S1：检测PFC单元以确定是否启动LLC，如果是，则进入步骤S2; 否则，进入步骤S8; S2：启动LLC; S3：检测主电源，以确定是否从电源切换到电池，如果是，则进入步骤S4; 否则，进入步骤S5; S4：在第一预设时间T1内清除积分量的情况下，以大于谐振频率的工作频率在LLC上执行频率固定调整预定幅度; 以及在清除第一预设时间T1和第二预设时间T2之间的积分量的情况下，以等于谐振频率的工作频率对LLC进行频率固定调整，并进入步骤S8; S5：确定LLC串联谐振变换器是否有过载，如果是，则进入步骤S6; 否则，进入步骤S7; S6：在清除积分量的同时，将工作频率等于谐振频率的LLC串联谐振变换器进行频率固定调整; 并进入步骤S8; S7：在LLC串联谐振转换器上执行正常的PI调节; 和S8：结束。 PFC实时检测运行状态，当PFC变为异常时，启动LLC，并在运行期间根据负载调整LLC，使系统增益保持在单调降压区域 ZVS区域。

4. 发明授权

US07833430B2 Method for fabricating microstructure and microstructure 有权
标题翻译：微结构和微结构的制作方法
公开(公告)号：US07833430B2
公开(公告)日：2010-11-16
申请号：US11256959
申请日：2005-10-25
申请人： Xiaoyu Mi , Norinao Kouma , Osamu Tsuboi , Masafumi Iwaki , Hisao Okuda , Hiromitsu Soneda , Satoshi Ueda , Ippei Sawaki
发明人： Xiaoyu Mi , Norinao Kouma , Osamu Tsuboi , Masafumi Iwaki , Hisao Okuda , Hiromitsu Soneda , Satoshi Ueda , Ippei Sawaki
IPC分类号： B44C1/22
CPC分类号： B81C1/00547 , B81B2201/042 , B81B2203/0136 , B81C2201/0132 , B81C2201/0133 , G01P15/0802 , G02B26/0841
摘要： A method of making a microstructure with thin wall portions (T1-T3) includes a step of performing a first etching process to a material substrate having a laminate structure including a first conductive layer (11) and a second conductive layer (12) having a thickness of the thin wall portions (T1-T3), where the etching is performed from the side of the first conductive layer (11) thereby forming in the second conductive layer (12) pre thin wall portions (T1′-T3′) which has a pair of side surfaces apart from each other in an in-plane direction of the second conductive layer (12) and contact the first conductive layer (11). The method also includes a step of performing a second etching process from the side of the first conductive layer (11) for removing part of the first conductive layer (11) contacting the pre thin wall portions (T1′-T3′) to form the thin wall portions.
摘要翻译：一种制造具有薄壁部分（T1-T3）的微结构的方法包括对具有包括第一导电层（11）和第二导电层（12）的层压结构的材料基板进行第一蚀刻工艺的步骤，所述第一导电层（11）和第二导电层（12）从第一导电层（11）侧进行蚀刻从而在第二导电层（12）中形成预薄壁部分（T1'-T3'）的薄壁部分（T1-T3）的厚度，具有在第二导电层（12）的面内方向上彼此分开的一对侧表面，并与第一导电层（11）接触。该方法还包括从第一导电层（11）侧进行第二蚀刻处理以去除与预薄壁部分（T1'-T3'）接触的第一导电层（11）的一部分的步骤，以形成薄壁部分。

5. 发明授权

US07808030B2 Electronic component manufacturing method and electronic component 失效
标题翻译：电子元件制造方法和电子元器件
公开(公告)号：US07808030B2
公开(公告)日：2010-10-05
申请号：US11595913
申请日：2006-11-13
申请人： Yoshihiro Mizuno , Xiaoyu Mi , Tsuyoshi Matsumoto , Hisao Okuda , Satoshi Ueda
发明人： Yoshihiro Mizuno , Xiaoyu Mi , Tsuyoshi Matsumoto , Hisao Okuda , Satoshi Ueda
IPC分类号： H01L21/76
CPC分类号： H05K1/162 , H01F17/0006 , H01L23/5223 , H01L23/5227 , H01L27/016 , H01L2924/0002 , H05K1/165 , H05K3/108 , H05K3/4644 , H05K3/4647 , H05K3/465 , H05K2201/09563 , H05K2201/09763 , H05K2201/09845 , H05K2203/0733 , H05K2203/1476 , H01L2924/00
摘要： The electronic component includes a base material, a capacitor unit, and a wiring portion. The capacitor unit has a stacked structure including a first electrode portion provided on the base material, a second electrode portion including a first surface opposing the first electrode portion and a second surface opposite to the first surface, and a dielectric portion interposed between the electrode portions. The wiring portion includes a via portion having a surface on the base material side, and joined to the second surface of the second electrode portion via the surface on the base material side. The surface of the via portion on the base material side includes an extending portion extending outward of the periphery of the second surface of the second electrode portion.
摘要翻译：电子部件包括基材，电容器单元和布线部。电容器单元具有包括设置在基材上的第一电极部分的层叠结构，包括与第一电极部分相对的第一表面和与第一表面相对的第二表面的第二电极部分和插入在电极部分之间的电介质部分。布线部包括在基材侧具有表面的通路部，经由基材侧的表面与第二电极部的第二面接合。基材侧的通孔部分的表面包括从第二电极部分的第二表面的周边向外延伸的延伸部分。

