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1. 发明授权

US5030373A Surface-treating agents for copper and copper alloy 失效
标题翻译：铜和铜合金表面处理剂
公开(公告)号：US5030373A
公开(公告)日：1991-07-09
申请号：US490719
申请日：1990-03-08
申请人： Toshiya Kimura , Koichi Wakashima , Hidebumi Ohnuki , Shigeki Nakajima , Katsutoshi Itani , Akira Hirai
发明人： Toshiya Kimura , Koichi Wakashima , Hidebumi Ohnuki , Shigeki Nakajima , Katsutoshi Itani , Akira Hirai
IPC分类号： C23F1/18 , C23F3/06 , C23G1/10 , H05K3/26 , H05K3/28
CPC分类号： H05K3/282 , C23F1/18 , C23F3/06 , C23G1/103
摘要： An aqueous solution containing 0.1 g/l or more of piperidine or a derivative, 100-500 g/l of sulfuric acid, 10-50 g/l of hydrogen peroxide and 0.5 g/l or more of phosphoric acid is used for treating the surface of copper or copper alloy used in manufacturing of printed circuit.

2. 发明授权

US4668332A Method of making multi-layer printed wiring boards 失效
标题翻译：制作多层印刷电路板的方法
公开(公告)号：US4668332A
公开(公告)日：1987-05-26
申请号：US727634
申请日：1985-04-26
申请人： Hidebumi Ohnuki , Toshiaki Asano , Takashi Atarashi , Sunao Yasui
发明人： Hidebumi Ohnuki , Toshiaki Asano , Takashi Atarashi , Sunao Yasui
IPC分类号： H05K1/02 , H05K3/42 , H05K3/44 , H05K3/46 , C23F1/02 , B44C1/22 , C03C15/00 , C03C25/06
CPC分类号： H05K3/4641 , H05K1/0219 , H05K2201/09536 , H05K2201/09745 , H05K2203/0369 , H05K3/429 , H05K3/44 , H05K3/4611 , H05K3/4623 , Y10T29/49155 , Y10T29/49165
摘要： A multi-layer printed wiring board in which an internal board has a wiring pattern on both sides. Two conductive plates for establishing respective voltage planes are formed with a pattern of grooves to match the wiring pattern of the internal board. The internal board is then sandwiched to the two sides of the conductive plates, with the grooves registering with the wiring pattern, and with intermediate insulating layers. Further, insulated wiring patterns are formed on the exterior sides of the conductive plates together with through-holes through the assembly.
摘要翻译：一种多层印刷电路板，其中内部板在两侧具有布线图案。用于建立各个电压平面的两个导电板形成有凹槽的图案以匹配内部板的布线图案。然后将内部板夹在导电板的两侧，其中凹槽与布线图案对准，并具有中间绝缘层。此外，绝缘布线图案与通孔一起形成在导电板的外侧上。

3. 发明授权

US5218761A Process for manufacturing printed wiring boards 失效
标题翻译：印刷线路板制造工艺
公开(公告)号：US5218761A
公开(公告)日：1993-06-15
申请号：US865215
申请日：1992-04-08
申请人： Ryo Maniwa , Hidebumi Ohnuki
发明人： Ryo Maniwa , Hidebumi Ohnuki
IPC分类号： H05K3/42 , H05K3/46
CPC分类号： H05K3/4623 , H05K3/428 , H05K3/429 , H05K2201/09536 , H05K2201/09736 , H05K2203/0542 , H05K2203/0793 , H05K3/4611 , Y10S428/901 , Y10T29/49165
摘要： A laminated board in which each of prepreg sheets is sandwiched between an internal printed wiring board which is provided with wirings and each of external printed wiring board which is provided with wirings on the outermost surface thereof is formed with through-holes by drilling. A thin copper plating layer is formed on the surfaces of the laminated board including the inner wall of the through-hole. Then, an alkali-soluble photoresist film is selectively formed on the surface of the thin copper plating layer and a thick copper plating layer is formed. The thin copper plating layer is removed by using the thick copper plating layer as a mask to forme through holes and wirings. The through holes and wirings can be thus formed without using the additive process. Environmental pollution due to use of organic solvents can be prevented by avoiding the use of an organic solvent-soluble resist film having a strong resistance to alkalis.
摘要翻译：在其中每个预浸料片被夹在设置有布线的内部印刷线路板和在其最外表面上设置有布线的每个外部印刷线路板之间的每个预浸料片通过钻孔形成有通孔。在包括通孔的内壁的层压板的表面上形成薄的镀铜层。然后，在薄铜镀层的表面上选择性地形成碱溶性光致抗蚀剂膜，形成厚铜镀层。通过使用厚铜镀层作为掩模去除薄铜镀层，以形成通孔和配线。因此，可以不使用添加剂来形成通孔和布线。通过避免使用耐碱性强的有机溶剂可溶性抗蚀剂膜，可以防止使用有机溶剂造成的环境污染。

