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1. 发明授权

US08144337B2 Inspecting method and inspecting apparatus for substrate surface 有权
标题翻译：基板表面检查方法及检查装置
公开(公告)号：US08144337B2
公开(公告)日：2012-03-27
申请号：US12470505
申请日：2009-05-22
申请人： Akira Hamamatsu , Yoshimasa Oshima , Shunji Maeda , Hisae Shibuya , Yuta Urano , Toshiyuki Nakao , Shigenobu Maruyama
发明人： Akira Hamamatsu , Yoshimasa Oshima , Shunji Maeda , Hisae Shibuya , Yuta Urano , Toshiyuki Nakao , Shigenobu Maruyama
IPC分类号： G01B11/30
CPC分类号： G01B11/303 , G01N21/47 , G01N21/94 , G01N21/9501
摘要： To inspect a substrate such as a semiconductor substrate for surface roughness at high precision.The surface roughness of the substrate is measured in each frequency band of the surface roughness by applying a light to the substrate surface and detecting a scattered light or reflected light at a plurality of azimuth or elevation angles.
摘要翻译：以高精度检查用于表面粗糙度的半导体基板等基板。通过向基板表面施加光并以多个方位角或仰角检测散射光或反射光，测量表面粗糙度的每个频带中的基板的表面粗糙度。

2. 发明申请

US20130107247A1 Inspecting Method and Inspecting Apparatus For Substrate Surface 有权
标题翻译：基板表面检查方法及检查装置
公开(公告)号：US20130107247A1
公开(公告)日：2013-05-02
申请号：US13672742
申请日：2012-11-09
申请人： Akira Hamamatsu , Yoshimasa Oshima , Shunji Maeda , Hisae Shibuya , Yuta Urano , Toshiyuki Nakao , Shigenobu Maruyama
发明人： Akira Hamamatsu , Yoshimasa Oshima , Shunji Maeda , Hisae Shibuya , Yuta Urano , Toshiyuki Nakao , Shigenobu Maruyama
IPC分类号： G01B11/30
CPC分类号： G01B11/303 , G01N21/47 , G01N21/94 , G01N21/9501
摘要： An inspecting method and apparatus for inspecting a substrate surface includes illuminating a light to the substrate surface having a film, detection of a scattered light or reflected light from a plurality of positions of the substrate surface to obtain a plurality of electrical signals, comparison of the plurality of electrical signals and a database which indicates a relationship between the electrical signals and surface roughness, and calculation of a surface roughness value based on the result of comparison.
摘要翻译：用于检查基板表面的检查方法和装置包括将光照射到具有膜的基板表面，从基板表面的多个位置检测散射光或反射光以获得多个电信号，多个电信号和指示电信号和表面粗糙度之间的关系的数据库，以及基于比较结果的表面粗糙度值的计算。

3. 发明授权

US08638429B2 Defect inspecting method and defect inspecting apparatus 失效
标题翻译：缺陷检查方法和缺陷检查装置
公开(公告)号：US08638429B2
公开(公告)日：2014-01-28
申请号：US13146428
申请日：2009-12-15
申请人： Toshiyuki Nakao , Shigenobu Maruyama , Akira Hamamatsu , Yuta Urano
发明人： Toshiyuki Nakao , Shigenobu Maruyama , Akira Hamamatsu , Yuta Urano
IPC分类号： G01N21/00 , G01J4/00
CPC分类号： G01N21/9501 , G01N21/8806 , G01N2021/8809 , G01N2021/8848 , H01L22/12
摘要： Provided are a defect inspecting method and a defect inspecting apparatus, wherein defect detecting sensitivity is improved and also haze measurement is performed using polarization detection, while suppressing damages to samples. The defect inspecting apparatus is provided with a light source which oscillates to a sample a laser beam having a wavelength band wherein a small energy is absorbed, and two independent detecting optical systems, i.e., a defect detecting optical system which detects defect scattered light generated by a defect, by radiating the laser beams oscillated by the light source, and a haze detecting optical system which detects roughness scattered light generated due to roughness of the wafer surface. Polarization detection is independently performed with respect to the scattered light detected by the two detecting optical systems, and based on the two different detection signals, defect determination and haze measurement are performed.
摘要翻译：提供了一种缺陷检查方法和缺陷检查装置，其中提高了缺陷检测灵敏度，并且在抑制对样本的损害的同时使用偏振检测进行雾度测量。缺陷检查装置具有向样品振荡的光源，其具有吸收小能量的波长带的激光束，以及两个独立的检测光学系统，即检测由通过照射由光源振荡的激光束的缺陷，以及检测由于晶片表面的粗糙度而产生的粗糙度散射光的雾度检测光学系统。相对于由两个检测光学系统检测的散射光独立地进行极化检测，并且基于两个不同的检测信号，执行缺陷确定和雾度测量。

