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1. 发明授权

US4600685A Patterning process using ladder-type organosiloxane resin and process for production of electronic devices utilizing said patterning process 失效
标题翻译：使用梯型有机硅氧烷树脂的图案化工艺和利用所述图案化工艺生产电子器件的方法
公开(公告)号：US4600685A
公开(公告)日：1986-07-15
申请号：US738891
申请日：1985-05-29
申请人： Toshisuke Kitakohji , Shiro Takeda , Minoru Nakajima , Hiroshi Tokunaga
发明人： Toshisuke Kitakohji , Shiro Takeda , Minoru Nakajima , Hiroshi Tokunaga
IPC分类号： G03F7/004 , G03F7/038 , G03F7/075 , H01L21/312 , G03C5/00
CPC分类号： H01L21/02137 , G03F7/0757 , H01L21/02282 , H01L21/02348 , H01L21/02351 , H01L21/3122
摘要： A patterning process is provided wherein a material to be etched is coated with a ladder type organosiloxane resin, the coated resin is irradiated with energy rays according to a desired pattern, the irradiated resin is subjected to a development treatment, and then, the material is etched by using the resin left after the development as a mask. The ladder type organosiloxane resin used is represented by the formula: ##STR1## wherein each R.sub.1 is independently selected from alkyl (Cl-6) groups, and phenyl and halophenyl groups, R.sub.2, R.sub.3, R.sub.4 and R.sub.5 are independently selected from hydrogen, alkoxy (Cl-3) groups, a hydroxyl group and alkyl (Cl-3) groups, and n is a number giving a Mw of about 1,000 to about 1,000,000. The patterning process can be advantageously employed for the production of electronic devices.
摘要翻译：提供了一种图案化工艺，其中待蚀刻的材料涂覆有梯形有机硅氧烷树脂，涂覆的树脂根据期望的图案用能量射线照射，照射的树脂经受显影处理，然后材料是通过使用在显影后留下的树脂作为掩模进行蚀刻。使用的梯型有机硅氧烷树脂由下式表示：其中每个R 1独立地选自烷基（C 1-6）基团，苯基和卤代苯基，R 2，R 3，R 4和R 5独立地选自氢，烷氧基（C1-3）基团，羟基和烷基（C1-3）基团，n是Mw为约1,000至约1,000,000的数。图案化工艺可以有利地用于生产电子设备。

2. 发明授权

US4349609A Electronic device having multilayer wiring structure 失效
标题翻译：具有多层布线结构的电子设备
公开(公告)号：US4349609A
公开(公告)日：1982-09-14
申请号：US161561
申请日：1980-06-20
申请人： Shiro Takeda , Minoru Nakajima
发明人： Shiro Takeda , Minoru Nakajima
IPC分类号： H01F10/30 , H01L21/312 , H01L21/768 , H01L23/29 , H01L23/532 , B32B17/06
CPC分类号： H01L21/02126 , H01F10/30 , H01L21/02137 , H01L21/02186 , H01L21/022 , H01L21/02216 , H01L21/02282 , H01L21/3122 , H01L21/76801 , H01L21/76829 , H01L21/76834 , H01L23/296 , H01L23/5329 , H01L2924/0002 , H01L2924/12044 , Y10T428/31612 , Y10T428/31663
摘要： An improved electronic device having a multilayer wiring structure. An interlayer insulation layer or at least one of plural interlayer insulation layers, formed between metal wiring layers, is comprised of a cured coating of a ladder-type silsesquioxane polymer. A layer for protecting a metal wiring layer or layers may also be comprised of a cured coating of a similar polymer. The specified cured coating exhibits good resistance to heat and moisture and enhanced levelling on a pattern.
摘要翻译：一种具有多层布线结构的改进型电子器件。层间绝缘层或形成在金属布线层之间的多个层间绝缘层中的至少一个由梯型倍半硅氧烷聚合物的固化涂层构成。用于保护金属布线层或层的层也可以由类似聚合物的固化涂层组成。指定的固化涂层具有良好的耐热和耐湿性，并增强了图案的均匀性。

