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    • 1. 发明授权
    • Fluidic feedback-controlled liquid cooling module
    • 流体反馈控制液体冷却模块
    • US5815370A
    • 1998-09-29
    • US857260
    • 1997-05-16
    • Trevor G. Sutton
    • Trevor G. Sutton
    • H05K7/20
    • H05K7/20281
    • A liquid cooling module for cooling electronic circuit components and the like comprises the use of a fluidic amplifier element in conjunction with a thermally sensitive fluidic element. The thermally sensitive fluidic element responds to the change in viscosity with respect to temperature of a coolant flowing through a cooling plate. In response to the viscosity change, the thermally sensitive element produces a fluidic control signal to the fluidic amplifier element, which increases the rate of flow through the cooling plate with increasing coolant temperature and decreases the rate of flow through the cooling plate with decreasing coolant temperature.
    • 用于冷却电子电路部件等的液体冷却模块包括使用与热敏流体元件结合的流体放大器元件。 热敏流体元件响应于流过冷却板的冷却剂的温度的粘度变化。 响应于粘度变化,热敏元件产生流体控制信号到流体放大器元件,这增加了冷却板随着冷却剂温度的增加而流动的速度,并降低了冷却板流过冷却剂温度降低的速度 。