4. 发明授权

US08310665B2 Inspecting method and inspecting apparatus for substrate surface 有权
标题翻译：基板表面检查方法及检查装置
公开(公告)号：US08310665B2
公开(公告)日：2012-11-13
申请号：US13404749
申请日：2012-02-24
申请人： Akira Hamamatsu , Yoshimasa Oshima , Shunji Maeda , Hisae Shibuya , Yuta Urano , Toshiyuki Nakao , Shigenobu Maruyama
发明人： Akira Hamamatsu , Yoshimasa Oshima , Shunji Maeda , Hisae Shibuya , Yuta Urano , Toshiyuki Nakao , Shigenobu Maruyama
IPC分类号： G01N21/00
CPC分类号： G01B11/303 , G01N21/47 , G01N21/94 , G01N21/9501
摘要： An inspecting method and apparatus for inspecting a substrate surface includes application of a light to the substrate surface, detection of scattered light or reflected light from the substrate surface due to the applied light at a plurality of positions to obtain a plurality of electrical signals, extraction of a signal in a mutually different frequency band from each of the plurality of electrical signals, and calculation of a value regarding a state of film of the substrate through an arithmetical operation process of a plurality of extracted signals in the frequency bands.
摘要翻译：用于检查基板表面的检查方法和装置包括：由于在多个位置处施加的光，向基板表面施加光，检测散射光或来自基板表面的反射光，以获得多个电信号，提取在与所述多个电信号中的每一个相互不同的频带中的信号的信号，以及通过所述频带中的多个提取的信号的算术运算处理来计算关于所述衬底的膜的状态的值。

5. 发明申请

US20120162665A1 Inspecting Method and Inspecting Apparatus for Substrate Surface 有权
标题翻译：基板表面检查方法及检查装置
公开(公告)号：US20120162665A1
公开(公告)日：2012-06-28
申请号：US13404749
申请日：2012-02-24
申请人： Akira Hamamatsu , Yoshimasa Oshima , Shunji Maeda , Hisae Shibuya , Yuta Urano , Toshiyuki Nakao , Shigenobu Maruyama
发明人： Akira Hamamatsu , Yoshimasa Oshima , Shunji Maeda , Hisae Shibuya , Yuta Urano , Toshiyuki Nakao , Shigenobu Maruyama
IPC分类号： G01B11/30
CPC分类号： G01B11/303 , G01N21/47 , G01N21/94 , G01N21/9501
摘要： An inspecting method and apparatus for inspecting a substrate surface includes application of a light to the substrate surface, detection of scattered light or reflected light from the substrate surface due to the applied light at a plurality of positions to obtain a plurality of electrical signals, extraction of a signal in a mutually different frequency band from each of the plurality of electrical signals, and calculation of a value regarding a state of film of the substrate through an arithmetical operation process of a plurality of extracted signals in the frequency bands.
摘要翻译：用于检查基板表面的检查方法和装置包括：由于在多个位置处施加的光，向基板表面施加光，检测散射光或来自基板表面的反射光，以获得多个电信号，提取在与所述多个电信号中的每一个相互不同的频带中的信号的信号，以及通过所述频带中的多个提取的信号的算术运算处理来计算关于所述衬底的膜的状态的值。