6. 发明申请

US20090166068A1 ELECTRONIC COMPONENT 有权
标题翻译：电子元件
公开(公告)号：US20090166068A1
公开(公告)日：2009-07-02
申请号：US12343784
申请日：2008-12-24
申请人： Takeo Takahashi , Xiaoyu Mi , Tsuyoshi Yokoyama , Tokihiro Nishihara , Satoshi Ueda
发明人： Takeo Takahashi , Xiaoyu Mi , Tsuyoshi Yokoyama , Tokihiro Nishihara , Satoshi Ueda
IPC分类号： H05K1/00 , H05K1/16
CPC分类号： H05K1/16 , H01L2224/16 , H05K1/0306 , H05K1/113 , H05K3/246 , H05K3/4061 , H05K3/4611 , H05K3/4629 , H05K2201/0195 , H05K2201/0347 , H05K2201/09436
摘要： An electronic component includes: a multilayer ceramic substrate that has a penetration electrode formed therein, and has a passive element provided on the upper face thereof; an insulating film that is provided on the multilayer ceramic substrate, and has an opening above the penetration electrode; a first connecting terminal that is provided on the insulating film so as to cover the opening, and is electrically connected to the penetration electrode; and a second connecting terminal that is provided on a region of the insulating film other than the opening region.
摘要翻译：电子部件包括：多层陶瓷基板，其具有形成在其中的穿透电极，并且在其上表面上设置无源元件; 绝缘膜，设置在所述多层陶瓷基板上，并且在所述贯通电极的上方具有开口部; 第一连接端子，设置在绝缘膜上以覆盖开口，并且电连接到穿透电极; 以及第二连接端子，其设置在除了开口区域之外的绝缘膜的区域上。

7. 发明授权

US07551054B2 Electronic device and method of manufacturing the same 有权
标题翻译：电子设备及其制造方法
公开(公告)号：US07551054B2
公开(公告)日：2009-06-23
申请号：US11288142
申请日：2005-11-29
申请人： Yoshihiro Mizuno , Xiaoyu Mi , Hisao Okuda , Hiromitsu Soneda , Satoshi Ueda , Takeo Takahashi
发明人： Yoshihiro Mizuno , Xiaoyu Mi , Hisao Okuda , Hiromitsu Soneda , Satoshi Ueda , Takeo Takahashi
IPC分类号： H01F5/00
CPC分类号： H01L23/5227 , H01F17/0006 , H01F27/40 , H01L21/84 , H01L23/5223 , H01L27/016 , H01L27/13 , H01L2924/0002 , H01L2924/09701 , H01L2924/19011 , H01L2924/00
摘要： An electronic device includes: an insulating substrate; at least one capacitor and an inductor that are formed directly on the insulating substrate; a line that connects the capacitor and the inductor from the above; and an external connecting pad unit that is made of the same conductor as the line and is disposed on the insulating substrate.
摘要翻译：电子设备包括：绝缘基板; 至少一个直接形成在所述绝缘基板上的电容器和电感器; 从上述连接电容器和电感器的线路; 以及外部连接焊盘单元，其由与该线路相同的导体制成并且设置在绝缘基板上。

