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    • 9. 发明授权
    • Photoelectric conversion device
    • 光电转换装置
    • US4256513A
    • 1981-03-17
    • US85205
    • 1979-10-16
    • Manabu YoshidaJun FukuchiShigetoshi Takayanagi
    • Manabu YoshidaJun FukuchiShigetoshi Takayanagi
    • H01L31/0224H01L31/00
    • H01L31/022425Y02E10/50
    • A photoelectric conversion device such as a solar cell in which electrodes formed from a conductive paste make ohmic contact with the surfaces of impurity diffused layers respectively formed in a semiconductor substrate. The conductive paste contains ultrafine particles of silver and gold as its principal solid components. The conductive paste further contains, as its additional principal solid components, ultrafine particles of a metal having a eutectic temperature lower than that of silver when alloyed with the semiconductor and a powdery glass material not containing any lead oxide glass component. The electrodes provided by the conductive paste exhibit excellent electrical properties when the conductive paste is subjected to firing treatment at a temperature of about 600.degree. C. Thus, when, for example, the semiconductor substrate is of n-type silicon and a p.sup.+ -type diffused layer is formed in one of its major surfaces to form a p.sup.+ /n junction of relatively small depth, the electrode making ohmic contact with the p.sup.+ -type diffused layer does not penetrate through the p.sup.+ /n junction and has a low contact resistance. The photoelectric conversion device such as the solar cell thus obtained can operate with a higher conversion efficiency than hitherto and can be manufactured at a lower cost than hitherto.
    • 诸如太阳能电池的光电转换装置,其中由导电浆料形成的电极与分别形成在半导体衬底中的杂质扩散层的表面欧姆接触。 导电浆料含有银和金的超细颗粒作为其主要固体成分。 作为其附加的主要固体成分,导电性糊料还含有与半导体合金化时共晶温度低于银的金属的超微粒子,以及不含有氧化铅玻璃成分的粉末状玻璃材料。 当导电浆料在约600℃的温度下进行焙烧处理时,由导电膏提供的电极表现出优异的电性能。因此,当例如半导体衬底是n型硅和p +型 扩散层形成在其一个主表面中以形成相对较小深度的p + / n结,与p +型扩散层欧姆接触的电极不穿透p + / n结并且具有低接触电阻。 由此获得的太阳能电池等光电转换装置能够以比以往更高的转换效率进行运转,并且可以以比迄今为止更低的成本制造。
    • 10. 发明授权
    • Conductive substrate and process for producing same
    • 导电基材及其制造方法
    • US08927054B2
    • 2015-01-06
    • US13503632
    • 2010-11-18
    • Manabu YoshidaToshihide Kamata
    • Manabu YoshidaToshihide Kamata
    • H05K1/03H05K3/00H05K3/12
    • H05K3/1283H05K2203/0143H05K2203/0271H05K2203/0278
    • Provided are a conductive substrate which can be produced from inexpensive materials at a lower temperature than those for conventional substrates, and a process for producing the conductive substrate. The conductive substrate comprises a substrate (1) and a conductive pattern (5) provided on the substrate (1), wherein the conductive pattern (5), except on a surface and in a vicinity thereof on a side opposite to the substrate side, entirely has a structure comprising a binder (2) and fine aluminum grains (3) dispersed therein, and on the surface and in the vicinity a surface metal aluminum layer (4) is formed in which the fine aluminum grains (3) are spread with a roller to form a conductive junction connecting the fine aluminum grains to each other.
    • 提供一种导电基板,其可以在比常规基板低的温度下由便宜的材料制造,以及制造导电基板的方法。 导电性基板包括基板(1)和设置在基板(1)上的导电图案(5),其中除了基板侧的相反一侧的表面及其附近,导电图案(5) 完全具有包含粘合剂(2)和分散在其中的细铝颗粒(3)的结构,并且在表面和附近形成表面金属铝层(4),其中细铝颗粒(3)与 一个辊,以形成将细铝颗粒彼此连接的导电结。