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    • 4. 发明申请
    • Organosilicon compound
    • 有机硅化合物
    • US20050101791A1
    • 2005-05-12
    • US11015024
    • 2004-12-20
    • Toshiyuki OzaiHiroyasu HaraYoshifumi InoueTomoyuki Goto
    • Toshiyuki OzaiHiroyasu HaraYoshifumi InoueTomoyuki Goto
    • C07F7/08C07F7/18
    • C07F7/1804
    • An organosilicon compound represented by the following general formula (1): wherein R1 is a hydrogen atom, a phenyl group or a halogenated phenyl group; R2 is a hydrogen atom or a methyl group; R3's are each a substituted or unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms; X is a hydrolyzable group; Z1 is —R4—, —R4O— or —R4(CH3)2SiO—, where R4 is a substituted or unsubstituted divalent hydrocarbon group having 1 to 10 carbon atoms; Z2 is an oxygen atom or a substituted or unsubstituted divalent hydrocarbon group having 1 to 10 carbon atoms; and m is 0, 1 or 2 and n is 0, 1 or 2. When incorporated in silicone compositions, the organosilicon compound acts as a cross-linking agent having well-balanced photopolymerizability and condensation curability.
    • 由以下通式(1)表示的有机硅化合物:其中R 1是氢原子,苯基或卤代苯基; R 2是氢原子或甲基; R 3各自为取代或未取代的碳原子数为1〜10的一价烃基; X是可水解基团; Z 1是-R 4 - , - R 4 O-或-R 4(CH 3) 3 SiO 2,其中R 4是取代或未取代的具有1至10个碳原子的二价烃基; Z 2是氧原子或取代或未取代的碳原子数为1〜10的二价烃基; 并且m为0,1或2,n为0,1或2.当掺入有机硅组合物中时,有机硅化合物用作具有良好平衡光聚合性和缩合固化性的交联剂。
    • 5. 发明授权
    • Organosilicon compound
    • 有机硅化合物
    • US07045572B2
    • 2006-05-16
    • US11015024
    • 2004-12-20
    • Toshiyuki OzaiHiroyasu HaraYoshifumi InoueTomoyuki Goto
    • Toshiyuki OzaiHiroyasu HaraYoshifumi InoueTomoyuki Goto
    • C08G77/06
    • C07F7/1804
    • An organosilicon compound represented by the following general formula (1): wherein R1 is a hydrogen atom, a phenyl group or a halogenated phenyl group; R2 is a hydrogen atom or a methyl group; R3's are each a substituted or unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms; X is a hydrolyzable group; Z1 is —R4—, —R4O— or —R4(CH3)2SiO—, where R4 is a substituted or unsubstituted divalent hydrocarbon group having 1 to 10 carbon atoms; Z2 is an oxygen atom or a substituted or unsubstituted divalent hydrocarbon group having 1 to 10 carbon atoms; and m is 0, 1 or 2 and n is 0, 1 or 2. When incorporated in silicone compositions, the organosilicon compound acts as a cross-linking agent having well-balanced photopolymerizability and condensation curability.
    • 由以下通式(1)表示的有机硅化合物:其中R 1是氢原子,苯基或卤代苯基; R 2是氢原子或甲基; R 3各自为取代或未取代的碳原子数为1〜10的一价烃基; X是可水解基团; Z 1是-R 4 - , - R 4 O-或-R 4(CH 3) 3 SiO 2,其中R 4是取代或未取代的具有1至10个碳原子的二价烃基; Z 2是氧原子或取代或未取代的碳原子数为1〜10的二价烃基; 并且m为0,1或2,n为0,1或2.当掺入有机硅组合物中时,有机硅化合物用作具有良好平衡光聚合性和缩合固化性的交联剂。
    • 6. 发明授权
    • Organosilicon compound
    • 有机硅化合物
    • US06849755B2
    • 2005-02-01
    • US09983933
    • 2001-10-26
    • Toshiyuki OzaiHiroyasu HaraYoshifumi InoueTomoyuki Goto
    • Toshiyuki OzaiHiroyasu HaraYoshifumi InoueTomoyuki Goto
    • C07F7/08C07F7/18C07F7/04
    • C07F7/1804
    • An organosilicon compound represented by the following general formula (1): wherein R1 is a hydrogen atom, a phenyl group or a halogenated phenyl group; R2 is a hydrogen atom or a methyl group; R3's are each a substituted or unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms; X is a hydrolyzable group; Z1 is —R4—, —R4O— or —R4(CH3)2SiO—, where R4 is a substituted or unsubstituted divalent hydrocarbon group having 1 to 10 carbon atoms; Z2 is an oxygen atom or a substituted or unsubstituted divalent hydrocarbon group having 1 to 10 carbon atoms; and m is 0, 1 or 2 and n is 0, 1 or 2. When incorporated in silicone compositions, the organosilicon compound acts as a cross-linking agent having well-balanced photopolymerizability and condensation curability.
