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    • 2. 发明申请
    • METHOD AND APPARATUS FOR APPLYING COATING SOLUTION, AND METHOD FOR MANUFACTURING COATED PRODUCT
    • 用于涂覆溶液的方法和装置,以及制造涂覆产品的方法
    • US20130243957A1
    • 2013-09-19
    • US13989189
    • 2011-11-24
    • Toshitsugu HosokawaKeiichi OkamotoSatoru Yamamoto
    • Toshitsugu HosokawaKeiichi OkamotoSatoru Yamamoto
    • B05C3/18
    • B05C3/18B05C5/0254B05D1/26B05D2252/02
    • The invention is a method, an apparatus, and a coated product-manufacturing method each capable of applying a coating solution to a flexible backing sheet using a die coater while preventing contaminants from forming defects. A virtual line L is drawn to pass through the discharge port 74 of the die coater 7 and to extend perpendicular to the backing sheet 1, the distance D1 between a starting line P1 and a boundary line P2 is 50 mm or less, wherein the starting line P1 is defined as a line intersecting with the virtual line L on the second surface of the backing sheet 1, and the boundary line P2 is defined as a line at a boundary where the second surface of the backing sheet 1 begins to separate, upstream of the starting line P1, from the outer surface of the backup roller 8 as the backup roller 8 rotates, and the distance between the starting line P1 and a line on the roller P3 is 5 μm or more, wherein the line on the roller P3 is defined as a line intersecting with the virtual line L on the outer surface of the backup roller 8.
    • 本发明是一种方法,设备和涂覆产品的制造方法,其各自能够使用模涂机将涂布溶液施加到柔性背衬片上,同时防止污染物形成缺陷。 虚拟线L被拉出以通过模涂机7的排出口74并且垂直于背衬片1延伸,起始线P1和边界线P2之间的距离D1为50mm或更小,其中起始 线P1被定义为与背衬片1的第二表面上的虚拟线L相交的线,并且边界线P2被定义为在背衬片1的第二表面开始分离的边界处的线,上游 作为支承辊8的支承辊8的外表面,起始线P1与辊P3之间的距离为5um以上,辊P3上的线 被定义为与支撑辊8的外表面上的虚拟线L相交的线。
    • 5. 发明授权
    • Image forming apparatus
    • 图像形成装置
    • US08503013B2
    • 2013-08-06
    • US12724690
    • 2010-03-16
    • Hirotaka SekiShigeo HataAtsushi OtaniAkihiko SakaiShoji TakedaSatoru YamamotoKeita Takahashi
    • Hirotaka SekiShigeo HataAtsushi OtaniAkihiko SakaiShoji TakedaSatoru YamamotoKeita Takahashi
    • G06F3/12G06K15/00
    • H04N1/00952G03G15/50H04N1/295H04N2201/0082
    • There is provided an image forming apparatus which adopts a distributed control system and suppresses generation of radiation noise without increasing the cost. To accomplish this, the image forming apparatus includes a master control unit that controls the overall image forming apparatus, a plurality of sub-master control units that control a plurality of functions for performing image formation, and a plurality of salve control units that control loads for implementing a plurality of functions. The image forming apparatus performs distributed control. The image forming apparatus determines the operating frequencies of the salve control units in accordance with loads controlled by the salve control units. The image forming apparatus compares the operating frequencies of the slave control units. Based on the comparison result, the image forming apparatus changes the operating frequency of a slave control unit that is equal to the operating frequency of another slave control unit.
    • 提供了一种图像形成装置,其采用分布式控制系统,并且抑制辐射噪声的产生而不增加成本。 为了实现这一点,图像形成装置包括控制整个图像形成装置的主控制单元,控制用于执行图像形成的多个功能的多个子主控制单元和控制负载的多个控制单元 用于实现多个功能。 图像形成装置执行分布式控制。 图像形成装置根据由药物控制单元控制的负荷来确定药膏控制单元的操作频率。 图像形成装置比较从属控制单元的工作频率。 基于比较结果,图像形成装置改变从控制单元的操作频率等于另一个从控制单元的工作频率。
    • 9. 发明授权
    • Electroplating apparatus and electroplating method
    • 电镀设备和电镀方法
    • US08029653B2
    • 2011-10-04
    • US11708548
    • 2007-02-21
    • Satoru YamamotoKeiichi KurashinaTakashi KawakamiTsutomu NakadaHiroyuki KandaJunji KunisawaKunihito Ide
    • Satoru YamamotoKeiichi KurashinaTakashi KawakamiTsutomu NakadaHiroyuki KandaJunji KunisawaKunihito Ide
    • C25D17/00
    • C25D17/001C25D5/18C25D7/123C25D17/004C25D17/008C25D17/12H01L21/6723
    • An electroplating apparatus can form a plated film having a more uniform thickness and good film quality over an entire surface of a substrate having a conductive layer (seed layer) whose resistivity is equal to or higher than that of copper. The electroplating apparatus includes: a substrate holder for holding a substrate; a sealing member for contact with a peripheral portion of a surface of a substrate, held by the substrate holder, to seal the peripheral portion; a cathode contact for contact with a conductive layer formed in the surface of the substrate, held by the substrate holder, to feed electricity to the conductive layer; and a housing having therein an anode to be immersed in a plating solution, and a porous structure disposed at an open end facing the substrate held by the substrate holder, said porous structure defining a plating chamber in the housing; wherein the plating chamber is divided into rooms by a partition plate and the porous structure, and the anode is comprised of a plurality of divided anodes, each divided anode being disposed in each room of the plating chamber so that each divided anode can pass an independent plating current.
    • 电镀装置可以在具有等于或高于铜的导电层(种子层)的基板的整个表面上形成具有更均匀的厚度和更好的膜质量的镀膜。 电镀装置包括:用于保持基板的基板保持件; 密封构件,其与由所述基板保持件保持的基板的表面的周边部接触,以密封所述周边部; 阴极接触件,用于与由衬底保持器保持的衬底表面中形成的导电层接触,以将电力馈送到导电层; 以及壳体,其中具有要浸入电镀溶液中的阳极,以及设置在面向由所述基板保持件保持的所述基板的开口端的多孔结构,所述多孔结构在所述壳体中限定电镀室; 其特征在于,通过分隔板和多孔结构将电镀室分为室,阳极由多个分开的阳极组成,每个分隔的阳极设置在电镀室的每个房间中,使得每个分隔的阳极可以通过独立的 电镀电流。