3. 发明授权

US4510283A Silicone-type coating resin solution 失效
标题翻译：硅胶型涂料树脂溶液
公开(公告)号：US4510283A
公开(公告)日：1985-04-09
申请号：US560170
申请日：1983-12-12
申请人： Shiro Takeda , Minoru Nakajima
发明人： Shiro Takeda , Minoru Nakajima
IPC分类号： H01L21/768 , C08G77/44 , C09D183/04 , C09D183/10 , H01L21/312 , H01L23/522 , C08K5/07
CPC分类号： C09D183/10 , C08G77/44
摘要： A silicone-type coating resin solution and a process for preparing the solution. This solution comprises 30 to 60 parts by weight of a hydrolytic condensation polymer of tetramethoxysilane or tetraethoxysilane (PDAS) having a weight average molecular weight of 1,000 to 6,000 and 70 to 40 parts by weight of a polysilsesquioxane prepolymer (PLOS) having a weight average molecular weight of 2,500 to 7,000 and in which each of 5 to 50 mole % of the organic groups attached directly to the silicon atoms is a phenyl group and the remaining organic groups are methyl, ethyl, or vinyl groups, these polymer components being dissolved in an organic solvent having a boiling point of not less than 110.degree. C. under a pressure of 760 mmHg. This solution is prepared by dissolving PDAS and PLOS in an organic solvent having a high boiling point and treating the resultant solution under a reduced pressure of not more than 5 mmHg.
摘要翻译：有机硅类涂料树脂溶液及其制备方法。该溶液包含30至60重量份的重均分子量为1,000至6,000的四甲氧基硅烷或四乙氧基硅烷（PDAS）的水解缩聚物和70至40重量份的具有重均分子量的聚倍半硅氧烷预聚物（PLOS）重量为2500〜7000，其中5〜50摩尔％直接与硅原子连接的有机基团为苯基，剩余的有机基团为甲基，乙基或乙烯基，这些聚合物成分溶于在760mmHg的压力下沸点不低于110℃的有机溶剂。该溶液通过将PDAS和PLOS溶解在具有高沸点的有机溶剂中并在不超过5mmHg的减压下处理所得溶液来制备。

4. 发明授权

US4326238A Electronic circuit packages 失效
标题翻译：电子电路封装
公开(公告)号：US4326238A
公开(公告)日：1982-04-20
申请号：US971658
申请日：1978-12-21
申请人： Shiro Takeda , Yuji Nagai , Minoru Nakajima , Kunihiko Hayashi , Koji Serizawa
发明人： Shiro Takeda , Yuji Nagai , Minoru Nakajima , Kunihiko Hayashi , Koji Serizawa
IPC分类号： H01L23/29 , H01L23/31 , H01L23/373 , H05K7/20 , C08K3/22 , H05K3/32
CPC分类号： H01L23/3737 , H01L23/295 , H01L23/3121 , H01L2924/0002 , Y10T29/4913 , Y10T29/49822
摘要： An electronic circuit comprising a circuit substrate with electronic circuit elements bonded onto the circuit substrate with gaps between the circuit substrate and the respective electronic circuit elements has thermal conductive layers comprising an oxidatively curable resin filled into the gaps. The thermal conductive layers are produced by filling a varnish comprising an oxidatively curable resin into the gaps and exhibit excellent moist heat resistance and thermal conductive properties. The electronic circuit elements once mounted on the circuit substrate can easily be removed as required by releasing the bonding between the elements and the substrate.
摘要翻译：一种电子电路，包括具有电路基板的电路基板，该电路基板具有与电路基板和各电子电路元件之间的间隙接合到电路基板上的电路基板，其具有填充到间隙中的可氧化固化树脂的导热层。通过将包含氧化可固化树脂的清漆填充到间隙中并且表现出优异的耐湿热性和导热性而制备导热层。一旦安装在电路基板上的电子电路元件就可以通过释放元件和基板之间的接合而根据需要容易地去除。

5. 发明授权

US4347306A Method of manufacturing electronic device having multilayer wiring structure 失效
标题翻译：具有多层布线结构的电子装置的制造方法
公开(公告)号：US4347306A
公开(公告)日：1982-08-31
申请号：US148722
申请日：1980-05-12
申请人： Shiro Takeda , Minoru Nakajima
发明人： Shiro Takeda , Minoru Nakajima
IPC分类号： H01L21/312 , H01L23/532 , G03C5/00
CPC分类号： H01L21/312 , H01L21/02118 , H01L21/02282 , H01L23/5329 , H01L2924/0002
摘要： Electronic devices having a multilayer wiring structure, such as a semiconductor device, a bubble memory device and a thin film magnetic head, are manufactured by using, as an insulation layer-forming material, a thermosetting addition polymerization type polyimide, i.e., a polyimide possessing imide rings in the recurring unit thereof and the degree of polymerization of which increases, when cured, due to the radical reaction of the end group or groups. The polyimide insulation layer exhibits better levelling property than that of a conventional condensational type polyimide.
摘要翻译：通过使用热固性加成聚合型聚酰亚胺，即具有聚酰亚胺的聚酰亚胺作为绝缘层形成材料，制造具有多层布线结构的电子器件，例如半导体器件，气泡存储器件和薄膜磁头酰亚胺环，其固化程度由于端基的自由基反应而增加。聚酰亚胺绝缘层比常规的聚合型聚酰亚胺具有更好的流平性能。