    • 由以下通式(1)表示的有机硅化合物:其中R 1是氢原子,苯基或卤代苯基; R 2是氢原子或甲基; R 3各自为取代或未取代的碳原子数为1〜10的一价烃基; X是可水解基团; Z 1是-R 4 - ,-R 4 O-或-R 4(CH 3)2 SiO - ,其中R 4是具有1至10个碳原子的取代或未取代的二价烃基 ; Z 2是氧原子或具有1〜10个碳原子的取代或未取代的二价烃基; 并且m为0,1或2,n为0,1或2.当掺入有机硅组合物中时,有机硅化合物充当具有良好平衡的光聚合性和冷凝固化性的交联剂。
    • 8. 发明授权
    • Organopolysiloxane composition
    • 有机聚硅氧烷组合物
    • US06699918B2
    • 2004-03-02
    • US10067374
    • 2002-02-07
    • Toshiyuki OzaiTomoyuki GotoYoshifumi Inoue
    • Toshiyuki OzaiTomoyuki GotoYoshifumi Inoue
    • C08L8304
    • C09D183/04C08G77/12C08G77/18C08G77/20C08G77/24C08G77/50C08G77/70C08K5/5425C08L83/04C08L2666/28C09J183/04C08L2666/44
    • An organopolysiloxane composition is provided including: (A) an organopolysiloxane with hydroxyl groups at both terminals of the molecular chain; (B) an organosilicon compound represented by the general formula shown below: wherein, R2 represents a hydrogen atom, a phenyl group or a halogenated phenyl group, R3 represents a hydrogen atom or a methyl group, R4 represents a monovalent hydrocarbon group, X represents a hydrolysable group, Z1 represents —R5—, —R5O— or —R5(CH3)2SiO— (wherein R5 represents a bivalent hydrocarbon group), Z2 represents an oxygen atom or a bivalent hydrocarbon group, m represents 0, 1 or 2, and n represents 0, 1 or 2; (C) a condensation curing catalyst; and (D) a photopolymerization initiator. This composition has two curing mechanisms, namely photopolymerizability and condensation curability, and displays superior adhesiveness, and in particular displays favorable adhesiveness to a substrate immediately following irradiation with ultraviolet light.
    • 提供了一种有机聚硅氧烷组合物,其包括:(A)在分子链的两个末端具有羟基的有机聚硅氧烷; (B)由下述通式表示的有机硅化合物:其中,R 2表示氢原子,苯基或卤代苯基,R 3表示氢原子或甲基,R 4 >表示一价烃基,X表示可水解基团,Z 1表示-R 5 - ,-R 5 O-或-R 5(CH 3)2 SiO-(其中R 5表示 二价烃基),Z 2表示氧原子或二价烃基,m表示0,1或2,n表示0,1或2; (C)缩合固化催化剂; 和(D)光聚合引发剂。 该组合物具有两种固化机理,即光聚合性和缩合固化性,并且显示出优异的粘合性,特别是在用紫外线照射后,显示出对基材的良好的粘附性。
    • 10. 发明授权
    • Heat conductive silicone composition
    • 导热硅胶组合物
    • US07737212B2
    • 2010-06-15
    • US11439277
    • 2006-05-24
    • Toshiyuki OzaiNaoki Yamakawa
    • Toshiyuki OzaiNaoki Yamakawa
    • C08L83/04
    • C08L83/04C08G77/045C08G77/12C08G77/14C08G77/18C08G77/20C08L83/00
    • A heat conductive silicone composition is provided, which includes (A) an organopolysiloxane having the formula (1): {(CH2═CH)R12SiO1/2}L(R1SiO3/2)m(R12SiO)n{O1/2SiR12—R2—SiR1(3-a)(OR3)a}o  (1) wherein R1 represents monovalent hydrocarbon groups, R2 represents an oxygen atom or a bivalent hydrocarbon group, R3 represents an alkyl group, alkoxyalkyl group, alkenyl group, or acyl group, L and o represent numbers from 1 to 10, m represents a number from 0 to 10, n represents a number from 5 to 100, a represents an integer from 1 to 3, and when m=0, L+o=2 and R2 is a bivalent hydrocarbon group, (B) a heat conductive filler, and (C) an organopolysiloxane other than the component (A). Even upon high-level packing with the heat conductive filler to obtain a highly heat conductivity, the composition still exhibits favorable handling and moldability properties.
    • 提供了一种导热硅氧烷组合物,其包括(A)具有式(1)的有机聚硅氧烷:{(CH 2 = CH)R 12 SiO 1/2/2)L(R 1 SiO 3/2)m(R 12 SiO)n {O 1 / 2SiR 12 -R 2 - SiR1(3-a)(OR3)a} o(1)其中R1表示一价烃基,R2表示氧原子或二价烃基,R3表示烷基,烷氧基烷基,烯基或酰基,L o表示1〜10的数,m表示0〜10的数,n表示5〜100的数,a表示1〜3的整数,m = 0时,L + o = 2,R2表示 二价烃基,(B)导热性填料,(C)除(A)成分以外的有机聚硅氧烷。 即使使用导热填料进行高级包装以获得高导热性,组合物仍然表现出良好的处理和成型性能。