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    • 2. 发明授权
    • High reflectance and low stress Mo2C/Be multilayers
    • 高反射率和低应力Mo2C / Be多层
    • US06229652B1
    • 2001-05-08
    • US09200163
    • 1998-11-25
    • Sasa BajtTroy W. Barbee, Jr.
    • Sasa BajtTroy W. Barbee, Jr.
    • G02B110
    • G02B5/0891G02B5/26G03F7/70958
    • A material for extreme ultraviolet (EUV) multilayers that will reflect at about 11.3 nm, have a high reflectance, low stress, and high thermal and radiation stability. The material consists of alternating layers of Mo2C and Be deposited by DC magnetron sputtering on a substrate, such as silicon. In one example a Mo2C/Be multilayer gave 65.2% reflectance at 11.25 nm measured at 5 degrees off normal incidence angle, and consisted of 70 bilayers with a deposition period of 5.78 nm, and was deposited at 0.83 mTorr argon (Ar) sputtering pressure, with the first and last layers being Be. The stress of the multilayer is tensile and only +88 MPa, compared to +330 MPa of a Mo/Be multilayers of the same thickness. The Mo2C/Be multilayer was capped with carbon which produced an increase in reflectivity of about 7% over a similar multilayer with no carbon capping material, thus raising the reflectivity from 58.3% to over 65%. The multilayers were formed using either Mo2C or Be as the first and last layers, and initial testing has shown the formation of beryllium carbide at the interfaces between the layers which both stabilizes and has a smoothing effect, and appear to be smoother than the interfaces in Mo/Be multilayers.
    • 将在11.3纳米处反射的极紫外(EUV)多层材料具有高反射率,低应力和​​高热辐射稳定性。 该材料由通过DC磁控溅射沉积的Mo2C交替层和在诸如硅的衬底上沉积。 在一个实例中,Mo2C / Be多层在垂直入射角5度下测量的11.25nm处的反射率为65.2%,由沉积周期为5.78nm的70个双层组成,并以0.83mTorr氩(Ar)溅射压力沉积, 第一层和最后层是Be。 与相同厚度的Mo / Be多层的+330MPa相比,多层的应力是拉伸且仅+88MPa。 Mo2C / Be多层被碳覆盖,与没有碳覆盖材料的类似多层相比,反射率增加约7%,从而将反射率从58.3%提高到65%以上。 多层是使用Mo2C或Be作为第一层和最后层形成的,初步测试显示在两层之间的界面处形成碳化铍,两层之间的界面既稳定又具有平滑效果,并且看起来比其界面更平滑 Mo / Be多层。
    • 3. 发明授权
    • Area X-ray or UV camera system for high-intensity beams
    • 用于高强度光束的区域X射线或UV摄像系统
    • US07672430B2
    • 2010-03-02
    • US12121177
    • 2008-05-15
    • Henry N. ChapmanSasa BajtEberhard A. SpillerStefan Hau-RiegeStefano Marchesini
    • Henry N. ChapmanSasa BajtEberhard A. SpillerStefan Hau-RiegeStefano Marchesini
    • G01N23/20
    • G01J1/429G01J1/04G01J1/0414G01J1/0455G01J1/4228G01N21/4788G21K2207/00
    • A system in one embodiment includes a source for directing a beam of radiation at a sample; a multilayer mirror having a face oriented at an angle of less than 90 degrees from an axis of the beam from the source, the mirror reflecting at least a portion of the radiation after the beam encounters a sample; and a pixellated detector for detecting radiation reflected by the mirror. A method in a further embodiment includes directing a beam of radiation at a sample; reflecting at least some of the radiation diffracted by the sample; not reflecting at least a majority of the radiation that is not diffracted by the sample; and detecting at least some of the reflected radiation. A method in yet another embodiment includes directing a beam of radiation at a sample; reflecting at least some of the radiation diffracted by the sample using a multilayer mirror; and detecting at least some of the reflected radiation.