6. 发明授权

US08181820B2 Mechanism for opening and closing an opening portion 有权
标题翻译：用于打开和关闭开口部分的机构
公开(公告)号：US08181820B2
公开(公告)日：2012-05-22
申请号：US12597242
申请日：2009-01-14
申请人： Shiro Takeda
发明人： Shiro Takeda
IPC分类号： B65D43/16 , B65D43/26
CPC分类号： A46B5/0033 , A45D40/264 , A46B7/023 , A46B2200/1046
摘要： A mechanism for opening and closing an opening portion is disclosed. The mechanism can simply and reliably open and close the opening portion without requiring a spring but using a simple mechanism and can stably maintain the closed state of the opening portion. When the opening portion is closed by a lid, with the head end side of the opening and closing member being protruded from the opening portion, the head end of the opening and closing member makes contact with the surface of the lid which faces the inner side of the opening portion, causing the lid to rotate about one end thereof which is rotatably supported by a rotation supporting shaft. This changes the state of the opening portion from the closed state to the opened state. When the head of the opening and closing member retracts into the opening portion from the state in which the opening and closing member is protruded from the opening portion, the protrusion of the opening and closing member will be made to engage the head end of a wound section of the lid, causing the lid to rotate about the one end of thereof which is rotatably supported by the rotation supporting shaft. This changes the state of the opening portion from the opened state to the closed state.
摘要翻译：公开了一种打开和关闭开口部分的机构。该机构可以简单且可靠地打开和关闭开口部分而不需要弹簧，但是使用简单的机构并且可以稳定地保持开口部分的关闭状态。当开口部被盖关闭时，开闭部件的头端侧从开口部突出，开闭部件的头端与盖的面向内侧的表面接触的开口部分，使得盖绕其一端旋转，其由旋转支撑轴可旋转地支撑。这将开口部分的状态从关闭状态改变为打开状态。当打开和关闭构件的头部从开口部分从开口部分突出的状态缩回到开口部分中时，打开和关闭构件的突起将被接合到伤口的头端从而导致盖绕其一端旋转，由旋转支撑轴可旋转地支撑。这将开口部分的状态从打开状态改变到关闭状态。

7. 发明申请

US20050205886A1 Gallium-containing light-emitting semiconductor device and method of fabrication 审中-公开
标题翻译：含镓的发光半导体器件及其制造方法
公开(公告)号：US20050205886A1
公开(公告)日：2005-09-22
申请号：US11135236
申请日：2005-05-23
申请人： Hitoshi Murofushi , Shiro Takeda
发明人： Hitoshi Murofushi , Shiro Takeda
IPC分类号： H01L21/18 , H01L21/22 , H01L29/22 , H01L33/00 , H01L33/20 , H01L33/38 , H01L33/40
CPC分类号： H01L33/387 , H01L21/182 , H01L21/2215 , H01L33/0079 , H01L33/20 , H01L33/405
摘要： An LED comprising a light-generating semiconductor region having an active layer sandwiched between two confining layers of opposite conductivity types. A cathode is arranged centrally on one of the opposite major surfaces of the semiconductor region from which is emitted the light. An array of discrete gold regions are formed via transition metal regions on the other major surface of the semiconductor region at which is exposed one of the confining layers which is of n-type AlGaInP semiconductor material. The gold is thermally diffused into the confining layer via the transition metal regions at a temperature less than the eutectic point of gold and gallium, thereby creating an array of ohmic contact regions of alloyed or intermingled gold and gallium, which are less absorptive of light than their conventional counterparts, to a thickness of 20 to 1000 angstroms. After removing the transition metal regions and gold regions from the surface of the light-generating semiconductor region, a reflective layer of aluminum is formed so as to cover both the ohmic contact regions and the exposed surface portions of the AlGaInP confining layer. An electroconductive base-plate of doped silicon is then bonded to the reflective layer.
摘要翻译：一种LED，其包括具有夹在相反导电类型的两个限制层之间的活性层的发光半导体区域。阴极被布置在半导体区域的相对的主表面之一的中心上，从其发射光。通过在半导体区域的另一个主表面上的过渡金属区域形成离散金区域的阵列，其中露出n型AlGaInP半导体材料的约束层之一。金在低于金和镓的共晶点的温度下通过过渡金属区域热扩散到约束层中，从而产生合金或混合的金和镓的欧姆接触区域阵列，其比光吸收更少它们的常规对应物，厚度为20至1000埃。在从发光半导体区域的表面除去过渡金属区域和金色区域之后，形成铝的反射层，以覆盖AlGaInP约束层的欧姆接触区域和露出的表面部分。然后将掺杂硅的导电基板接合到反射层。