6. 发明授权

US08654350B2 Inspecting method and inspecting apparatus for substrate surface 有权
标题翻译：基板表面检查方法及检查装置
公开(公告)号：US08654350B2
公开(公告)日：2014-02-18
申请号：US13672742
申请日：2012-11-09
申请人： Akira Hamamatsu , Yoshimasa Oshima , Shunji Maeda , Hisae Shibuya , Yuta Urano , Toshiyuki Nakao , Shigenobu Maruyama
发明人： Akira Hamamatsu , Yoshimasa Oshima , Shunji Maeda , Hisae Shibuya , Yuta Urano , Toshiyuki Nakao , Shigenobu Maruyama
IPC分类号： G01B11/30
CPC分类号： G01B11/303 , G01N21/47 , G01N21/94 , G01N21/9501
摘要： An inspecting method and apparatus for inspecting a substrate surface includes illuminating a light to the substrate surface having a film, detection of a scattered light or reflected light from a plurality of positions of the substrate surface to obtain a plurality of electrical signals, comparison of the plurality of electrical signals and a database which indicates a relationship between the electrical signals and surface roughness, and calculation of a surface roughness value based on the result of comparison.
摘要翻译：用于检查基板表面的检查方法和装置包括将光照射到具有膜的基板表面，从基板表面的多个位置检测散射光或反射光以获得多个电信号，多个电信号和指示电信号和表面粗糙度之间的关系的数据库，以及基于比较结果的表面粗糙度值的计算。

7. 发明申请

US20120019835A1 DEFECT INSPECTING METHOD AND DEFECT INSPECTING APPARATUS 失效
标题翻译：缺陷检查方法和缺陷检查装置
公开(公告)号：US20120019835A1
公开(公告)日：2012-01-26
申请号：US13146428
申请日：2009-12-15
申请人： Toshiyuki Nakao , Shigenobu Maruyama , Akira Hamamatsu , Yuta Urano
发明人： Toshiyuki Nakao , Shigenobu Maruyama , Akira Hamamatsu , Yuta Urano
IPC分类号： G01B11/30 , G01N21/88
CPC分类号： G01N21/9501 , G01N21/8806 , G01N2021/8809 , G01N2021/8848 , H01L22/12
摘要： Provided are a defect inspecting method and a defect inspecting apparatus, wherein defect detecting sensitivity is improved and also haze measurement is performed using polarization detection, while suppressing damages to samples. The defect inspecting apparatus is provided with a light source which oscillates to a sample a laser beam having a wavelength band wherein a small energy is absorbed, and two independent detecting optical systems, i.e., a defect detecting optical system which detects defect scattered light generated by a defect, by radiating the laser beams oscillated by the light source, and a haze detecting optical system which detects roughness scattered light generated due to roughness of the wafer surface. Polarization detection is independently performed with respect to the scattered light detected by the two detecting optical systems, and based on the two different detection signals, defect determination and haze measurement are performed.
摘要翻译：提供了一种缺陷检查方法和缺陷检查装置，其中提高了缺陷检测灵敏度，并且在抑制对样本的损害的同时使用偏振检测来进行雾度测量。缺陷检查装置具有向样品振荡的光源，其具有吸收小能量的波长带的激光束，以及两个独立的检测光学系统，即检测由通过照射由光源振荡的激光束的缺陷，以及检测由于晶片表面的粗糙度而产生的粗糙度散射光的雾度检测光学系统。相对于由两个检测光学系统检测的散射光独立地进行极化检测，并且基于两个不同的检测信号，执行缺陷确定和雾度测量。

8. 发明授权

US08514388B2 Flaw inspecting method and device therefor 有权
标题翻译：缺陷检查方法及其装置
公开(公告)号：US08514388B2
公开(公告)日：2013-08-20
申请号：US13387120
申请日：2010-07-28
申请人： Shigenobu Maruyama , Toshifumi Honda , Toshiyuki Nakao , Yuta Urano
发明人： Shigenobu Maruyama , Toshifumi Honda , Toshiyuki Nakao , Yuta Urano
IPC分类号： G01N21/95
CPC分类号： G01N21/9501 , G01N21/47
摘要： In order to maximize the effect of signal addition during inspection of foreign substances in wafers, a device structure including line sensors arranged in plural directions is effective. Low-angle detection optical systems that detect light beams in plural azimuth directions, the light beams being scattered in low angle directions among those scattered from a linear area on a sample illuminated by illuminating means, each include a combination of a first imaging lens group (330) and a diffraction grating (340) and a combination of a second imaging lens group (333) and an image detector (350) having a plurality of light receiving surfaces. A signal processing unit processes signals from the image detectors of the low-angle detection optical systems by adding the signals from the light receiving surfaces corresponding between the image detectors.
摘要翻译：为了最大限度地发挥在晶片中异物检查期间信号增加的效果，包括沿多个方向布置的线传感器的装置结构是有效的。检测在多个方位方向上的光束的低角度检测光学系统，所述光束在从由照明装置照射的样品上的线性区域散射的那些中以低角度方向散射，各自包括第一成像透镜组（ 330）和衍射光栅（340）以及具有多个光接收表面的第二成像透镜组（333）和图像检测器（350）的组合。信号处理单元通过将来自相应于图像检测器之间的光接收表面的信号相加来处理来自低角度检测光学系统的图像检测器的信号。