4. 发明授权

US5455393A Multilayered printed wiring board and method of manufacturing the same 失效
标题翻译：多层印刷线路板及其制造方法
公开(公告)号：US5455393A
公开(公告)日：1995-10-03
申请号：US159234
申请日：1993-11-30
申请人： Tutomu Ohshima , Hidebumi Ohnuki , Ryo Maniwa
发明人： Tutomu Ohshima , Hidebumi Ohnuki , Ryo Maniwa
IPC分类号： H05K3/34 , H05K1/02 , H05K1/11 , H05K3/00 , H05K3/46 , H05K1/00
CPC分类号： H05K1/0221 , H05K1/112 , H05K3/465 , H05K2201/09472 , H05K2201/09509 , H05K2201/09745 , H05K2203/0733 , H05K3/0023 , H05K3/3468 , Y10T29/49155 , Y10T29/49165
摘要： A multilayered printed wiring board includes a plurality of inner layer circuits, ground layers, first insulating layers, a second insulating layer, a surface layer circuit, and a parts mounting pad. The inner layer circuits are arranged parallel to each other in a flat manner in at least one inner layer. The ground layers are formed on and under the inner layer circuits to sandwich the inner layer circuits. The first insulating layers are respectively formed between the ground layers and the inner layer circuits to insulate the inner layer circuits from each other and the inner layer circuits from the ground layers. The second insulating layer is formed at least on an uppermost one of the ground layers and serving as a surface layer. The surface layer circuit is selectively formed on the second insulating layer. The parts mounting pad is formed at a predetermined region on the second insulating layer, has a recessed portion for fitting a lead portion of a mounting part therein, and is connected to the surface layer circuit. A method of manufacturing this printed wiring board is also disclosed.
摘要翻译：多层印刷电路板包括多个内层电路，接地层，第一绝缘层，第二绝缘层，表面层电路和部件安装焊盘。内层电路在至少一个内层中以平坦的方式彼此平行地布置。接地层形成在内层电路之上和之下，以夹住内层电路。第一绝缘层分别形成在接地层和内层电路之间，以使内层电路彼此隔离，内层电路与接地层绝缘。第二绝缘层至少形成在最上层的一层接地层中并用作表面层。表层电路选择性地形成在第二绝缘层上。零件安装垫形成在第二绝缘层上的预定区域，具有用于将安装部件的引线部分嵌入其中的凹部，并连接到表面层电路。还公开了制造该印刷线路板的方法。