8. 发明授权

US5882557A Method of fabricating ultrasonic coupler 失效
标题翻译：制造超声波耦合器的方法
公开(公告)号：US5882557A
公开(公告)日：1999-03-16
申请号：US675841
申请日：1996-07-05
申请人： Kenichi Hayakawa , Kazuhiro Watanabe , Kiyoto Matsui , Shiro Takeda
发明人： Kenichi Hayakawa , Kazuhiro Watanabe , Kiyoto Matsui , Shiro Takeda
IPC分类号： A61B8/00 , B29C35/16 , B29C39/00 , B29C39/10 , B29C39/18 , B29C39/38 , B29C39/40 , B29C70/72 , G10K11/02
CPC分类号： B29C39/40 , B29C39/006 , B29C39/18 , B29C39/38 , B29C70/72 , G10K11/02 , B29K2029/04
摘要： A method of fabricating an ultrasonic coupler to a specified configuration such that the ultrasonic coupler is fabricated by freezing and defrosting an aqueous solution containing a polymer. A surface of the fabricated ultrasonic coupler is made to be smooth. The ultrasonic coupler is fabricated using an ultrasonic coupler fabricating die including members each made of silicone rubber which varies in compliance with the expansion and the contraction of the aqueous solution. To fabricate the ultrasonic coupler, the aqueous solution containing a polyvinyl alcohol (PVA) is poured into the die. Then, the die is subjected to the process of cooling to below the freezing point and the process of recovery to room temperature so as to progress a bridging of the PVA, thereby progressing a gelling of the aqueous solution.
摘要翻译：一种制造超声波耦合器的方法，其特征在于，通过使包含聚合物的水溶液冷冻和除霜来制造超声波耦合器。使制造的超声波耦合器的表面光滑。使用超声波耦合器制造模具制造超声波耦合器，所述超声波耦合器制造模具包括各自由硅橡胶制成的构件，其随水溶液的膨胀和收缩而变化。为了制造超声波耦合器，将含有聚乙烯醇（PVA）的水溶液倒入模具中。然后，将模头进行冷却至低于冰点的温度和回收至室温的过程，以进行PVA的桥接，从而进行水溶液的凝胶化。

9. 发明授权

US5253093A Row electrode driving circuit for a display apparatus 失效
标题翻译：用于显示装置的行电极驱动电路
公开(公告)号：US5253093A
公开(公告)日：1993-10-12
申请号：US783890
申请日：1991-10-29
申请人： Shiro Takeda , Takafumi Kawaguchi , Makoto Takeda
发明人： Shiro Takeda , Takafumi Kawaguchi , Makoto Takeda
IPC分类号： G02F1/133 , G09G3/20 , G09G3/36 , G02F1/13 , G09G1/10
CPC分类号： G09G3/3677 , G09G2310/0283
摘要： An improved row electrode driving circuit can drive a matrix type display apparatus without necessitating digital signals transmitted between partial row electrode driving circuits. Each of the partial row electrode driving circuits is allocated with a number. In each of the partial row electrode driving circuits, shift register shifts a pulse signal to sequentially output it from a plurality of outputs. At each time when a predetermined number of clock pulses have been counted, a count signal is produced. When the shift direction is set to the upper direction, a signal indicating the allocated number is produced. When the shift direction is set to the lower direction, a signal indicating a number which is obtained by subtracting the allocated number from a specified number is produced. When this number and the clock pulse count number satisfy a predetermined relationship, the pulse signal is output.

10. 发明授权

US5166670A Column electrode driving circuit for a display apparatus 失效
标题翻译：用于显示装置的柱电极驱动电路
公开(公告)号：US5166670A
公开(公告)日：1992-11-24
申请号：US634591
申请日：1990-12-27
申请人： Shiro Takeda , Takafumi Kawaguchi , Makoto Takeda
发明人： Shiro Takeda , Takafumi Kawaguchi , Makoto Takeda
IPC分类号： G09G3/20 , G09G3/36
CPC分类号： G09G3/3688 , G09G2310/0283
摘要： An improved column electrode driving circuit can drive a matrix type display apparatus without necessitating that digital signals be transmitted between partial column electrode driving circuits. Each of the partial column electrode driving circuits is allocated with a number. In each of the partial column electrode driving circuits, a shift register shifts a sample signal to sequentially output it from a plurality of outputs. At each time when a predetermined number of clock pulses have been counted, a count signal is produced. When the shift direction is set to the right direction, a signal indicating the allocated number is produced. When the shift direction is set to the left direction, a signal indicating a number, which is obtained by subtracting the allocated number from a specified number, is produced. When this number and the clock pulse count number satisfy a predetermined relationship, the sample signal is output.

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