8. 发明申请

US20090085707A1 ELECTRONIC DEVICE 有权
标题翻译：电子设备
公开(公告)号：US20090085707A1
公开(公告)日：2009-04-02
申请号：US12237826
申请日：2008-09-25
申请人： Xiaoyu MI , Takeo Takahashi , Tsuyoshi Matsumoto , Satoshi Ueda
发明人： Xiaoyu MI , Takeo Takahashi , Tsuyoshi Matsumoto , Satoshi Ueda
IPC分类号： H01F5/00
CPC分类号： H01F17/0013 , H01F27/29 , H01F2017/002 , H01F2017/0073
摘要： An electronic device includes a substrate, a first coil that has a spiral shape and is provided on the substrate, a second coil that has a spiral shape, is provided above the first coil, and is spaced from the first coil, a first connection portion that electrically couples the first coil and the second coil, a wire that is provided on the substrate and connects one of the first coil and the second coil to outside, and a second connection portion that is mechanically connected to an outer side face of outermost circumference of the second coil and is mechanically connected on the substrate where one of the wire and the first coil is not provided.
摘要翻译：一种电子设备包括基板，具有螺旋形状并设置在基板上的第一线圈，具有螺旋形状的第二线圈，设置在第一线圈上方，并与第一线圈间隔开，第一连接部分将第一线圈和第二线圈电耦合的线路，设置在基板上并将第一线圈和第二线圈中的一个连接到外部的线，以及机械地连接到最外侧的外侧面的第二连接部并且机械连接在不设置线和第一线圈中的一个的基板上。

9. 发明申请

US20080180872A1 Drive control method and unit for micro machine device 有权
标题翻译：微机设备的驱动控制方法和单元
公开(公告)号：US20080180872A1
公开(公告)日：2008-07-31
申请号：US12010243
申请日：2008-01-23
申请人： Naoyuki Mishima , Yu Yonezawa , Takeaki Shimanouchi , Xiaoyu Mi , Takeshi Takano , Nobuhisa Aoki , Yuuta Nakaya
发明人： Naoyuki Mishima , Yu Yonezawa , Takeaki Shimanouchi , Xiaoyu Mi , Takeshi Takano , Nobuhisa Aoki , Yuuta Nakaya
IPC分类号： H01H47/00 , H03K17/975 , H03H7/38
CPC分类号： H01G5/18 , H03H7/38 , H03H2007/006
摘要： A drive control method for a micro machine device is provided. The micro machine device is made up of first and second electrodes opposed to each other and a dielectric layer disposed between them. The drive control method includes the steps of applying a control voltage between the first and the second electrodes so that an electrostatic force is exerted on the first and the second electrodes for displacing the first or the second electrode, and switching polarity of the control voltage at a predetermined period or a shorter period.
摘要翻译：提供了一种微机器的驱动控制方法。微机器件由彼此相对的第一和第二电极以及设置在它们之间的电介质层构成。驱动控制方法包括以下步骤：在第一和第二电极之间施加控制电压，使得静电力施加在第一和第二电极上，用于使第一或第二电极移位，并且将控制电压的极性切换到预定期间或较短期间。

10. 发明申请

US20080055873A1 Electronic part module and method of making the same 有权
标题翻译：电子零件模块及其制作方法
公开(公告)号：US20080055873A1
公开(公告)日：2008-03-06
申请号：US11896036
申请日：2007-08-29
申请人： Xiaoyu Mi , Tsuyoshi Matsumoto , Satoshi Ueda
发明人： Xiaoyu Mi , Tsuyoshi Matsumoto , Satoshi Ueda
IPC分类号： H05K1/16 , H05K3/00 , H05K7/02
CPC分类号： H05K1/165 , H01L23/5389 , H01L23/642 , H01L23/645 , H01L25/16 , H01L2224/16 , H01L2924/00011 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/16152 , H01L2924/19015 , H05K1/162 , H05K3/0052 , H05K3/4685 , H05K2201/0394 , H05K2201/10674 , H05K2203/0574 , H05K2203/308 , Y10T29/49124 , H01L2224/0401
摘要： An electronic part module includes a wiring substrate, a passive device group of passive devices formed on the wiring substrate, and device chips mounted on the wiring substrate. Such an electronic part module is made in the following manner. First, a wiring substrate wafer is made, to include a plurality of electronic part module formation areas. Then, a plurality of passive devices are formed in each of the electronic part module formation areas on the wiring substrate wafer. Then, the device chips are formed on each of the electronic part module formation areas on the wiring substrate wafer. Finally, the wiring substrate wafer is divided.
摘要翻译：电子部件模块包括布线基板，形成在布线基板上的无源器件的无源器件组以及安装在布线基板上的器件芯片。这样的电子部件模块以如下方式制成。首先，制造布线基板晶片，以包括多个电子部件模块形成区域。然后，在布线基板晶片上的每个电子部件模块形成区域中形成多个无源器件。然后，在布线基板晶片上的每个电子部件模块形成区域上形成器件芯片。最后，分配布线基板晶片。

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