    • 一个实施例中的系统包括用于在样本处引导辐射束的源; 多层反射镜,其具有朝向与源的光束的轴线成小于90度的角度定向的面,反射镜在光束遇到样本之后反射至少一部分辐射; 以及用于检测由反射镜反射的辐射的像素化检测器。 另一实施例中的方法包括将样品的辐射束引导; 反映由样品衍射的至少一些辐射; 不反映不被样品衍射的辐射的至少大部分; 以及检测所述反射辐射中的至少一些。 另一实施例中的方法包括将样品的辐射束引导; 使用多层反射镜反射由样品衍射的至少一些辐射; 以及检测所述反射辐射中的至少一些。
    • 6. 发明授权
    • Method to adjust multilayer film stress induced deformation of optics
    • 调整多层膜应力诱导光学变形的方法
    • US6134049A
    • 2000-10-17
    • US160264
    • 1998-09-25
    • Eberhard A. SpillerPaul B. MirkarimiClaude MontcalmSasa BajtJames A. Folta
    • Eberhard A. SpillerPaul B. MirkarimiClaude MontcalmSasa BajtJames A. Folta
    • B32B7/02B32B15/04G02B1/10G02B5/08G02B5/26G02B5/28G03F1/22G03F7/20F21V9/04
    • G03F7/70958G02B5/0875G02B5/0891G02B5/26G03F1/22G21K1/062
    • Stress compensating systems that reduces/compensates stress in a multilayer without loss in reflectivity, while reducing total film thickness compared to the earlier buffer-layer approach. The stress free multilayer systems contain multilayer systems with two different material combinations of opposite stress, where both systems give good reflectivity at the design wavelengths. The main advantage of the multilayer system design is that stress reduction does not require the deposition of any additional layers, as in the buffer layer approach. If the optical performance of the two systems at the design wavelength differ, the system with the poorer performance is deposited first, and then the system with better performance last, thus forming the top of the multilayer system. The components for the stress reducing layer are chosen among materials that have opposite stress to that of the preferred multilayer reflecting stack and simultaneously have optical constants that allow one to get good reflectivity at the design wavelength. For a wavelength of 13.4 nm, the wavelength presently used for extreme ultraviolet (EUV) lithography, Si and Be have practically the same optical constants, but the Mo/Si multilayer has opposite stress than the Mo/Be multilayer. Multilayer systems of these materials have practically identical reflectivity curves. For example, stress free multilayers can be formed on a substrate using Mo/Be multilayers in the bottom of the stack and Mo/Si multilayers at the top of the stack, with the switch-over point selected to obtain zero stress. In this multilayer system, the switch-over point is at about the half point of the total thickness of the stack, and for the Mo/Be--Mo/Si system, there may be 25 deposition periods Mo/Be to 20 deposition periods Mo/Si.
    • 应力补偿系统减少/补偿多层中的应力,而不损失反射率,同时减少与较早的缓冲层方法相比的总膜厚度。 无应力的多层系统包含具有两种不同材料组合的相反应力的多层系统,其中两个系统在设计波长处给出良好的反射率。 多层系统设计的主要优点是减压不需要任何附加层的沉积,如缓冲层方法一样。 如果两个系统的设计波长的光学性能不同,首先沉积性能较差的系统,然后再次具有更好性能的系统,从而形成多层系统的顶部。 应力降低层的组件选自具有与优选的多层反射叠层相反的应力的材料,并且同时具有允许在设计波长处获得良好的反射率的光学常数。 对于13.4nm的波长,目前用于极紫外(EUV)光刻的波长Si和Be实际上具有相同的光学常数,但Mo / Si多层具有与Mo / Be多层相反的应力。 这些材料的多层系统具有几乎相同的反射曲线。 例如,可以在堆叠底部使用Mo / Be多层和堆叠顶部的Mo / Si多层在衬底上形成无应力多层,选择切换点以获得零应力。 在该多层体系中,切换点为堆叠总厚度的大约一半,对于Mo / Be-Mo / Si系统,可能存在25个沉积周期Mo / Be至20个沉积周期Mo / Si。
    • 9. 发明授权
    • Mitigation of substrate defects in reticles using multilayer buffer layers
    • 减少使用多层缓冲层的标线板中的底物缺陷
    • US06319635B1
    • 2001-11-20
    • US09454715
    • 1999-12-06
    • Paul B. MirkarimiSasa BajtDaniel G. Stearns
    • Paul B. MirkarimiSasa BajtDaniel G. Stearns
    • G03F900
    • B82Y40/00B82Y10/00G03F1/24G03F1/38G03F1/72
    • A multilayer film is used as a buffer layer to minimize the size of defects on a reticle substrate prior to deposition of a reflective coating on the substrate. The multilayer buffer layer deposited intermediate the reticle substrate and the reflective coating produces a smoothing of small particles and other defects on the reticle substrate. The reduction in defect size is controlled by surface relaxation during the buffer layer growth process and by the degree of intermixing and volume contraction of the materials at the multilayer interfaces. The buffer layers are deposited at near-normal incidence via a low particulate ion beam sputtering process. The growth surface of the buffer layer may also be heated by a secondary ion source to increase the degree of intermixing and improve the mitigation of defects.
    • 在将反射涂层沉积在基底上之前,使用多层膜作为缓冲层以最小化掩模版基板上的缺陷的尺寸。 沉积在掩模版基板和反射涂层之间的多层缓冲层在掩模版基板上产生平滑的小颗粒和其它缺陷。 缺陷尺寸的减少由缓冲层生长过程中的表面松弛和多层界面处的材料的混合和体积收缩程度控制。 缓冲层通过低颗粒离子束溅射工艺以近正常入射沉积。 缓冲层的生长表面也可以被二次离子源加热以增加混合程度并改善缺陷的减轻。