9. 发明授权

US08804110B2 Fault inspection device and fault inspection method 有权
标题翻译：故障检查装置及故障检查方法
公开(公告)号：US08804110B2
公开(公告)日：2014-08-12
申请号：US13703414
申请日：2011-05-20
申请人： Yuta Urano , Shigenobu Maruyama , Toshiyuki Nakao , Toshifumi Honda , Yukihiro Shibata
发明人： Yuta Urano , Shigenobu Maruyama , Toshiyuki Nakao , Toshifumi Honda , Yukihiro Shibata
IPC分类号： G01N21/00 , G01N21/95 , G01N21/94 , G01N21/956
CPC分类号： G01N21/94 , G01N21/47 , G01N21/8806 , G01N21/9501 , G01N21/956 , G01N2021/4711 , G01N2021/8867 , G01N2021/8874 , G01N2201/0806 , G01N2201/10
摘要： Proposed is a defect inspection method whereby: illuminating light having a substantially uniform illumination intensity distribution in one direction of a sample surface irradiated on the sample surface; multiple scattered light components, which are output in multiple independent directions, are detected among the scattered light from the sample surface and multiple corresponding scattered light detection signals are obtained; at least one of the multiple scattered light detection signals is processed and the presence of defects is determined; at least one of the multiple scattered light detection signals that correspond to each of the points determined by the processing as a defect is processed and the dimensions of the defect are determined; and the position and dimensions of the defect on the sample surface, at each of the points determined as a defect, are displayed.
摘要翻译：提出了一种缺陷检查方法，其中：照射在样品表面上的样品表面的一个方向具有基本上均匀的照明强度分布的光; 在来自样品表面的散射光中检测多个独立方向输出的多个散射光分量，并获得多个相应的散射光检测信号; 处理多个散射光检测信号中的至少一个并确定缺陷的存在; 处理与通过处理确定的每个点对应的多个散射光检测信号中的至少一个作为缺陷，并确定缺陷的尺寸; 并且显示在被确定为缺陷的每个点处的样品表面上的缺陷的位置和尺寸。

10. 发明授权

US08599369B2 Defect inspection device and inspection method 有权
标题翻译：缺陷检查装置及检验方法
公开(公告)号：US08599369B2
公开(公告)日：2013-12-03
申请号：US13378418
申请日：2010-06-09
申请人： Yuta Urano , Shigenobu Maruyama , Toshiyuki Nakao , Toshifumi Honda
发明人： Yuta Urano , Shigenobu Maruyama , Toshiyuki Nakao , Toshifumi Honda
IPC分类号： G01N21/47 , G01N21/55
CPC分类号： G01N21/9501 , G01N2021/8861 , G01N2021/8874
摘要： A defect inspection method wherein illumination light having a substantially uniform illumination intensity distribution in a certain direction on the surface of a specimen is radiated onto the surface of the specimen; wherein multiple components of those scattered light beams from the surface of the specimen which are emitted mutually different directions are detected, thereby obtaining corresponding multiple scattered light beam detection signals; wherein the multiple scattered light beam detection signals is subjected to processing, thereby determining the presence of defects; wherein the corresponding multiple scattered light detecting signals is processed with respect to all of the spots determined to be defective by the processing, thereby determining the sizes of defects; and wherein the defect locations on the specimen and the defect sizes are displayed with respect to all of the spots determined to be defective by the processing.
摘要翻译：一种缺陷检查方法，其中将在试样表面上沿某一方向具有基本均匀的照明强度分布的照明光辐射到样品的表面上; 其中检测出来自样本表面的这些散射光束相互不同方向发射的多个分量，从而获得相应的多个散射光束检测信号; 其中对所述多个散射光束检测信号进行处理，由此确定缺陷的存在; 其中相应的多个散射光检测信号相对于通过处理确定为有缺陷的所有点进行处理，从而确定缺陷的尺寸; 并且其中相对于通过处理确定为有缺陷的所有点显示样本上的缺陷位置和缺陷尺寸。

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