专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US5526564A Method of manufacturing a multilayered printed wiring board 失效
标题翻译：制造多层印刷线路板的方法
公开(公告)号：US5526564A
公开(公告)日：1996-06-18
申请号：US459781
申请日：1995-06-02
申请人： Tutomu Ohshima , Hidebumi Ohnuki , Ryo Maniwa
发明人： Tutomu Ohshima , Hidebumi Ohnuki , Ryo Maniwa
IPC分类号： H05K3/34 , H05K1/02 , H05K1/11 , H05K3/00 , H05K3/46 , H01K3/10
CPC分类号： H05K1/0221 , H05K1/112 , H05K3/465 , H05K2201/09472 , H05K2201/09509 , H05K2201/09745 , H05K2203/0733 , H05K3/0023 , H05K3/3468 , Y10T29/49155 , Y10T29/49165
摘要： A multilayered printed wiring board includes a plurality of inner layer circuits, ground layers, first insulating layers, a second insulating layer, a surface layer circuit, and a parts mounting pad. The inner layer circuits are arranged parallel to each other in a flat manner in at least one inner layer. The ground layers are formed on and under the inner layer circuits to sandwich the inner layer circuits. The first insulating layers are respectively formed between the ground layers and the inner layer circuits to insulate the inner layer circuits from each other and the inner layer circuits from the ground layers. The second insulating layer is formed at least on an uppermost one of the ground layers and serving as a surface layer. The surface layer circuit is selectively formed on the second insulating layer. The parts mounting pad is formed at a predetermined region on the second insulating layer, has a recessed portion for fitting a lead portion of a mounting part therein, and is connected to the surface layer circuit. A method of manufacturing this printed wiring board is also disclosed.
摘要翻译：多层印刷电路板包括多个内层电路，接地层，第一绝缘层，第二绝缘层，表面层电路和部件安装焊盘。内层电路在至少一个内层中以平坦的方式彼此平行地布置。接地层形成在内层电路之上和之下，以夹住内层电路。第一绝缘层分别形成在接地层和内层电路之间，以使内层电路彼此隔离，内层电路与接地层绝缘。第二绝缘层至少形成在最上层的一层接地层中并用作表面层。表层电路选择性地形成在第二绝缘层上。零件安装垫形成在第二绝缘层上的预定区域，具有用于将安装部件的引线部分嵌入其中的凹部，并连接到表面层电路。还公开了制造该印刷线路板的方法。

2. 发明授权

US5455393A Multilayered printed wiring board and method of manufacturing the same 失效
标题翻译：多层印刷线路板及其制造方法
公开(公告)号：US5455393A
公开(公告)日：1995-10-03
申请号：US159234
申请日：1993-11-30
申请人： Tutomu Ohshima , Hidebumi Ohnuki , Ryo Maniwa
发明人： Tutomu Ohshima , Hidebumi Ohnuki , Ryo Maniwa
IPC分类号： H05K3/34 , H05K1/02 , H05K1/11 , H05K3/00 , H05K3/46 , H05K1/00
CPC分类号： H05K1/0221 , H05K1/112 , H05K3/465 , H05K2201/09472 , H05K2201/09509 , H05K2201/09745 , H05K2203/0733 , H05K3/0023 , H05K3/3468 , Y10T29/49155 , Y10T29/49165
摘要： A multilayered printed wiring board includes a plurality of inner layer circuits, ground layers, first insulating layers, a second insulating layer, a surface layer circuit, and a parts mounting pad. The inner layer circuits are arranged parallel to each other in a flat manner in at least one inner layer. The ground layers are formed on and under the inner layer circuits to sandwich the inner layer circuits. The first insulating layers are respectively formed between the ground layers and the inner layer circuits to insulate the inner layer circuits from each other and the inner layer circuits from the ground layers. The second insulating layer is formed at least on an uppermost one of the ground layers and serving as a surface layer. The surface layer circuit is selectively formed on the second insulating layer. The parts mounting pad is formed at a predetermined region on the second insulating layer, has a recessed portion for fitting a lead portion of a mounting part therein, and is connected to the surface layer circuit. A method of manufacturing this printed wiring board is also disclosed.
摘要翻译：多层印刷电路板包括多个内层电路，接地层，第一绝缘层，第二绝缘层，表面层电路和部件安装焊盘。内层电路在至少一个内层中以平坦的方式彼此平行地布置。接地层形成在内层电路之上和之下，以夹住内层电路。第一绝缘层分别形成在接地层和内层电路之间，以使内层电路彼此隔离，内层电路与接地层绝缘。第二绝缘层至少形成在最上层的一层接地层中并用作表面层。表层电路选择性地形成在第二绝缘层上。零件安装垫形成在第二绝缘层上的预定区域，具有用于将安装部件的引线部分嵌入其中的凹部，并连接到表面层电路。还公开了制造该印刷线路板的方法。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式