5. 发明授权

US5526564A Method of manufacturing a multilayered printed wiring board 失效
标题翻译：制造多层印刷线路板的方法
公开(公告)号：US5526564A
公开(公告)日：1996-06-18
申请号：US459781
申请日：1995-06-02
申请人： Tutomu Ohshima , Hidebumi Ohnuki , Ryo Maniwa
发明人： Tutomu Ohshima , Hidebumi Ohnuki , Ryo Maniwa
IPC分类号： H05K3/34 , H05K1/02 , H05K1/11 , H05K3/00 , H05K3/46 , H01K3/10
CPC分类号： H05K1/0221 , H05K1/112 , H05K3/465 , H05K2201/09472 , H05K2201/09509 , H05K2201/09745 , H05K2203/0733 , H05K3/0023 , H05K3/3468 , Y10T29/49155 , Y10T29/49165
摘要： A multilayered printed wiring board includes a plurality of inner layer circuits, ground layers, first insulating layers, a second insulating layer, a surface layer circuit, and a parts mounting pad. The inner layer circuits are arranged parallel to each other in a flat manner in at least one inner layer. The ground layers are formed on and under the inner layer circuits to sandwich the inner layer circuits. The first insulating layers are respectively formed between the ground layers and the inner layer circuits to insulate the inner layer circuits from each other and the inner layer circuits from the ground layers. The second insulating layer is formed at least on an uppermost one of the ground layers and serving as a surface layer. The surface layer circuit is selectively formed on the second insulating layer. The parts mounting pad is formed at a predetermined region on the second insulating layer, has a recessed portion for fitting a lead portion of a mounting part therein, and is connected to the surface layer circuit. A method of manufacturing this printed wiring board is also disclosed.
摘要翻译：多层印刷电路板包括多个内层电路，接地层，第一绝缘层，第二绝缘层，表面层电路和部件安装焊盘。内层电路在至少一个内层中以平坦的方式彼此平行地布置。接地层形成在内层电路之上和之下，以夹住内层电路。第一绝缘层分别形成在接地层和内层电路之间，以使内层电路彼此隔离，内层电路与接地层绝缘。第二绝缘层至少形成在最上层的一层接地层中并用作表面层。表层电路选择性地形成在第二绝缘层上。零件安装垫形成在第二绝缘层上的预定区域，具有用于将安装部件的引线部分嵌入其中的凹部，并连接到表面层电路。还公开了制造该印刷线路板的方法。

6. 发明授权

US5480675A Method of and apparatus for plating printed circuit board 失效
标题翻译：印刷电路板电镀方法和装置
公开(公告)号：US5480675A
公开(公告)日：1996-01-02
申请号：US209606
申请日：1994-03-10
申请人： Tomoo Murakami , Hidebumi Ohnuki , Takanori Tsunoda , Ryo Maniwa
发明人： Tomoo Murakami , Hidebumi Ohnuki , Takanori Tsunoda , Ryo Maniwa
IPC分类号： C23C18/31 , C23C18/38 , C25D21/04 , C25D21/10 , H05K3/00 , H05K3/18 , H05K3/24 , B05D5/12
CPC分类号： C25D21/04 , C25D17/001 , C25D21/10 , C25D5/003 , C25D5/20 , C25D7/123 , H05K3/0088 , H05K3/241
摘要： An apparatus for plating a printed circuit board including a non-through hole for connecting between a surface conductive layer and an interlayer wiring layer has a jig, a vessel, a supporting body carrying the jig for causing it to vibrate and swing in a plating liquid contained in the vessel, and a vacuum pump connected to the vessel for exhausting the air in the vessel thereby enhancing removal of bubbles in the non-through hole. A method of plating a printed circuit board includes the step of reducing the pressure inside the vessel simultaneously with the printed circuit board being subjected to the vibration and swinging actions thereby to remove a bubble existing inside the non-through hole. The removal of the bubble makes it possible to have a uniform plating film formed in an inner wall of the non-through hole and ensures the reliable electric connection to be established through the non-through hole between a surface conductive layer and interlayer conductive layers.
摘要翻译：一种用于电镀包括用于连接表面导电层和层间布线层的非通孔的印刷电路板的装置具有夹具，容器，承载夹具的支撑体，使其在镀液中振动和摆动容纳在容器中的真空泵和连接到容器的真空泵，用于排出容器中的空气，从而增强了非通孔中气泡的去除。电镀印刷电路板的方法包括与承受振动和摆动作用的印刷电路板同时降低容器内的压力的步骤，从而去除存在于非通孔内的气泡。去除气泡使得可以在非通孔的内壁中形成均匀的镀膜，并且通过表面导电层和层间导电层之间的非贯通孔确保可靠的电连接。

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